GB9212891D0 - Apparatus and method for rounding off the edges of semiconductor discs - Google Patents

Apparatus and method for rounding off the edges of semiconductor discs

Info

Publication number
GB9212891D0
GB9212891D0 GB929212891A GB9212891A GB9212891D0 GB 9212891 D0 GB9212891 D0 GB 9212891D0 GB 929212891 A GB929212891 A GB 929212891A GB 9212891 A GB9212891 A GB 9212891A GB 9212891 D0 GB9212891 D0 GB 9212891D0
Authority
GB
United Kingdom
Prior art keywords
rounding
edges
semiconductor discs
discs
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB929212891A
Other versions
GB2256822A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GMN GEORG MUELLER NUERNBERG AG
Original Assignee
GMN GEORG MUELLER NUERNBERG AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GMN GEORG MUELLER NUERNBERG AG filed Critical GMN GEORG MUELLER NUERNBERG AG
Publication of GB9212891D0 publication Critical patent/GB9212891D0/en
Publication of GB2256822A publication Critical patent/GB2256822A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
GB9212891A 1991-06-18 1992-06-17 Rounding off the edges of semiconductor discs Withdrawn GB2256822A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4120003A DE4120003A1 (en) 1991-06-18 1991-06-18 DEVICE AND METHOD FOR EDGE-ROUNDING SEMICONDUCTOR RODS

Publications (2)

Publication Number Publication Date
GB9212891D0 true GB9212891D0 (en) 1992-07-29
GB2256822A GB2256822A (en) 1992-12-23

Family

ID=6434168

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9212891A Withdrawn GB2256822A (en) 1991-06-18 1992-06-17 Rounding off the edges of semiconductor discs

Country Status (6)

Country Link
JP (1) JPH05177524A (en)
KR (1) KR930001332A (en)
DE (1) DE4120003A1 (en)
FR (1) FR2677912A1 (en)
GB (1) GB2256822A (en)
IT (1) IT1258972B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4325518A1 (en) * 1993-07-29 1995-02-02 Wacker Chemitronic Method for smoothing the edge of semiconductor wafers
KR100928789B1 (en) * 2002-12-13 2009-11-25 주식회사 포스코 Manufacturing method of steel plate for brushing of hearth roll and brushing method of hearth roll
KR100923433B1 (en) * 2007-08-09 2009-10-27 조봉원 Luster having protrusion members
CN102490099B (en) * 2011-11-26 2015-04-01 深圳市合川科技有限公司 Grinding knife of vertical leather edge grinding machine
CN109352453A (en) * 2018-10-23 2019-02-19 湖州华豪机械有限公司 Color steel plate burr remover
CN112548859B (en) * 2020-12-04 2021-11-09 西安博奥达金刚石工磨具有限公司 High-precision double-edge diamond roller and manufacturing method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054010A (en) * 1976-01-20 1977-10-18 Headway Research, Inc. Apparatus for grinding edges of planar workpieces
JPS5454337A (en) * 1977-09-27 1979-04-28 Ragunaa Subante Yonsuson Urufu Valve
JPS5484686A (en) * 1977-12-17 1979-07-05 Hitachi Zosen Corp Dressing method of metal bond grind stone
JPS57173447A (en) * 1981-04-16 1982-10-25 Nakamuratome Seimitsu Kogyo Kk Working device for outer circumference of material difficult to be ground
GB2123724B (en) * 1982-05-04 1986-07-09 Tokyo Shibaura Electric Co Machining the periphery of work
JPH0230465A (en) * 1988-07-20 1990-01-31 Mento Kenkyusho:Kk Grinding method and device
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
JPH06104297B2 (en) * 1989-04-27 1994-12-21 信越半導体株式会社 Chamfering equipment for semiconductor wafers
DE3928514A1 (en) * 1989-08-29 1991-03-14 Thielenhaus Maschf Grinding rounded edge on cylindrical workpiece - inclining grinding wheel axis to workpiece axis
US5094037A (en) * 1989-10-03 1992-03-10 Speedfam Company, Ltd. Edge polisher

Also Published As

Publication number Publication date
JPH05177524A (en) 1993-07-20
IT1258972B (en) 1996-03-11
DE4120003C2 (en) 1993-07-29
FR2677912A1 (en) 1992-12-24
GB2256822A (en) 1992-12-23
KR930001332A (en) 1993-01-16
DE4120003A1 (en) 1992-12-24
ITMI921435A0 (en) 1992-06-11
ITMI921435A1 (en) 1993-12-11

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)