KR910017355A - 전자 발음장치 - Google Patents
전자 발음장치 Download PDFInfo
- Publication number
- KR910017355A KR910017355A KR1019910002989A KR910002989A KR910017355A KR 910017355 A KR910017355 A KR 910017355A KR 1019910002989 A KR1019910002989 A KR 1019910002989A KR 910002989 A KR910002989 A KR 910002989A KR 910017355 A KR910017355 A KR 910017355A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit pattern
- circuit
- conductive metal
- metal plate
- circuit element
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K15/00—Acoustics not otherwise provided for
- G10K15/04—Sound-producing devices
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
- G10K9/12—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
- Y10T29/4916—Simultaneous circuit manufacturing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Push-Button Switches (AREA)
- Electric Clocks (AREA)
- Telephone Set Structure (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제1실시예를 도시한 전자발음장치의 평면도, 제2도는 제1도의 발음체의 단면도, 제6도는 제2실시예를 도시한 전자발음장치의 평면도.
Claims (7)
- 멜로디등의 신호를 발하는 회로소자(4,102,204,302), 전지(5,103,205) 스위치(6,104,206)가 부착된 도전성 금속판으로되는 회로패턴(2,105,202,303)과 진동판(16,109,216)을 가진 박판형 발음체(3,107,203)를 구비한 전자발음장치.
- 청구범위 제1항에 있어서, 도전성 금속판의 회로패턴(2)과 전지홀더부(13)를 일체적으로 형성한 것을 특징으로 하는 전자발음장치.
- 청구범위 제1항에 있어서, 도전성 금속판의 회로패턴(105)과 스위치접속편(141,142)을 일체적으로 형성한 것을 특징으로 하는 전자발음장치.
- 청구범위 제1항에 있어서, 도전성 금속판의 회로패턴(202)에 박판형 발음체(203)의 커버(226)가 일체로 형성된 보강판(217)을 부착한 것을 특징으로 하는 전자발음장치.
- 청구범위 제1항에 있어서, 박판형 발음체(3)의 진동판(16)에 요부(21)가 형성되어 있는것을 특징으로 하는 전자발음장치.
- 청구범위 제1항에 있어서, 회로소자(302), 도전성 금속판의 회로패턴(303)과 상기 회로소자(302)와 회로패턴(303)을 결합하는 도전와이어(307)와, 상기 회로소자(302)와 도전와이어(307)를 씌우는 수지(308)와 회로소자(302)의 바로밑에서 회로패턴(303)이면 측에 배치된 내열시이트(305)를 가지고 상기 수지(308)로 회로소자(302)를 밀봉한 구성의 회로소자(302)의 회로패턴(301)을 구비한 것을 특징으로 하는 전자발음장치.
- 청구범위 제1항에 있어서, 도전성 금속판의 회로패턴(2,105)과 박판상 발음체(3,107)의 진동판(16,109)을 일체적으로 형성한 것을 특징으로 하는 전자발음 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2-51685 | 1990-03-05 | ||
JP2-21471 | 1990-03-05 | ||
JP5168590A JPH03254135A (ja) | 1990-03-05 | 1990-03-05 | 半導体素子付リードフレームの構造 |
JP1990021471U JPH087643Y2 (ja) | 1990-03-05 | 1990-03-05 | 回路パターンの構造 |
JP2058528A JPH077272B2 (ja) | 1990-03-09 | 1990-03-09 | 電子発音装置 |
JP2-58528 | 1990-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910017355A true KR910017355A (ko) | 1991-11-05 |
KR0165544B1 KR0165544B1 (ko) | 1999-03-20 |
Family
ID=27283439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910002989A KR0165544B1 (ko) | 1990-03-05 | 1991-02-25 | 전자발음장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5264656A (ko) |
KR (1) | KR0165544B1 (ko) |
DE (1) | DE4106824A1 (ko) |
FR (1) | FR2659164B1 (ko) |
GB (1) | GB2243479B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100665431B1 (ko) * | 2003-09-30 | 2007-01-04 | 세이코 엡슨 가부시키가이샤 | 전기광학 장치 및 전자기기 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2289365A (en) * | 1994-05-07 | 1995-11-15 | Pyronix Ltd | A sounder having a protective casing |
US5498833A (en) * | 1995-07-12 | 1996-03-12 | Kyooh Precision Industry Co., Ltd. | Electric music box powered by wind-up |
US5567892A (en) * | 1995-09-05 | 1996-10-22 | Kyooh Precision Industry Co., Ltd. | Motor driving electronic music box |
JPH11283593A (ja) * | 1998-03-27 | 1999-10-15 | Mitsumi Electric Co Ltd | 電池パック |
US6097281A (en) * | 1998-05-11 | 2000-08-01 | Korean Co., Ltd. | Sound producing device |
US7251957B2 (en) * | 2004-12-03 | 2007-08-07 | Solomon Gary B | Musical jewelry apparatus |
DE102005016511B4 (de) * | 2005-04-11 | 2008-09-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat |
JP4548199B2 (ja) * | 2005-04-22 | 2010-09-22 | 株式会社デンソー | 電子回路装置の製造方法 |
US20070067347A1 (en) * | 2005-07-01 | 2007-03-22 | Palbicki William W | Method and apparatus for previewing recorded audio media |
WO2009009974A1 (fr) * | 2007-07-19 | 2009-01-22 | Hongwei Zhao | Trompette électronique avec une connexion électrique analogique et son procédé de fabrication |
US8088988B2 (en) * | 2009-04-22 | 2012-01-03 | Randazzo Teddy C | Triangular mode guitar pickup |
