KR920006435B1 - Solid state image element - Google Patents

Solid state image element Download PDF

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KR920006435B1
KR920006435B1 KR1019880018171A KR880018171A KR920006435B1 KR 920006435 B1 KR920006435 B1 KR 920006435B1 KR 1019880018171 A KR1019880018171 A KR 1019880018171A KR 880018171 A KR880018171 A KR 880018171A KR 920006435 B1 KR920006435 B1 KR 920006435B1
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size
photodiode
light
solid
region
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KR1019880018171A
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KR900011051A (en
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이정형
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삼성전자 주식회사
김광호
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation

Abstract

The region of photo diodes is varied inversely proportional to input high level to reduce the blooming and the phenomenon. The light receiving region is devided into three parts: a center region (a), an intermediate region (b) and an outer region (c). The size of photo diode in the center region is less than the size of a conventional photo diode, the size of photo diode in the intermediate region (B) is the same as the size of a conventional photo diode, and the size of photo diode in the outer region is less than the size of a conventional photo diode.

Description

고체 촬영소자Solid state imaging element

제1도는 선행기술에 따라 제작된 고체 촬영소자의 칩(chip) 구성을 개략적으로 보인 평면도.1 is a plan view schematically showing a chip configuration of a solid state imaging device manufactured according to the prior art.

제2도는 제1도에 도시된 고체 촬상소자의 구조를 도시한 도면.2 is a diagram showing the structure of the solid-state image sensor shown in FIG.

제3도는 본 발명에서 제안되는 고체 촬영소의 구성의 개략도.3 is a schematic view of the configuration of the solid state photo shoot proposed in the present invention.

제4도는 본 발명에 다른 고체 촬영소자의 단위 화소 구성을 보인 평면도.4 is a plan view showing a unit pixel configuration of a solid state image pickup device according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 단위 화소부 2 : 수직 전송부1: unit pixel portion 2: vertical transfer portion

3 : 수평 전송부 4 : 출력부3 horizontal transmission unit 4 output unit

5 : 오브플로우 드레인5: Overflow Drain

본 발명은 포토다이오드의 광축적 효과를 이용하는 전하 결합 디바이스(Charge Coupled Device ; CCD)형 고체 촬영소자에 관한 것으로서, 보다 상세하게는 단위화소(Pixel)의 포토다이오드 크기를 각각 다르게설정하여 수광능력이나 감도 특성을 향상시킴과 동시에 블루밍(Blooming) 현상을 제거하는 고체 촬영소자에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a charge coupled device (CCD) type solid-state imaging device that utilizes the optical accumulation effect of a photodiode. More particularly, the photodiode size of a unit pixel is set differently so that the light receiving capability or The present invention relates to a solid state image pickup device that improves sensitivity characteristics and simultaneously eliminates blooming.

블루밍 현상이란 일부의 화소에 강한 빛이 입사되어 그곳에서 발생한 신호 전하량이 포트다이오드의 전하수용 능력 이상으로 되면 과잉전하가 주변의 포토다이오드로 흘러들어가 주위의 화소에는 빛이 들어오지 않음에도 불구하고 전하가 괴어 상기 화소가 선택될때 불필요한 위신호(僞信號)가 출력되어 브라운관 상에 재현되므로 강한 빛이 입사한 부분을 중심으로 하여 그 주위에 희고 밝게 보이는 것을 말한다.Blooming phenomenon is that when strong light is incident on some pixels and the amount of signal charge generated there is more than the capacity of the port diode, the excess charge flows to the surrounding photodiode, but the charge does not enter the surrounding pixels. When the pixel is selected, an unnecessary false signal is output and reproduced on the CRT, which means that white light appears brightly around the part where strong light is incident.

일반적으로 피사체에 해당되는 입사광량을 전기적인 신호로 변환하는 CCD형 고체 촬영 소자는 작고 가벼우면서도 뛰어난 이미지(image)전송 특성 때문에 많은 연구가 진행되고 있고, 이미 많은 상품 모델(Model)이 개발되어 사용되고 있는 실정이다. 그런데, 선행기술에 따라 제작된 고체 촬영소자의 특성중 수광 능력의 부족이나 감고가 낮은 원인은, 고체 촬영소자의 특성중 불가피한 블루밍 현상을 억제하기 위한수단으로 과도하게 공급된 광신호를 어느 높이 이상에 이르면 강제로 밖으로 배출시키기 때문이다. 따라서고체촬영소자의 구조는 제2도에 도시된 바와 같이 오브플로우 드레인(5)을 수직 전송부(2)전에 만들어 블루밍 현상은 어느 정도 억제 가능하게 되었다.Generally, CCD type solid-state imaging devices that convert the incident light amount corresponding to a subject into an electrical signal have been researched due to their small, light, and excellent image transmission characteristics, and many product models have already been developed and used. There is a situation. However, the cause of the lack of light receiving ability or low winding of the characteristics of the solid state imaging device manufactured according to the prior art is a means for suppressing the unavoidable blooming phenomenon among the characteristics of the solid state imaging device more than a certain height. Because it is forced to discharge out. Therefore, the structure of the solid state imaging device makes the orflow drain 5 before the vertical transfer section 2, as shown in FIG. 2, to suppress the blooming phenomenon to some extent.

