KR900018307A - 반응성 고온 용융 구조적 접착제 - Google Patents

반응성 고온 용융 구조적 접착제 Download PDF

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KR900018307A
KR900018307A KR1019890007159A KR890007159A KR900018307A KR 900018307 A KR900018307 A KR 900018307A KR 1019890007159 A KR1019890007159 A KR 1019890007159A KR 890007159 A KR890007159 A KR 890007159A KR 900018307 A KR900018307 A KR 900018307A
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epoxy resin
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이. 킴블 마이클
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원본미기재
더블유. 알. 그레이스 앤드 컴패니-콘
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    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/667—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6681—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38
    • C08G18/6688—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/32 or C08G18/3271 and/or polyamines of C08G18/38 with compounds of group C08G18/3271
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
    • C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
    • C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
    • C08G18/8012—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with diols
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    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
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Abstract

내용 없음

Description

반응성 고온 용융 구조적 접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (18)

  1. (1) 선혼합물 A, 50내지 1000중량부, (2) 약 3 : 1중량 비율의 에폭시 수지 B및 에폭시 수지 C로 구성된 에폭시 수직 혼합물, 10내지 500 중량부, (3) 에폭시 수지, D, 10내지 200 중량부, (4) 규산 칼슘분말, 0내지 200중량부, (5) CaO, 0내지 100중량부, (6) 발연실리카, 0 내지 80중량부, (7) 연화점이 190내지 290°F이고 열반응성이 아닌 페놀성 수지, 5내지 100 중량부, (8) Zn3(PO4)2, 5내지 100중량부, (9) 약 2 : 1중량비의 에폭시 수지 D 및 디시안디아미드의 혼합물, 5내지 100중량부, (10) 글리시딜 트리메틸 실란, 1내지 10중량부, (11) 시프염기, 0내지 50중량부, (12) CaCO3분말, 0내지 200중량부를 포함하고, 이때, 선중합체 A는 (ⅰ)에틸렌옥시드 캡구조가 발단에 부가되고 일차-OH기를 함유하는 약 4000g/몰의 폴리프로필렌 글리콜 삼블록 공중합체-에틸렌옥시드-프로필렌옥시드-에티러랜옥시드-5내지 100중량부 (ⅱ) 이차-OH기를 갖는 약4000g/몰의 폴리프로필렌 글리콜 동종중합체, 0내지 50중량부 (ⅲ) 페닐 디에탄올아민, 0내지 2중량부 (ⅳ) 약 50 : 50중량비의 디페닐메탄 디이소시아네이트/트리프로필렌 글리콜디페닐 메탄 디이소시아내이트 부가반응 생성물, 5내지 50중량부, 이양은-NCO/폴리올-OH의 몰 비율이 1 및 2사이가 되도록 선정됨 : (ⅴ) 에폭시 수지 C, O내지 50중량부 (ⅵ) 에폭시 수지 B, 10내지 50중량부를 포함하고, 에폭시 수지 B는이며, 여기서 X
    이고
    Y는 -R-K-Q이며, R은 -CH2CH(OH)CH2-이고, K는이며, Q는-CH2-이고, 에폭시 수지 C는 Q-K-(-R-K-)-Q2-4이며, 에폭시 수지 D는 Q-K-Q이고, 단 CaO가 존재하면 시프 염기는 0이고 또 그 역도 가능하며, 또 규산 칼슘, 발연 황산 및 탄산칼슘의 총량이 전체 조성물의 약 10내지 30중량 % 범위임.
  2. 제1항에 있어서, (1) 선혼합물 A가 50내지 800 중량부, (2) 에폭시 수지 B 및 C의 혼합물이 10내지 500중량부, (3) 에폭시 수지 D가 10내지 200 중량부 (4) 규산칼슘이 0내지 200중량부, (5) CaO가 10내지 100중량부, (6) 발연실리카 5내지 80중량부, (7) 연화점 235 내지 290°F인 페놀성 수지가 5내지 100 중량부 (8) Zn3(PO4)2가 5내지 100중량부 (9) 에폭시 수지 D/디시안디아미드 혼합물이 50내지 150중량부 (10) 글리시딜 트리메틸 실란이 1내지 10중량부 (11) 시프 염기가 0이며 또 (12) CaCO3분말이 0인 조성물.