GB2505641A (en) * | 2012-08-29 | 2014-03-12 | Anna Marie Anderson | Proximity monitoring system for children or elderly people |
KR101929465B1 (ko) | 2016-10-18 | 2019-03-14 | 주식회사 옵텔라 | 광학모듈 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1934238B2 (de) * | 1969-07-05 | 1972-03-02 | Dr Bernhard Beyschlag Apparatebau GmbH, 2280 Westerland | Netzwerk mit elektrischen bauteilen und verfahren zu seiner herstellung |
FR2076686A5 (ko) * | 1970-01-23 | 1971-10-15 | Sovcor Electronique | |
DE2305883A1 (de) * | 1973-02-07 | 1974-08-15 | Finsterhoelzl Rafi Elekt | Leiterplatte |
FR2315818A1 (fr) * | 1975-06-27 | 1977-01-21 | Ribatto Jean Jacques | Procede de fabrication de haut-parleurs et haut-parleurs realises a l'aide de ce procede |
US4202091A (en) * | 1976-03-04 | 1980-05-13 | Matsushita Electric Industrial Co. Ltd. | Method of manufacturing a hybrid framework consisting of metallic plate and projection made of synthetic resin |
FR2361007A1 (fr) * | 1976-08-06 | 1978-03-03 | Sev Marchal | Procede de fabrication d'un circuit electrique notamment pour un pont redresseur d'alternateur de vehicule automobile |
CA1087004A (en) * | 1976-08-11 | 1980-10-07 | Michael J. Hampshire | Sound generator |
DE7640015U1 (de) * | 1976-12-21 | 1977-11-24 | S. Siedle & Soehne, Telefon- U. Telegrafenwerke Gmbh, 7743 Furtwangen | Leiterplatte |
GB2002619B (en) * | 1977-07-13 | 1982-03-17 | Victor Company Of Japan | Moving-coil type stereo pickup cartridge |
JPS5655752Y2 (ko) * | 1977-09-05 | 1981-12-25 | ||
JPS55141896A (en) * | 1979-04-24 | 1980-11-06 | Mitsubishi Electric Corp | Assembling method of speaker |
US4403107A (en) * | 1980-12-15 | 1983-09-06 | Amp Incorporated | Stamped circuit board |
US4400861A (en) * | 1981-11-27 | 1983-08-30 | Oyo Instruments, Inc. | Fabrication of seismic springs from sheets |
US4434567A (en) * | 1982-04-19 | 1984-03-06 | Hallmark Cards, Inc. | Memorabilia repository |
JPS58219661A (ja) * | 1982-06-15 | 1983-12-21 | Sharp Corp | カ−ド電卓 |
JPS59152535A (ja) * | 1983-02-21 | 1984-08-31 | Toshiba Corp | 自動焦点調節装置 |
US4477249A (en) * | 1983-04-29 | 1984-10-16 | Zdenka Ruzek | Flame-producing sound-emitting device |
US4524247A (en) * | 1983-07-07 | 1985-06-18 | At&T Bell Laboratories | Integrated electroacoustic transducer with built-in bias |
US4554613A (en) * | 1983-10-31 | 1985-11-19 | Kaufman Lance R | Multiple substrate circuit package |
DE8428488U1 (de) * | 1984-09-27 | 1986-01-23 | Siemens AG, 1000 Berlin und 8000 München | Kleinhörgerät |
DE3518897A1 (de) * | 1985-05-25 | 1986-11-27 | Diehl GmbH & Co, 8500 Nürnberg | Elektrischer schallgeber |
US4870688A (en) * | 1986-05-27 | 1989-09-26 | Barry Voroba | Mass production auditory canal hearing aid |
DE8708894U1 (de) * | 1987-06-26 | 1988-10-27 | Siemens AG, 1000 Berlin und 8000 München | Hörgerät mit einer Leiterfolie |
FR2621774B1 (fr) * | 1987-10-12 | 1990-02-16 | Dav | Plaque circuit pour courants eleves et procede de preparation |
DE3908050A1 (de) * | 1989-03-13 | 1990-09-27 | Diehl Gmbh & Co | Elektronischer akustischer signalgeber |
-
1991
- 1991-02-25 KR KR1019910002989A patent/KR0165544B1/ko not_active IP Right Cessation
- 1991-02-28 US US07/662,522 patent/US5264656A/en not_active Expired - Fee Related
- 1991-03-01 GB GB9104356A patent/GB2243479B/en not_active Expired - Fee Related
- 1991-03-04 DE DE4106824A patent/DE4106824A1/de not_active Withdrawn
- 1991-03-05 FR FR9102621A patent/FR2659164B1/fr not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100665431B1 (ko) * | 2003-09-30 | 2007-01-04 | 세이코 엡슨 가부시키가이샤 | 전기광학 장치 및 전자기기 |
Also Published As
Publication number | Publication date |
---|---|
FR2659164B1 (ko) | 1997-03-14 |
GB9104356D0 (en) | 1991-04-17 |
KR0165544B1 (ko) | 1999-03-20 |
US5264656A (en) | 1993-11-23 |
GB2243479A (en) | 1991-10-30 |
GB2243479B (en) | 1994-09-14 |
DE4106824A1 (de) | 1991-09-12 |
FR2659164A1 (ko) | 1991-09-06 |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20030915 Year of fee payment: 6 |
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LAPS | Lapse due to unpaid annual fee |