KR900017134A - Semiconductor Device Bonding Method to Tab Tape - Google Patents

Semiconductor Device Bonding Method to Tab Tape Download PDF

Info

Publication number
KR900017134A
KR900017134A KR1019900005362A KR900005362A KR900017134A KR 900017134 A KR900017134 A KR 900017134A KR 1019900005362 A KR1019900005362 A KR 1019900005362A KR 900005362 A KR900005362 A KR 900005362A KR 900017134 A KR900017134 A KR 900017134A
Authority
KR
South Korea
Prior art keywords
semiconductor device
tab tape
bonding method
device bonding
inner lead
Prior art date
Application number
KR1019900005362A
Other languages
Korean (ko)
Other versions
KR930003140B1 (en
Inventor
노부도 야마자끼
아끼히로 니시무라
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라이 가즈오, 가부시끼가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR900017134A publication Critical patent/KR900017134A/en
Application granted granted Critical
Publication of KR930003140B1 publication Critical patent/KR930003140B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음.No content.

Description

태브테이프에의 반도체소자 접합방법Semiconductor Device Bonding Method to Tab Tape

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 1실시예를 도시한 평면도.1 is a plan view showing one embodiment of the present invention.

제2(a)도,제2(b)도는 이너리이드와 초음파 진동과의 관계를 도시하는 평면설명도.2 (a) and 2 (b) are plan explanatory views showing the relationship between the inner lead and the ultrasonic vibration.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 태브테이프 2a~2d : 이너리이드1: Tab tape 2a ~ 2d: Inner lead

3 : 반도체소자 3a : 전극3: semiconductor element 3a: electrode

4 : 본딩공구 5 : 호온4: bonding tool 5: hoon

Claims (1)

태브테이프에 설치된 이너리이드를 반도체소자의 전극에 본딩공구를 사용하여 별개로 접합하는 방법에 있어서, 상기 본딩공구에 인가되는 초음파 진동의 방향을 상기 태브테이프가 이동하는 방향에 대해서 30~60°의 범위로 하여 이너리이드와 전극을 접합하는 것을 특징으로 하는 테프테이프에의 반도체소자 접합방법.In the method of bonding the inner lead provided on the tab tape separately to the electrode of the semiconductor device using a bonding tool, the direction of the ultrasonic vibration applied to the bonding tool is 30 to 60 degrees with respect to the direction in which the tab tape moves. A method of joining a semiconductor device to a tape, characterized in that the inner lead and the electrode are bonded to each other in the range. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900005362A 1989-04-17 1990-04-17 Semiconductor device bonding method on tab KR930003140B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP89-96948 1989-04-17
JP1-96948 1989-04-17
JP1096948A JP2525243B2 (en) 1989-04-17 1989-04-17 Method of joining semiconductor devices to tab tape

Publications (2)

Publication Number Publication Date
KR900017134A true KR900017134A (en) 1990-11-15
KR930003140B1 KR930003140B1 (en) 1993-04-22

Family

ID=14178524

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900005362A KR930003140B1 (en) 1989-04-17 1990-04-17 Semiconductor device bonding method on tab

Country Status (2)

Country Link
JP (1) JP2525243B2 (en)
KR (1) KR930003140B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2576426B2 (en) * 1994-10-28 1997-01-29 日本電気株式会社 Semiconductor device bonding method and bonding apparatus
JP2002158258A (en) * 2000-11-17 2002-05-31 Sony Corp Semiconductor device, and its manufacturing method

Also Published As

Publication number Publication date
JP2525243B2 (en) 1996-08-14
JPH02273953A (en) 1990-11-08
KR930003140B1 (en) 1993-04-22

Similar Documents

Publication Publication Date Title
KR900005586A (en) Semiconductor device and method of forming the same
KR890012380A (en) Electronic device package and manufacturing method
KR940003002A (en) Integrated circuit
KR920020658A (en) Chip bonding method of semiconductor device
DE69532298D1 (en) MICROELECTRONIC BOND CONNECTION WITH LADDER MOVEMENT
KR920018878A (en) Flexible Thin Film Semiconductor Package
KR960039239A (en) Semiconductor device
KR880003427A (en) Semiconductor devices and leadframes used therein
KR890011039A (en) How to connect electrodes
KR890015393A (en) Tape Bonding Method
KR900017134A (en) Semiconductor Device Bonding Method to Tab Tape
KR880008922A (en) Cylindrical film package, its manufacturing method and manufacturing apparatus
KR920015521A (en) Semiconductor device and manufacturing method thereof
KR900017719A (en) Wire bonding method
KR960039241A (en) Semiconductor device manufacturing method
KR880001046A (en) Electrical connection method inside the semiconductor component
KR920007131A (en) Semiconductor devices
KR960043146A (en) How to Implement an Integrated Circuit Device with Bonding Pad Option and Bonding Pad Option
KR870009453A (en) Resin Sealed Semiconductor Device
KR910010686A (en) Resin Sealed Semiconductor Device
KR910003775A (en) Solder coating method of semiconductor device
KR960015882A (en) Semiconductor devices
KR920010862A (en) Semiconductor devices and leadframes used therein
KR900004040A (en) Semiconductor integrated circuit devices
KR920010803A (en) Wire Bonding Semiconductor Device

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19990408

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee