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Priority to KR1019900016196ApriorityCriticalpatent/KR920008856A/en
Publication of KR920008856ApublicationCriticalpatent/KR920008856A/en
반도체 웨이퍼의 표면 세정방법Surface cleaning method of semiconductor wafer
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 본 발명의 세정방법에 사용되는 세정장치의 개략구성도.1 is a schematic configuration diagram of a cleaning apparatus used in the cleaning method of the present invention.
Claims (1)
웨이퍼가 담겨진 배쓰에 순수를 일정한 유속으로 공급하여 순수가 오버플로우 됨에 따라 웨이퍼 표면이 세정되게 함을 특징으로 하는 반도체 웨이퍼의 표면 세정방법.A method of cleaning a surface of a semiconductor wafer, comprising supplying pure water to a bath containing a wafer at a constant flow rate to clean the surface of the wafer as the pure water overflows.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900016196A1990-10-121990-10-12
Surface cleaning method of semiconductor wafer
KR920008856A
(en)