KR920013592A - Sealing method of semiconductor chip using face down method - Google Patents

Sealing method of semiconductor chip using face down method Download PDF

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Publication number
KR920013592A
KR920013592A KR1019900020313A KR900020313A KR920013592A KR 920013592 A KR920013592 A KR 920013592A KR 1019900020313 A KR1019900020313 A KR 1019900020313A KR 900020313 A KR900020313 A KR 900020313A KR 920013592 A KR920013592 A KR 920013592A
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KR
South Korea
Prior art keywords
sealing
semiconductor chip
face down
moved
package
Prior art date
Application number
KR1019900020313A
Other languages
Korean (ko)
Other versions
KR0175295B1 (en
Inventor
김구성
권희준
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019900020313A priority Critical patent/KR0175295B1/en
Publication of KR920013592A publication Critical patent/KR920013592A/en
Application granted granted Critical
Publication of KR0175295B1 publication Critical patent/KR0175295B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음.No content.

Description

페이스다운 방식을 이용한 반도체칩의 시일링방법Sealing method of semiconductor chip using face down method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명 페이스다운 방식을 이용한 반도체칩의 시일링방법을 설명하기 위한 도면.2 is a view for explaining a sealing method of a semiconductor chip using the face down method of the present invention.

Claims (1)

히팅블록(1)의 중앙에 위치하는 진광관(VT)을 갖는 콜렛(Co)에 진공도를 높이고, 시일링 부위에 하드솔더(Au+Sn)가 도포된 팩키지리드(13)를 상기 히팅블록(1)에 접촉 또는 착탈되게 하도록 상하로 움직이며, 와이어본딩공정이 끝나서, 시일링되는 부분에 AU가 도포된, 지그에 의하여 고정된 MES FET(GaAs FET)팩키지(2)에 상기 팩키지리드(13)를 접착시켜 시일링하는 페이스다운방식을 이용한 반도체칩의 시일링방법.Increase the degree of vacuum in the collet (Co) having a light tube (VT) located in the center of the heating block (1), and a package lead 13 is coated with a hard solder (Au + Sn) on the sealing portion of the heating block ( The package lead 13 is moved to the MES FET (GaAs FET) package 2 fixed by a jig, which is moved up and down to be in contact with or detached from 1), and the wire bonding process is completed and AU is applied to the sealed portion. Sealing method of a semiconductor chip using a face down method of bonding and sealing). ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: This is to be disclosed by the original application.
KR1019900020313A 1990-12-11 1990-12-11 Sealing method of semiconductor chip using face down method KR0175295B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900020313A KR0175295B1 (en) 1990-12-11 1990-12-11 Sealing method of semiconductor chip using face down method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900020313A KR0175295B1 (en) 1990-12-11 1990-12-11 Sealing method of semiconductor chip using face down method

Publications (2)

Publication Number Publication Date
KR920013592A true KR920013592A (en) 1992-07-29
KR0175295B1 KR0175295B1 (en) 1999-04-01

Family

ID=19307326

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900020313A KR0175295B1 (en) 1990-12-11 1990-12-11 Sealing method of semiconductor chip using face down method

Country Status (1)

Country Link
KR (1) KR0175295B1 (en)

Also Published As

Publication number Publication date
KR0175295B1 (en) 1999-04-01

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