KR920003497A - 집적 회로의 부식 및 정전기 방전 보호 방법 - Google Patents

집적 회로의 부식 및 정전기 방전 보호 방법 Download PDF

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Publication number
KR920003497A
KR920003497A KR1019910012468A KR910012468A KR920003497A KR 920003497 A KR920003497 A KR 920003497A KR 1019910012468 A KR1019910012468 A KR 1019910012468A KR 910012468 A KR910012468 A KR 910012468A KR 920003497 A KR920003497 A KR 920003497A
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South Korea
Prior art keywords
electrostatic discharge
integrated circuits
fine particles
protect against
metal
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KR1019910012468A
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English (en)
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KR100226334B1 (ko
Inventor
필립 프래니 죤
엘던 그래들 토마스
Original Assignee
비. 에스. 슈나이더
아메리칸 텔리폰 앤드 텔레그라프 캄파니
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Application filed by 비. 에스. 슈나이더, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 비. 에스. 슈나이더
Publication of KR920003497A publication Critical patent/KR920003497A/ko
Application granted granted Critical
Publication of KR100226334B1 publication Critical patent/KR100226334B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F15/00—Other methods of preventing corrosion or incrustation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Dicing (AREA)
  • Elimination Of Static Electricity (AREA)
  • Adhesive Tapes (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

집적 회로의 부식 및 정전기 방전 보호 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 구리 및 카아본 블랙의 결합비와 표면 비저항과의 관계를 도시하는 그래프,
제2도는 필름 두께와 표면 비저항과의 관계를 도시하는 그래프.

Claims (8)

  1. 장치 또는 이것으로부터의 정전기 방전을 제한하는 보호수단에 대해 장치를 위치 설정시키는 공정으로 구성되어 정전기 방전으로부터의 장치를 보호하는 방법에 있어서, 상기 보호 수단은 미립자가 함유된 폴리머 필름을 포함하는데, 상기 미립자는 카아본 블록으로 구성된 미립자와 카아본 블랙과 결합된 금속 물질로 구성된 미립자를 포함하는 것을 특징으로 하는 정전기 방전으로부터의 장치의 보호 방법.
  2. 제1항에 있어서, 상기 금속은 폴리머와 결합되는 것을 특징으로 하는 장치의 보호 방법.
  3. 제1항에 있어서, 상기 장치는 집적 회로로 구성되는 것을 특징으로 하는 장치의 보호 방법.
  4. 제1항에 있어서, 상기 방법은 또한 장치의 부식을 방지하는 것을 특징으로 하는 장치의 보호방법.
  5. 제4항에 있어서, 상기 금속은 철과 구리로 구성된 그룹으로부터 결정되는 것을 특징으로 하는 장치의 보호방법.
  6. 제1항에 있어서, 상기 금속은, 철, 코발트, 망간 및 구리로 구성된 그룹으로부터 결정되는 것을 특징으로 하는 장치의 보호 방법.
  7. 제6항에 있어서, 상기 폴리머는 폴리에틸렌으로 구성되는 것을 특징으로 하는 장치의 보호 방법.
  8. 제1항에 있어서, 상기 보호수단은 1X106내지 1X1012오옴/스궤어의 비저항을 구비하는 것을 특징으로 하는 장치의 보호 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910012468A 1990-07-27 1991-07-20 집적회로의 부식 및 정전기 방전 보호방법 KR100226334B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US558,990 1990-07-27
US07/558,990 US5154886A (en) 1987-10-08 1990-07-27 Protection of devices

Publications (2)

Publication Number Publication Date
KR920003497A true KR920003497A (ko) 1992-02-29
KR100226334B1 KR100226334B1 (ko) 1999-10-15

Family

ID=24231835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910012468A KR100226334B1 (ko) 1990-07-27 1991-07-20 집적회로의 부식 및 정전기 방전 보호방법

Country Status (6)

Country Link
US (1) US5154886A (ko)
EP (1) EP0468710B1 (ko)
JP (1) JPH04239482A (ko)
KR (1) KR100226334B1 (ko)
CA (1) CA2045787C (ko)
DE (1) DE69132183T2 (ko)

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US7261839B2 (en) * 2002-01-22 2007-08-28 Northern Technologies International Corp. Tarnish inhibiting composition and article containing it
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US10570296B2 (en) 2012-03-19 2020-02-25 Tesla Nanocoatings, Inc. Self-healing polymer compositions
US9222174B2 (en) 2013-07-03 2015-12-29 Nanohibitor Technology Inc. Corrosion inhibitor comprising cellulose nanocrystals and cellulose nanocrystals in combination with a corrosion inhibitor
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Also Published As

Publication number Publication date
DE69132183T2 (de) 2001-06-07
DE69132183D1 (de) 2000-06-15
EP0468710A1 (en) 1992-01-29
CA2045787A1 (en) 1992-01-28
EP0468710B1 (en) 2000-05-10
US5154886A (en) 1992-10-13
JPH04239482A (ja) 1992-08-27
CA2045787C (en) 1996-07-16
KR100226334B1 (ko) 1999-10-15

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