KR910003007A - Epoxy Resin Compositions for Semiconductor Sealing - Google Patents

Epoxy Resin Compositions for Semiconductor Sealing Download PDF

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Publication number
KR910003007A
KR910003007A KR1019890010677A KR890010677A KR910003007A KR 910003007 A KR910003007 A KR 910003007A KR 1019890010677 A KR1019890010677 A KR 1019890010677A KR 890010677 A KR890010677 A KR 890010677A KR 910003007 A KR910003007 A KR 910003007A
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South Korea
Prior art keywords
epoxy resin
weight
parts
semiconductor encapsulation
group
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KR1019890010677A
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Korean (ko)
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KR930001989B1 (en
Inventor
이제균
이원섭
조희재
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최근선
주식회사 럭 키
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Priority to KR1019890010677A priority Critical patent/KR930001989B1/en
Publication of KR910003007A publication Critical patent/KR910003007A/en
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Publication of KR930001989B1 publication Critical patent/KR930001989B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음.No content.

Description

반도체 밀봉용 에폭시 수지 조성물Epoxy Resin Compositions for Semiconductor Sealing

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (6)

(a) 에폭시당량170~240, 연화점 60~110℃의 크레졸 노볼락 에폭시수지 또는 페놀노볼락 에폭시수지 10~30중량부, (b) 70~110℃의 연화점을 갖는 페놀노볼락 수지 또는 크레졸노볼락수지 5~20중량부, (c)무기충전제 60~80중량부. (d)폴리디메틸 실록산계의 실리콘오일 0.1~10중량부. (e) 흄 실리카 0.1~5중량부, (f) 열가소성 페녹시수지 0.01~5중량부로 구성됨을 특징으로 하는 반도체 밀봉용 에폭시 수지 조성물.(a) 10 to 30 parts by weight of a cresol novolac epoxy resin or phenol novolac epoxy resin having an epoxy equivalent of 170 to 240 and a softening point of 60 to 110 ° C, and (b) a phenol novolak resin or cresolno having a softening point of 70 to 110 ° C. 5 to 20 parts by weight of volac resin, (c) 60 to 80 parts by weight of inorganic filler. (d) 0.1-10 weight part of silicone oil of polydimethyl siloxane system. (e) 0.1 to 5 parts by weight of fume silica, and (f) 0.01 to 5 parts by weight of a thermoplastic phenoxy resin. 제1항에 있어서, 에폭시수지(a)는 1분자중에 적어도 3이상의 에폭시기를 함유하는 것임을 특징으로 하는 반도체 밀봉용 에폭시수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the epoxy resin (a) contains at least three epoxy groups in one molecule. 제1항에서, 무기충전제는 산화실리콘, 탄산칼슘, 분쇄상 용융실리카, 구상 용융실리카, 결정성실리카, 알루미나, 마이카임을 특징으로 하는 반도체 밀봉용 에폭시 수지조성물.The epoxy resin composition for semiconductor encapsulation of claim 1, wherein the inorganic filler is silicon oxide, calcium carbonate, pulverized fused silica, spherical fused silica, crystalline silica, alumina, mica. 제1항에 있어서, 폴리디메틸 실록산계의 실리콘오일은 말단 또는 분자쇄중에 메틸기, 에폭시기, 아민기, 수산기, 카르복실기로 치환된 것임을 특징으로 하는 반도체 밀봉용 에폭시 수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the polydimethyl siloxane silicone oil is substituted with a methyl group, an epoxy group, an amine group, a hydroxyl group, or a carboxyl group in the terminal or molecular chain. 제1항에 있어서, 흄 실리카는 입자크기가 0.01~0.05㎛이고, 표면적이 100~300㎡/g임을 특징으로 하는 반도체 밀봉용 에폭시 수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the fume silica has a particle size of 0.01 to 0.05 µm and a surface area of 100 to 300 m 2 / g. 제1항에 있어서, 열가소성 페녹시 수지는 분자량이 25.000~35.000사이로 하기 일반식으로 표시됨을 특징으로 하는 반도체 밀봉용 에폭시 수지 조성물.The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the thermoplastic phenoxy resin has a molecular weight of 25.000 to 35.000 and is represented by the following general formula. 상기식에서, n은 82~123사이의 정수, R1은 수소, 히드록실(Hydroxyl), 페녹시(phenoxy), 글리시딜 비스페녹시(glycidyl bisphenoxy)그룹이다.Wherein n is an integer from 82 to 123, R 1 is hydrogen, hydroxyl, phenoxy, glycidyl bisphenoxy group. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890010677A 1989-07-27 1989-07-27 Epoxy resin composition for encapsulating semiconductor KR930001989B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890010677A KR930001989B1 (en) 1989-07-27 1989-07-27 Epoxy resin composition for encapsulating semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890010677A KR930001989B1 (en) 1989-07-27 1989-07-27 Epoxy resin composition for encapsulating semiconductor

Publications (2)

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KR910003007A true KR910003007A (en) 1991-02-26
KR930001989B1 KR930001989B1 (en) 1993-03-20

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KR1019890010677A KR930001989B1 (en) 1989-07-27 1989-07-27 Epoxy resin composition for encapsulating semiconductor

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100364619B1 (en) * 2000-12-18 2002-12-16 제일모직주식회사 Epoxy resin composition for encapsulating semiconductor device
KR100387219B1 (en) * 2000-12-28 2003-06-12 제일모직주식회사 Epoxy resin composition for encapsulating semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101787132B (en) * 2010-03-29 2011-12-21 中科院广州化学有限公司 Organic-silicon hybridization epoxy resin as well as preparation method and application thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100364619B1 (en) * 2000-12-18 2002-12-16 제일모직주식회사 Epoxy resin composition for encapsulating semiconductor device
KR100387219B1 (en) * 2000-12-28 2003-06-12 제일모직주식회사 Epoxy resin composition for encapsulating semiconductor device

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Publication number Publication date
KR930001989B1 (en) 1993-03-20

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