KR910009959A - 동 및 동합금의 표면처리 방법 - Google Patents

동 및 동합금의 표면처리 방법 Download PDF

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Publication number
KR910009959A
KR910009959A KR1019900018311A KR900018311A KR910009959A KR 910009959 A KR910009959 A KR 910009959A KR 1019900018311 A KR1019900018311 A KR 1019900018311A KR 900018311 A KR900018311 A KR 900018311A KR 910009959 A KR910009959 A KR 910009959A
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KR
South Korea
Prior art keywords
copper
alkyl group
surface treatment
treatment method
copper alloy
Prior art date
Application number
KR1019900018311A
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English (en)
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KR100208555B1 (ko
Inventor
마사쉬 기노쉬타
타카유키 무라이
타카쉬 요쉬오카
Original Assignee
아카자와 아츄쉬
시코쿠 카세이 코오교오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from JP2180239A external-priority patent/JP2686168B2/ja
Priority claimed from JP2212285A external-priority patent/JP2972295B2/ja
Application filed by 아카자와 아츄쉬, 시코쿠 카세이 코오교오 가부시기가이샤 filed Critical 아카자와 아츄쉬
Publication of KR910009959A publication Critical patent/KR910009959A/ko
Application granted granted Critical
Publication of KR100208555B1 publication Critical patent/KR100208555B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

내용 없음

Description

동 및 동합금의 표면처리 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. 2위치에 탄소수 3이상의 알킬기를 갖는 벤즈이미다졸화합물과 유기산을 포함하는 수용액을 동 또는 동합금의 표면에 접촉시키는 동 및 동합금의 표면처리 방법.
  2. 제1항에 있어서, 하기 일반식(I)로 표시되는 알킬벤즈이미다졸 화합물을 사용하는 동 및 동합금의 표면처리방법.
    일반식(I)
    단 식중 R1은 탄소수 3이상의 알킬기를 나타냄.
  3. 제1항에 있어서, 하기 일반식(Ⅱ)로 표시되는 알킬 벤즈 이미다졸 화합물을 사용하는 동 및 동합금의 표면처리 방법.
    일반식(Ⅱ)
    단 식중 R1은 탄소수 3이상의 알킬기를 나타내며, R2′,R3및 R4는 저급알킬기, 할로겐원자, 니트로기 또는 수소원자를 나타내며, 또한 최소한 그 하나가 저급알킬기, 할로겐원자 또는 니트로기의 어느 하나를 나타냄.
  4. 제1항에 있어서, 하기 일반식(Ⅲ)로 표시되는 알킬벤즈 이미다졸 화합물 및 하기 일반식(Ⅳ)로 표시되는 알킬벤즈 이미다졸화합물을 사용하는 동 및 동합금의 표면처리 방법.
    일반식(Ⅲ)
    단 식중 R1은 탄소수 3이상의 알킬기를 나타냄.)
    일반식(Ⅳ)
    (단 식중 R1은 상기와 같음).
  5. 2위치에 탄소수 3이상의 알킬기를 갖는 벤즈이미다졸 화합물과 유기산을 포함하는 수용액을 동 또는 동합금의 표면에 접촉시키고, 계속해서 상기 처리가 행해진 금속표면에 아연 화합물을 포함하는 수용액을 접촉시키는 동 및 동합금의 표면처리 방법.
  6. 2위치에 탄소수 3이상의 알킬기를 갖는 벤즈이미다졸 화합물, 유기산 및 아연 화합물을 포함하는 수용액을 동 또는 합금의 표면에 접촉시키는 동 및 동합금의 표면처리방법.
  7. 2위치에 탄소수 3이상의 알킬기를 갖는 벤즈이미다졸 화합물과 유기산을 포함하는 수용액을 동 또는 동합금의 표면에 접촉시키고, 계속해서 상기 처리가 행해진 금속표면에 동화합물을 포함하는 수용액을 접촉시키는 동 및 동합금의 표면 처리 방법.
  8. 2위치에 탄소수 3이상의 알킬기를 갖는 벤즈이미다졸 화합물, 유기산 및 동화합물을 포함하는 수용액을 동 또는 동합금의 표면에 접촉시키는 동 및 동합금의 표면처리 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900018311A 1989-11-13 1990-11-13 동 및 동합금의 표면 처리 방법 KR100208555B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP29525389 1989-11-13
JP89/295253 1989-11-13
JP90/180239 1990-07-07
JP2180239A JP2686168B2 (ja) 1989-11-13 1990-07-07 銅及び銅合金の表面処理方法並びにはんだ付用表面処理剤
JP90/212285 1990-08-10
JP2212285A JP2972295B2 (ja) 1990-08-10 1990-08-10 銅及び銅合金の表面処理方法

Publications (2)

Publication Number Publication Date
KR910009959A true KR910009959A (ko) 1991-06-28
KR100208555B1 KR100208555B1 (ko) 1999-07-15

Family

ID=67532139

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900018311A KR100208555B1 (ko) 1989-11-13 1990-11-13 동 및 동합금의 표면 처리 방법

Country Status (1)

Country Link
KR (1) KR100208555B1 (ko)

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Publication number Publication date
KR100208555B1 (ko) 1999-07-15

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