KR900014248A - Water Soluble Colloid Dispersion Of Fumed Silica, Acid And Stabilizer - Google Patents

Water Soluble Colloid Dispersion Of Fumed Silica, Acid And Stabilizer Download PDF

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Publication number
KR900014248A
KR900014248A KR1019900003705A KR900003705A KR900014248A KR 900014248 A KR900014248 A KR 900014248A KR 1019900003705 A KR1019900003705 A KR 1019900003705A KR 900003705 A KR900003705 A KR 900003705A KR 900014248 A KR900014248 A KR 900014248A
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South Korea
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colloidal dispersion
fumed silica
acid
dispersion according
weight
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KR1019900003705A
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Korean (ko)
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KR0148692B1 (en
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지. 밀러 데니스
에프. 몰 윌리엄
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해리 제이. 귄넬
캐보트 코포레이션
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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141Preparation of hydrosols or aqueous dispersions
    • C01B33/1415Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
    • C01B33/1417Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water an aqueous dispersion being obtained
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14Colloidal silica, e.g. dispersions, gels, sols

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Colloid Chemistry (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Paper (AREA)
  • Treating Waste Gases (AREA)

Abstract

내용 없음No content

Description

발연 실리카, 산 및 안정제의 수용성 콜로이드 분산물Water Soluble Colloid Dispersion Of Fumed Silica, Acid And Stabilizer

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (20)

(a)발연 실리카 적어도 약 40중량%, (b)산:발연 실리카의 중량에 기초하여 약 0.0025-0.50중량%, (c)안정제:물 중에 분산된 분산물의 pH를 약7.0-12.0으로 상승시킬 수 있는 양으로 구성되는 콜로이드 분산물.(a) at least about 40 weight percent of fumed silica, (b) about 0.0025-0.50 weight percent based on the weight of acid: fumed silica, and (c) stabilizer: increase the pH of the dispersion dispersed in water to about 7.0-12.0. Colloidal dispersion composed of quantifiable amounts. 제1항에 있어서, 발연 실리카의 양이 약 40-65%인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of fumed silica is about 40-65%. 제1항에 있어서, 발연 실리카의 양이 약 40중량%인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of fumed silica is about 40% by weight. 제1항에 있어서, 발연 실리카의 양이 약 45중량%인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of fumed silica is about 45% by weight. 제1항에 있어서, 발연 실리카의 양이 약 50중량%인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of fumed silica is about 50% by weight. 제1항에 있어서, 발연 실리카의 양이 약 55중량%인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of fumed silica is about 55% by weight. 제1항에 있어서, 발연 실리카의 양이 약 60중량%인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of fumed silica is about 60% by weight. 제1항에 있어서, 발연 실리카의 양이 약 65중량%인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of fumed silica is about 65% by weight. 제1항에 있어서, 산이 무기산 및 유기산으로 이루어지는 군 중에서 선택되는 것을 특징으로하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the acid is selected from the group consisting of inorganic and organic acids. 제1항에 있어서, 산이 염산, 황산, 질산, 인산, 초산 및 말레산으로 이루어지는 군 중에서 선택되는 것을 특징으로하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the acid is selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid and maleic acid. 제1항에 있어서, 산이 염산인것을 특징으로하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the acid is hydrochloric acid. 제1항에 있어서, 산의 양이 발연 실리카의 중량에 기초하여 약0.02-0.15중량%인 것을 특징으로하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the amount of acid is about 0.02-0.15% by weight based on the weight of fumed silica. 제1항에 있어서, 안정제가 알칼리 또는 아민으로 이루어지는 군 중에서 선택되는 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the stabilizer is selected from the group consisting of alkalis or amines. 제1항에 있어서, 안정제가 수산화나트륨, 수산화칼륨, 수산화리튬, 수산화암모늄, 트리에틸아민 및 디메탈에탄올 아민으로 이루어지는 군중에서 선택되는 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the stabilizer is selected from the group consisting of sodium hydroxide, potassium hydroxide, lithium hydroxide, ammonium hydroxide, triethylamine and dimetalethanol amine. 제1항에 있어서, 안정제가 수산화암모늄인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion according to claim 1, wherein the stabilizer is ammonium hydroxide. 제14항에 있어서, 안정제가 수산화암모늄인 것을 특징으로 하는 콜로이드 분산물.15. The colloidal dispersion of claim 14, wherein the stabilizer is ammonium hydroxide. 제1항에 있어서, 안정제가 분산물의 pH를 약 7.5-11로 상승시키는 양으로 첨가되는 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion of claim 1, wherein the stabilizer is added in an amount that raises the pH of the dispersion to about 7.5-11. 제1항에 있어서, 발연 실리카의 표면적이 약 75sq.m/g미만인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion of claim 1, wherein the surface area of the fumed silica is less than about 75sq.m / g. 제1항에 있어서, 발연 실리카의 표면적이 약 10-75sq.m/g미만인 것을 특징으로 하는 콜로이드 분산물.2. The colloidal dispersion of claim 1, wherein the surface area of the fumed silica is less than about 10-75sq.m / g. 제1항에 있어서, 발연 실리카의 표면적이 약 50sq.m/g미만인 것을 특징으로 하는 콜로이드 분산물.The colloidal dispersion of claim 1, wherein the fumed silica has a surface area of less than about 50 sq. M / g. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900003705A 1989-03-21 1990-03-20 Aqueous colloidal dispersion of fumed silica, acid and stabilizer KR0148692B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US326,890 1981-12-02
US32689089A 1989-03-21 1989-03-21