  3. 제2항에 있엇서, (1) 선혼합물 A가 50내지 80 중량부, (2) 에폭시 수지 B 및 C의 혼합물이 50내지 400중량부, (3) 에폭시 수지 D가 25내지 125 중량부, (4) 규산칼슘이 50 내지 150중량부 (5) CaO가 25내지 75중량부 (6) 발연실리카가 20내지 60중량부 (7) 페놀성 수지가 15내지 75중량부 (8) Zn3(PO4)2가 5내지 50중량부 (9) 에폭시 수지 D/디시안디아미드 혼합물이 60내지 120중량부 (10) 글리시딜 트리메틸 실란이 3내지 7중량부인 조성물.
  4. 제3항에 있어서, (1) 선혼합물 A가 50내지 800중량부. (2) 에폭시 수지 B 및 C의 혼합물이 200중량부, (3) 에폭시 수지 D가 50중량부, (4) 구산칼슘이 100중량부, (5) CaO가 50중량부 (6) 발연실리카가 40중량부 (7) 페놀성 수지가 20중량부 (8) Zn3(PO4)2가 10중량부, (9)에폭시 수지 D/디시안디아미드 혼합물이 80중량부, (10) 글리시딜 트리메틸 실란이 5중량부인 조성물.
  5. 제3항 또는 제4항에 있어서, (1) 선혼합물 A가 100내지 300중량부인 조성물.
  6. 제3항 또는 제4항에 있어서, (1) 선혼합물 A가 250 중량부인 조성물.
  7. 제1항에 있어서, (1)선혼합물, A, 200내지 1000중량부, (6) 발연 실리카, 0내지 50중량부, (7) 연화점 190내지 235°F의 페놀성 수지, 0내지 50중량부 (9) 에폭시 수지D 디시안디아미드 혼합물. 5내지 50중량부 (10) 글리시딜 트리메틸 실란, 1 내지 10중량부, (11) 시프염기, 5내지 50중량부 및 (12) 탄산칼슘 0 내지 200중량부로 구성된 조성물.
  8. 제7항에 있어서, (1) 선혼합물 A가 400내지 600 중량부, (6) 발연 실리카가 15내지 25중량부 (7) 페놀성 수지가 10내지 30중량부, (9) 에폭시 수지 D/디시안디아미드 혼합물이 15내지 25중량부 (10)글리시딜 트리메틸실란이 1내지 5중량부. (11) 시프염기가 15내지 25중량부 및 (12) 탄산칼슘이 50내지 150중량부인 조성물.
  9. 제8항에 있어서, (1) 선혼합물 A가 500 중량부, (6) 발연실리카가 22.2중량부, (7)페놀성 수지가 18.5중량부, (9) 에폭시 수지 D/디시안디아미드 혼합물이 22.2중량부, (10) 글리시딜 트리메틸 실란이 3중량부, (11) 시프염기가 22.2중량부 또 (12) 탄산칼슘이 111중량부인 조성물.
  10. 제1항 내지 제9항중 어느 하나에 따른 조성물을 경화 온도까지 가열하는 것에 의하여 제조된 경화 조성물.
  11. 제1항 내지 제10항중 어느 하나에 따른 조성물을 그들 사이에 함유하는 2개의 금속 기재를 포함하는 물품.
  12. 약 80내지 150℃온도에서 비경화된 용융상태인 제1항 내지 제9항중 어느 하나에 따른 조성물을 그들 사이에 함유하는 2개의 금속기재를 포함하는 물품.
  13. 약 0내지 10pai의 전단강도 및 약80내지 160℃의 온도를 갖는 제1항 내지 제9항중 어느 하나에 따른 비경화된 용융 내지 반 용융접착제 조성물에 의하여 결합된 2개의 금속 기재를 포함하고 이 기재들이 결합 상실없이 서로에 대하여 움직일 수 있는 물품.
  14. 제11항 내지 제13항 중 어느 하나에 있어서, 피복된 물품.
  15. (1) 제1항 내지 제9항중 어느 하나에 따른 접착제 조성물을 용융되지만 경화되지 않게 80내지 140℃로 가열하고, (2) 가열된 접착제 조성물을 금속 기재에 이용하며, (3) 제2의 금속 기재들을 접착재 조성물과 긴밀하게 접촉시켜 고정하여 2개의 조립기재 간에 결합을 형성하고, (4) 결합된 기재들을 150내지 200℃에서 가열하여 접착제 조성물을 경화시키고 또 기재들의 접착을 유발하는 연속적인 단개를 포함하는 2개 기재를 함께 접착하는 방법.
  16. 제15항에 있어서, 단계3 및 4사이에(3-a) 결합된 기재들을 다른 장치에 통합시키며, 이 통합은 조성물의 결합 통합성을 잃지 않고 결합된 기재들에 대해 응력을 갖고 또(3-b) 따른 장치가 접착제 조성물이 피복액에 용해되지 않고 과량의 피복액에 노출시키는 것에 의해 피복되는 단계를 포함하는 방법.
  17. 제15항 또는 제16항에 잇어서, 접착제 조성물이 제2항 내지 제6항중 어느 하나의 접착제 조성물인 방법.
  18. 제15항 또는 제16항에 있어서, 접착제 조성물이 제7항, 제8항 또는 제9항의 접착제 조성물인 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890007159A 1988-05-27 1989-05-26 반응성 고온 용융 구조적 접착제 KR0130893B1 (ko)

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US199,491 1988-05-27
US07/199,491 US4962138A (en) 1988-05-27 1988-05-27 Reactive hot melt structural adhesive

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ES2070865T3 (es) 1995-06-16
NZ229299A (en) 1991-05-28
ZA894010B (en) 1990-02-28
DE68922434D1 (de) 1995-06-08
KR0130893B1 (ko) 1998-04-20
JPH0251579A (ja) 1990-02-21
EP0343676A2 (en) 1989-11-29
DE68922434T2 (de) 1995-09-07
AU3515089A (en) 1989-11-30
JP2691021B2 (ja) 1997-12-17
US4962138A (en) 1990-10-09
EP0343676B1 (en) 1995-05-03
EP0343676A3 (en) 1990-06-20
ATE122065T1 (de) 1995-05-15

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