그러나 고체 촬영소자의 수광능력은 포토다이오드의 크기에 비례하며, 소자의 설계 및 특성 평가시 중요한 값이 개구율(開口率)의 퍼센트 값으로 주어지는데, 예컨대 고체 촬영소자에서 블루밍 현상이 없다면 오브플로우 드레인이나 오브플로우 드레인용 게이트가 필요없는 구조이므로 그만큼 포트다이오드가 차지하는면적비는 커지게 된다.However, the light-receiving ability of the solid-state image pickup device is proportional to the size of the photodiode, and an important value in designing and characterizing the device is given as a percentage of the aperture ratio. The area ratio occupied by the port diode becomes larger since the structure does not require the gate for the ordrain drain.

고체 촬영소자에 광(光)이 입사될때는 카메라의 렌즈부를 거치면서 점광되기 때문에 소자 중심부의 화소(Pixel)가 감지하는 빛의 세기는 주변보다 강하므로 블루밍 현상을 억제하기 위한 수단으로써 소자의 각포토다이오드 크기를 제1도에 도시된 바와 같이 중심부의 포토다이오드 크기로 설계하는바, 전화소의 포토다이오드(수광소자)의 개구율(開口率)은 제한 받게 된다.When light is incident on the solid-state image pickup device, the light is detected through the lens of the camera, so the intensity of light detected by the pixel in the center of the device is stronger than the surroundings. As shown in FIG. 1, the size of the photodiode is designed to be the size of the photodiode in the center, and the aperture ratio of the photodiode (light-receiving element) of the telephone station is limited.

이와 같이 전화소의 포토다이오드 크기가 같은 고체 촬영소자는 어느 정도의 광신호 레벨 이상이 되면 블루밍 현상을 발생시키거나 오브플로우 드레인(7)으로 배출하는 바, 강한 빛을 100% 이용하지 못하게 되어전체적으로 볼때 저 레벨의 빛만이 이용 가능하게 된다. 또 개구율의 저하로 조명이 낮으면 특수 조명시설을 요하게 되며, 감도(感度)가 낮다는 문제점이 있었다.As such, the solid-state image pickup device having the same size as the photodiode of a telephone station generates a blooming phenomenon or is discharged to an overflow drain (7) when the optical signal level is above a certain level. Only the light of the level becomes available. In addition, when the illumination is low due to the decrease in the aperture ratio, a special lighting facility is required, and there is a problem that the sensitivity is low.

따라서 본 발명은 상기와 같은 제반 결점을 해소하고자 창안한 것으로서, 단위 화소부의 크기를 변화시켜광 감지능력을 향상 시킴과 동시에 블루밍 현상과 스미어(smer) 현상을 억제시키는 고체 촬상소자를 제공하는데 그 목적을 두고 있다.Accordingly, an object of the present invention is to provide a solid-state image pickup device which improves light sensing ability by changing the size of a unit pixel unit while suppressing blooming and smear phenomenon. Leave.

상기한 목적을 달성하기 위하여 본 발명에 따른 고체 촬영소자는 카메라의 렌즈부를 거치면서 수공부에집광되는 빛의 레벨에 반비례하게 소자의 화소부인 포토다이오드의 크기를 결정함을 특징으로 한다.In order to achieve the above object, the solid-state imaging device according to the present invention is characterized in that the size of the photodiode as the pixel portion of the device inversely proportional to the level of light focused on the hand while passing through the lens portion of the camera.

이하, 도면을 통하여 본 발명을 더욱 구체화하하여 기술 하기로 한다.Hereinafter, the present invention will be described in more detail with reference to the drawings.