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KR0148692B1 KR0148692B1 (en) 1998-08-17

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JP (1) JP2949633B2 (en)
KR (1) KR0148692B1 (en)
CN (1) CN1027162C (en)
AU (1) AU625980B2 (en)
BE (1) BE1002854A3 (en)
BR (1) BR9001302A (en)
CA (1) CA2012719C (en)
DE (1) DE4006392A1 (en)
FR (1) FR2644768B1 (en)
GB (1) GB2229432B (en)
IT (1) IT1239546B (en)

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US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
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JP4428473B2 (en) 1999-01-18 2010-03-10 株式会社東芝 Method for producing water-containing solid substance of vapor-phase inorganic oxide particles and polishing slurry
JP3721497B2 (en) * 1999-07-15 2005-11-30 株式会社フジミインコーポレーテッド Method for producing polishing composition
DE19936478A1 (en) * 1999-08-03 2001-02-15 Degussa Sintered materials
DE60133411T2 (en) * 2000-11-15 2009-04-16 Cabot Corp., Boston METHOD FOR PRODUCING A DISPERSION OF PYROGENIC METAL OXIDES
JP4426192B2 (en) * 2003-02-14 2010-03-03 ニッタ・ハース株式会社 Method for producing polishing composition
JP5164129B2 (en) * 2004-03-29 2013-03-13 ニッタ・ハース株式会社 Semiconductor polishing composition
JP2005286047A (en) 2004-03-29 2005-10-13 Nitta Haas Inc Abrasive composition for semiconductor
GB0407198D0 (en) 2004-03-30 2004-05-05 British Telecomm Joint fault detection
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DE102005012409A1 (en) * 2005-03-17 2006-09-21 Wacker Chemie Ag Aqueous dispersions of partially hydrophobic silicic acids
JP4837483B2 (en) * 2006-08-04 2011-12-14 住友大阪セメント株式会社 Silica fume slurry for high-strength concrete
DE102008041466A1 (en) * 2008-08-22 2010-02-25 Wacker Chemie Ag Aqueous dispersions of hydrophobic silicic acids
EP2555920B1 (en) * 2009-12-29 2017-09-13 W. R. Grace & Co.-Conn Composite inorganic particles and methods of making and using the same
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BE1002854A3 (en) 1991-07-02
GB2229432A (en) 1990-09-26
CA2012719A1 (en) 1990-09-21
JPH0360420A (en) 1991-03-15
CN1045754A (en) 1990-10-03
JP2949633B2 (en) 1999-09-20
BR9001302A (en) 1991-04-02
DE4006392A1 (en) 1990-09-27
CN1027162C (en) 1994-12-28
IT1239546B (en) 1993-11-05
KR0148692B1 (en) 1998-08-17
FR2644768B1 (en) 1994-02-11
GB9006122D0 (en) 1990-05-16
GB2229432B (en) 1992-09-23
CA2012719C (en) 1999-06-08
IT9019748A0 (en) 1990-03-21
AU625980B2 (en) 1992-07-23
IT9019748A1 (en) 1991-09-21
AU5201090A (en) 1990-09-27
FR2644768A1 (en) 1990-09-28

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