KR910015208A - 부품 설치 회로 기판 - Google Patents

부품 설치 회로 기판 Download PDF

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Publication number
KR910015208A
KR910015208A KR1019910000927A KR910000927A KR910015208A KR 910015208 A KR910015208 A KR 910015208A KR 1019910000927 A KR1019910000927 A KR 1019910000927A KR 910000927 A KR910000927 A KR 910000927A KR 910015208 A KR910015208 A KR 910015208A
Authority
KR
South Korea
Prior art keywords
component mounting
component
flexible member
circuit board
layers
Prior art date
Application number
KR1019910000927A
Other languages
English (en)
Inventor
마사또 다나까
Original Assignee
오오가 노리오
소니 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP409790U external-priority patent/JPH0396095U/ja
Priority claimed from JP409690U external-priority patent/JPH0396062U/ja
Application filed by 오오가 노리오, 소니 가부시끼가이샤 filed Critical 오오가 노리오
Publication of KR910015208A publication Critical patent/KR910015208A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

내용 없음

Description

부품 설치 회로 기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명에 따라 구성된 부품 설치회로이 제1실시예를 도시하는 전개 측면도, 제7도는 제6도의 부품 설치 회로판의 설치된 절첩상태의 측면도, 제8A도 및 제8B도는 본 발명에 따라 구성된 외피 유니트의 제1실시예를 도시하는 평면도 및 개략적 사시도.

Claims (6)

  1. 가요성 부재의 주어진 방향을 따라 교대로 배열된 다수의 부품 설치부와 다수의 절첩부를 갖는 가용성 부재와, 부품 설치부에서 가요성 부재의 적어도 일측부 상에 설치된 전자부품을 포함하며, 상기 가요성 부재는 다수층의 부품 설치부의 적어도 하나의 다른 부분상에 부품 설치부의 하나를 겹쳐놓도록 절첩부에서 절첩된 것을 특징으로 하는 부품 설치 회로기판.
  2. 제1항에 있어서, 가요성 부재는 전자부품의 적어도 4개의 층을 형성하도록 적어도 3개의 절첩부를 포함하는 것을 특징으로 하는 부품 설치 회로기판.
  3. 제1항에 있어서, 부품 설치부에서 가요성 부재의 다른 측부 상에 장착된 예정된 전자 부품을 부가로 포함하는 것을 특징으로 하는 부품 설치 회로기판.
  4. 제3항에 있어서, 가요성 부재는 전자부품의 적어도 8개층을 형성하도록 적어도 3개의 절첩부를 포함하는 것을 특징으로 하는 부품 설치 회로기판.
  5. 하나 이상의 부품 설치부와, 부품 설치부로부터 연장하는 다수의 연장부를 갖는 가요성 부재와, 부품 설치부에서 가요성 부재의 적어도 일측부 상에 설치된 예정된 전자부품과, 상기 연장부 상에 연장된 보호 패턴을 포함하며, 상기 연장부는 전자부품을 보호하도록 절첩된 것을 특징으로 하는 부품 설치 회로기판.
  6. 제5항에 있어서, 전자부품은 상부, 측부와 하부를 갖고 상기 연장부는 적어도 상부 및 측부를 둘러싸는 것을 특징으로 하는 부품 설치 회로기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910000927A 1990-01-21 1991-01-21 부품 설치 회로 기판 KR910015208A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP4096 1990-01-21
JP4097 1990-01-21
JP409790U JPH0396095U (ko) 1990-01-21 1990-01-21
JP409690U JPH0396062U (ko) 1990-01-21 1990-01-21

Publications (1)

Publication Number Publication Date
KR910015208A true KR910015208A (ko) 1991-08-31

Family

ID=26337816

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000927A KR910015208A (ko) 1990-01-21 1991-01-21 부품 설치 회로 기판

Country Status (3)

Country Link
EP (1) EP0443717A3 (ko)
KR (1) KR910015208A (ko)
AU (1) AU6943191A (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513967A (ja) * 1991-07-03 1993-01-22 Mitsubishi Electric Corp 半導体記憶制御装置及びその高密度実装方法
EP0588077B1 (en) * 1992-09-17 2001-11-14 Kabushiki Kaisha Toshiba Compact electronic apparatus and method of assembling the same
DE19821857A1 (de) * 1998-05-15 1999-11-18 Biotronik Mess & Therapieg Hochintegrierte elektronische Schaltung, insbesondere zum Einsatz in Herzschrittmachern
EP1933610A4 (en) * 2005-08-30 2009-05-06 Panasonic Corp PLATE STRUCTURE AND ELECTRONIC DEVICE
US7652628B2 (en) 2008-03-13 2010-01-26 Sony Ericsson Mobile Communications Ab Antenna for use in earphone and earphone with integrated antenna
CN101795532A (zh) * 2010-03-31 2010-08-04 华为终端有限公司 单层软性线路板及其实现方法
WO2015187669A1 (en) 2014-06-02 2015-12-10 Twinleaf Llc Circuit board integrated atomic magnetometer and gyroscope
JP6496011B2 (ja) 2015-03-31 2019-04-03 富士フイルム株式会社 内視鏡の組立方法及び内視鏡
CN112969280B (zh) * 2021-02-20 2022-08-26 京东方科技集团股份有限公司 柔性电路板及显示面板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1048021A (en) * 1963-02-04 1966-11-09 Nigel Archibald Walter Electrical circuit arrangements
US4085433A (en) * 1976-11-22 1978-04-18 Baranowski Conrad J Method and apparatus for improving packaging density of discrete electronic components
JPS56105659A (en) * 1980-01-25 1981-08-22 Nec Corp Multichip lsi
US4567543A (en) * 1983-02-15 1986-01-28 Motorola, Inc. Double-sided flexible electronic circuit module
DE3414480C2 (de) * 1984-04-17 1993-02-25 Ifm Electronic Gmbh, 4300 Essen Elektrisches, insbesondere elektronisches, berührungslos arbeitendes Schaltgerät
DE3512978A1 (de) * 1985-04-11 1986-10-16 Schaller-Automation Industrielle Automationstechnik KG, 6653 Blieskastel Verfahren und vorrichtung zur herstellung von elektronischen geraeten und nach dem verfahren hergestellte geraete

Also Published As

Publication number Publication date
EP0443717A2 (en) 1991-08-28
EP0443717A3 (en) 1992-01-29
AU6943191A (en) 1991-07-25

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