본 발명에서 제안되는 고체 찰영소자의 구성은 제3도에 도시한 바와 같이 수직으로 배열된 수직 전송부(2) 사이에 설치된 단위 화소부(1)의 포토다이오드 크기를 수광부에 집광되는 빛의 레벨에 반비례하게 설정한 것으로서, 동 도면에서 카메라의 렌즈부를 거치면서 집광되는 중심부(a)에 있는 화소의 포토다이오드크기는 기존 포토다이오드보다 작게 하고, 중심부(a)의 주변부(b)에 있는 포토다이오드 크기는 기존 포토다이오드와 비슷하게 하며, 외각부(C)에 있는 포토다이오드 크기는 기존 포토다이오드 보다 크게 하여 된다.In the configuration of the solid state element proposed in the present invention, as shown in FIG. 3, the level of light focused on the photodiode of the unit pixel unit 1 provided between the vertical transfer units 2 arranged vertically is the light receiving unit. The photodiode size of the pixel in the center portion (a) that is condensed while passing through the lens portion of the camera in the drawing is smaller than that of the existing photodiode, and the photodiode in the peripheral portion (b) of the center portion (a). The size of the photodiode is similar to that of the conventional photodiode, and the size of the photodiode in the outer portion C is larger than that of the conventional photodiode.

즉, 본 발명에 따른 고체 찰영소자의 단위 화소 구멍은 제4도에 도시한 바와 같이 수평방향의 포토다이오드(PD) 크기는 변화없이 수직방향의 폭을 집광되는 빛의 레벨(광량)에 따라 변화시키고, 이에 따라 전극(poly)의 폭과 채널 스톱부(CS)의 폭 크기를 나누어 설계한다.That is, as shown in FIG. 4, the unit pixel hole of the solid state imaging element according to the present invention is changed according to the level (light quantity) of light condensed in the vertical direction without changing the size of the photodiode PD in the horizontal direction. Accordingly, the width of the electrode poly and the width of the channel stop CS are divided.

상기한 바와 같이 집광되는 빛의 레벨에 따라서 화소인 포토다이오드의 크기를 설정하는 고체 촬영소자는중심부(a)에 있는 포토다이오드(중심에서 약 15%정도)는 기존 소자에 있는 포토다이오드 보다 작게 만들어 입사되는 광신호량을 적게하여 상대적으로 주변의 다른 화소(pixel)에서 받아들이는 광신호량과의 차이가 오브플로우 드레인 구조보다 작게 만들어 광 세기를 비교적 균일하게하므로 화면 중앙부가 주변보다 밝게 되는 현상을 제거할 수 있고, 그리고 비교적 강한 입사광 하에서도 광량이 작으므로 블루밍(blooming)현상을 제거할 수 있다.As described above, the solid-state imaging device that sets the size of the photodiode as a pixel according to the level of light collected is made by making the photodiode (about 15% in the center) smaller in the center part (a) than the photodiode in the existing device. By reducing the amount of light signal that is relatively small, the difference between the amount of light signal received by other pixels around it is smaller than the obflow drain structure, so that the light intensity is made relatively uniform. In addition, since the amount of light is small even under relatively strong incident light, blooming may be eliminated.

상술한 본 발명의 고체 촬영 소자는 수광부에 접광되는 빛의 레벨에 따라 반비례하게 포토다이오드 크기를 설정하여 구성하기 때문에 포토다이오드에서 광세기를 비교적 균일하게 형성하므로 선명한 화면을 얻을수 있으며, 블루밍 현상을 제거하는 장점이 있다.Since the solid-state imaging device of the present invention is configured by setting the size of the photodiode in inverse proportion to the level of light incident on the light-receiving portion, the light intensity is formed relatively uniformly in the photodiode, so that a clear screen can be obtained and the blooming phenomenon is eliminated. There is an advantage.

Claims (1)

서로 상이한 크기의 포토다이오드로 구성된 수광부를 포함하는 고체촬상소자에 있어서, 상기 수광부는중심부(a), 주변부(b) 및 외각부(c)로 구성되어 있고 렌즈부를 통한 빛의 광량에 반비례하도록 중심부(a)의 포토다이오드의 크기는 종래의 포토다이오드 크기보다 작고, 중심부의 주변부(b)의 포토다이오드의 크기는 종래의 포토다이오드 크기와 동일하면, 외각부(c)의 포토다이오드의 크기는 종래의 포토다이오드 크기보다 크게함을 특징으로 하는 고체촬영소자.In a solid-state image pickup device comprising a light receiving unit composed of photodiodes of different sizes, the light receiving unit is composed of a central portion (a), a peripheral portion (b) and an outer portion (c), and the center portion is inversely proportional to the amount of light through the lens portion. If the size of the photodiode of (a) is smaller than that of the conventional photodiode, and the size of the photodiode of the peripheral portion (b) of the center portion is the same as that of the conventional photodiode, the size of the photodiode of the outer portion (c) is conventionally A solid-state imaging device, characterized in that larger than the size of the photodiode.
KR1019880018171A 1988-12-31 1988-12-31 Solid state image element KR920006435B1 (en)

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