KR910014020A - 부품장착장치 - Google Patents

부품장착장치 Download PDF

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Publication number
KR910014020A
KR910014020A KR1019900022376A KR900022376A KR910014020A KR 910014020 A KR910014020 A KR 910014020A KR 1019900022376 A KR1019900022376 A KR 1019900022376A KR 900022376 A KR900022376 A KR 900022376A KR 910014020 A KR910014020 A KR 910014020A
Authority
KR
South Korea
Prior art keywords
component
optical axis
holding
shape
inclined mirror
Prior art date
Application number
KR1019900022376A
Other languages
English (en)
Inventor
야스오 이즈미
마사노리 야스다게
Original Assignee
다니이 아끼오
마쯔시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다니이 아끼오, 마쯔시다덴기산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR910014020A publication Critical patent/KR910014020A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0421—Feeding with belts or tapes with treatment of the terminal leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Abstract

내용 없음.

Description

부품장착장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 요부의 사시도,
제2도는 전체구성을 표시한 사시도,
제3도는 흡착노즐부분의 종단정면도.

Claims (4)

  1. 부품공급위치에시 부품을 유지하고, 소정의 부품장착위치로 이송하여 장착하는 부품유지이송수단과, 부품유지이송 수단에 의해서 유지된 부품의 형상을 인식하는 인식수단과, 인식수단의 광축 방향에 대해서 수직인 방향의 부품형상의 화상을 상기 인식수단에 입력시키는 경사경을 구비한 것을 특징으로 하는 부품장착장치.
  2. 제1항에 있어서, 인식수단과 유지된 부품과의 광축방향의 상대위치를 위치조정하는 수단을 형성한 것을 특징으로 하는 부품장착장치.
  3. 제1항 또는 제2항에 있어서, 광축방향에서 본 경사경의 형상이 4각형프레임형상인 것을 특징으로 하는 부품 장착장치.
  4. 제1항에 있어서, 광축방향에서 본 경사경의 형상이 L자형상 또는 직선형상이며, 부품유지이송수단 및 인식수단의 경사경에 대한 광축과 수직인 방향의 상대위치를 조정하는 수단을 형성하고, 또한 부품유지이송수단이 유지부품을 광축과 평행한 축심둘레로 회전시키는 수단을 구비하고 있는 것을 특징으로 하는 부품 장착장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900022376A 1989-12-29 1990-12-29 부품장착장치 KR910014020A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-341538 1989-12-28
JP1341538A JPH03203399A (ja) 1989-12-29 1989-12-29 部品装着装置

Publications (1)

Publication Number Publication Date
KR910014020A true KR910014020A (ko) 1991-08-08

Family

ID=18346847

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900022376A KR910014020A (ko) 1989-12-29 1990-12-29 부품장착장치

Country Status (3)

Country Link
US (1) US5140643A (ko)
JP (1) JPH03203399A (ko)
KR (1) KR910014020A (ko)

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US6435808B1 (en) 1993-10-06 2002-08-20 Tdk Corporation Chip-type circuit element mounting apparatus
JPH07115296A (ja) * 1993-10-15 1995-05-02 Sanyo Electric Co Ltd 部品実装機の制御装置
KR970700860A (ko) * 1994-02-02 1997-02-12 크라처 져하트 3차원 객체를 이미지화하기 위한 장치(device for imaging a three-dimensional object)
US5563703A (en) * 1994-06-20 1996-10-08 Motorola, Inc. Lead coplanarity inspection apparatus and method thereof
US5880772A (en) * 1994-10-11 1999-03-09 Daimlerchrysler Corporation Machine vision image data acquisition system
EP0808554A1 (de) * 1995-12-11 1997-11-26 QTec Industrie-Automation GmbH Verfahren und einrichtung zur dreidimensionalen, berührungslosen vermessung der geometrie von anschlussbeinen bei halbleiter-bauelementen
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US5883663A (en) * 1996-12-02 1999-03-16 Siwko; Robert P. Multiple image camera for measuring the alignment of objects in different planes
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US5910844A (en) * 1997-07-15 1999-06-08 Vistech Corporation Dynamic three dimensional vision inspection system
JP3760274B2 (ja) * 1997-07-18 2006-03-29 山形カシオ株式会社 電子部品の装着方法及び装置
US6055055A (en) * 1997-12-01 2000-04-25 Hewlett-Packard Company Cross optical axis inspection system for integrated circuits
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US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
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US6538244B1 (en) 1999-11-03 2003-03-25 Cyberoptics Corporation Pick and place machine with improved vision system including a linescan sensor
US6535291B1 (en) * 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
JP2002048716A (ja) * 2000-07-03 2002-02-15 Internatl Business Mach Corp <Ibm> 小型部品の外観検査治具およびその治具を用いた検査方法
EP1220596A1 (en) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
US20020135757A1 (en) * 2001-01-02 2002-09-26 Robotic Vision Systems, Inc. LCC device inspection module
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TWI628428B (zh) * 2016-12-16 2018-07-01 由田新技股份有限公司 多視角影像擷取裝置、及其多視角影像檢測設備
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Also Published As

Publication number Publication date
JPH03203399A (ja) 1991-09-05
US5140643A (en) 1992-08-18

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E601 Decision to refuse application