KR930001332A - 반도체 슬라이스의 엣지를 둥글게하기 위한 장치와 방법 - Google Patents

반도체 슬라이스의 엣지를 둥글게하기 위한 장치와 방법 Download PDF

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Publication number
KR930001332A
KR930001332A KR1019920010396A KR920010396A KR930001332A KR 930001332 A KR930001332 A KR 930001332A KR 1019920010396 A KR1019920010396 A KR 1019920010396A KR 920010396 A KR920010396 A KR 920010396A KR 930001332 A KR930001332 A KR 930001332A
Authority
KR
South Korea
Prior art keywords
grinding
grinding disc
workpiece
semiconductor wafer
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019920010396A
Other languages
English (en)
Korean (ko)
Inventor
힌젠 후베르트
Original Assignee
칼 게오르그 뢰쉬
게엠엔 게오르그 뮐러 뉘른베르그 아. 게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 칼 게오르그 뢰쉬, 게엠엔 게오르그 뮐러 뉘른베르그 아. 게 filed Critical 칼 게오르그 뢰쉬
Publication of KR930001332A publication Critical patent/KR930001332A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
KR1019920010396A 1991-06-18 1992-06-16 반도체 슬라이스의 엣지를 둥글게하기 위한 장치와 방법 Withdrawn KR930001332A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4120003A DE4120003A1 (de) 1991-06-18 1991-06-18 Vorrichtung und verfahren zum kantenverrunden von halbleiterronden
DEP4120003.9 1991-06-18

Publications (1)

Publication Number Publication Date
KR930001332A true KR930001332A (ko) 1993-01-16

Family

ID=6434168

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920010396A Withdrawn KR930001332A (ko) 1991-06-18 1992-06-16 반도체 슬라이스의 엣지를 둥글게하기 위한 장치와 방법

Country Status (6)

Country Link
JP (1) JPH05177524A (enrdf_load_stackoverflow)
KR (1) KR930001332A (enrdf_load_stackoverflow)
DE (1) DE4120003A1 (enrdf_load_stackoverflow)
FR (1) FR2677912A1 (enrdf_load_stackoverflow)
GB (1) GB2256822A (enrdf_load_stackoverflow)
IT (1) IT1258972B (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100928789B1 (ko) * 2002-12-13 2009-11-25 주식회사 포스코 허스롤의 브러싱용 강판의 제조방법 및 허스롤의 브러싱방법
KR20230003242A (ko) * 2020-06-08 2023-01-05 가부시키가이샤 사무코 웨이퍼 외주부의 연마 장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4325518A1 (de) * 1993-07-29 1995-02-02 Wacker Chemitronic Verfahren zur Glättung der Kante von Halbleiterscheiben
US7018268B2 (en) 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
KR100923433B1 (ko) * 2007-08-09 2009-10-27 조봉원 다수의 돌기부재를 가진 회전식 형상가공형 광택기
CN102490099B (zh) * 2011-11-26 2015-04-01 深圳市合川科技有限公司 立式皮料磨边机的磨刀
CN109352453A (zh) * 2018-10-23 2019-02-19 湖州华豪机械有限公司 彩钢板去毛刺装置
CN112548859B (zh) * 2020-12-04 2021-11-09 西安博奥达金刚石工磨具有限公司 一种高精度双刃金刚石滚轮及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054010A (en) * 1976-01-20 1977-10-18 Headway Research, Inc. Apparatus for grinding edges of planar workpieces
JPS5454337A (en) * 1977-09-27 1979-04-28 Ragunaa Subante Yonsuson Urufu Valve
JPS5484686A (en) * 1977-12-17 1979-07-05 Hitachi Zosen Corp Dressing method of metal bond grind stone
JPS57173447A (en) * 1981-04-16 1982-10-25 Nakamuratome Seimitsu Kogyo Kk Working device for outer circumference of material difficult to be ground
DE3316321C2 (de) * 1982-05-04 1984-09-06 Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa Verfahren zum Voreinstellen des Abschaltpunktes des Arbeitsvorschubs einer Kantenschleifmaschine und Schleifmaschine zum Durchführen des Verfahrens
JPH0230465A (ja) * 1988-07-20 1990-01-31 Mento Kenkyusho:Kk 研削方法および装置
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
JPH06104297B2 (ja) * 1989-04-27 1994-12-21 信越半導体株式会社 半導体ウエーハの面取り装置
DE3928514A1 (de) * 1989-08-29 1991-03-14 Thielenhaus Maschf Verfahren zur feinschleifbearbeitung der stirnflaeche eines zylindrischen werkstueckes
US5094037A (en) * 1989-10-03 1992-03-10 Speedfam Company, Ltd. Edge polisher

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100928789B1 (ko) * 2002-12-13 2009-11-25 주식회사 포스코 허스롤의 브러싱용 강판의 제조방법 및 허스롤의 브러싱방법
KR20230003242A (ko) * 2020-06-08 2023-01-05 가부시키가이샤 사무코 웨이퍼 외주부의 연마 장치

Also Published As

Publication number Publication date
ITMI921435A1 (it) 1993-12-11
DE4120003C2 (enrdf_load_stackoverflow) 1993-07-29
FR2677912A1 (fr) 1992-12-24
ITMI921435A0 (it) 1992-06-11
JPH05177524A (ja) 1993-07-20
GB2256822A (en) 1992-12-23
IT1258972B (it) 1996-03-11
DE4120003A1 (de) 1992-12-24
GB9212891D0 (en) 1992-07-29

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19920616

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid