KR900011604A - 무기상을 포함하는 복합재 및 이러한 상을 전달하는 방법 - Google Patents
무기상을 포함하는 복합재 및 이러한 상을 전달하는 방법 Download PDFInfo
- Publication number
- KR900011604A KR900011604A KR1019900000818A KR900000818A KR900011604A KR 900011604 A KR900011604 A KR 900011604A KR 1019900000818 A KR1019900000818 A KR 1019900000818A KR 900000818 A KR900000818 A KR 900000818A KR 900011604 A KR900011604 A KR 900011604A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- surface portion
- layer
- composite
- transfer
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C3/00—Processes, not specifically provided for elsewhere, for producing ornamental structures
- B44C3/08—Stamping or bending
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/22—Metallic printing; Printing with powdered inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/10—Applying flat materials, e.g. leaflets, pieces of fabrics
- B44C1/14—Metallic leaves or foils, e.g. gold leaf
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1007—Running or continuous length work
- Y10T156/1023—Surface deformation only [e.g., embossing]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
- Y10T156/1041—Subsequent to lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Decoration By Transfer Pictures (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Duplication Or Marking (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 유용한 양각 기판의 단면도, 제2도는 양각 표면상에 부착된 무기층을 지니는 제1도의 단면도,제3도는 양각 표면의 높아진 표면 부위에 접착제 층으로 코팅된 제2도의 제품의 단면도.
Claims (17)
- a) 돌출 표면부 및 오목하게 들어간 표면부를 지니는 릴리프 표면을 지니는 양각 기판에 기판내 형성된 형상을 제공하고, b) 상기 릴리프 표면상에 두기층을 침착시켜, 상기 돌출 표면부에 상층을 제공함으로서 상기 양각 기판의 상기 상층 및 돌출 표면부 사이에 X강도 결합을 형성시키고, c) 적어도 상기 상층위에 접착제층을 제공하고, d) 상기 상층위에 제공된 접착제층을 전달 기판과 접촉시키고, e)Y가 X보다 크도록 상기 전달기판과 상기 상층 사이에 Y강도를 갖는 접착제 결합을 형성시키고, f) 상기 양각 기판과 전달 기판을 분리시켜 상기 상층을 상기 전달 기판에 전달시키는 단계를 포함하는 전달 기판에 상응 전달시키는 방법.
- 제1항에 있어서,상기 상층을 상기 양각 기판의 평면에 거의 수직인 각도로 침착시키는 것을 특징으로 하는 방법.
- a) 돌출 표면부와 오목하게 들어간 표면위로 구성되는 기판에 형성된 릴리프 형상을 지니는 가요성 중합체 기판, 과 b) 상기 돌출 표면부에 접착된 제1 무기층과 상기 오목하게 들어간 표면부에 접착된 제2무기층을 포함하는 것을 특징으로 하는 무기/기판 복합재.
- 제3항에 있어서, 상기 제1 무기층이 접착제로 코팅되는 것을 특징으로 하는 복합재.
- 제3항에 있어서, 상기 돌출 표면부와 상기 오목하게 들어간 표면부 사이에 놓여 있는 사수의 특면 부분을 포함하며, 상기 측면 부분이 상기 돌출 표면부와 상기 오목하게 들어간 표면부에 거의 수직인 것을 특징으로 하는 복합재.
- 제3항에 있어서, 상기 무기층이 적어도 하나의 금속 필름을 포함하는 것을 특징으로 하는 복합재.
- 제3항에 있어서, 상기 돌출 표면이 약 625-10,100 돌출물/㎠을 지니는 규칙적으로 배열된 돌출물을 포함하는 것을 특징으로 하는 복합재.
- 제7항에 있어서, 상기 측벽이 약 10 내지 1000 rm의 길이를 지니는 것을 특징으로 하는 복합재.
- 제3항에 있어서, 상기 무기층이 전도성인 것을 특징으로 하는 복합재.
- 제8항에 있어서, 상기 복합재가 자체로 감겨진 로울 형태로서 제공되는 것을 특징으로 하는 복합재.
- a) 돌출 표면부와 오목하게 들어간 표면부를 지니는 기판내 형성된 릴리프 형상을 지니고 양각 기판을 제공하고, b) 상기 릴리프 형상을 상기 돌출 표면부상에 코팅된 상층을 포함하는 금속층에 코팅하고, 코팅하고, c) 적어도 상층을 접합체 층으로 코팅하고, d) 전달 기판을 접착제층을 지닌 상기 상층에 결합시키고, e) 상기 전달 기판과 상기 상층 사이의 결합이 상기 상층과 상기 양각 기판 사이의 결합 보다 크도록 형성시키고, f) 상기 양각 기판과 상기 전달 기판을 분리시켜 상기 상층을 상기 전달 기판에 전달시키는 단계를 포함하는 제6항에 기재된 복합재의 형성방법.
- a) 돌출 표면부 및 오목하게 들어간 표면부를 지나는 기판내 형성된 형성을 지니는 릴리프 표면을 포함하는 양각 기판을 제공하고, b) 상기 돌출표면부상에 상층을 침착시켜, 상기 상층과 상기 돌출 표면부사이에, X 강도를 갖는 결합을 형성시키고, c) 상기 접착제를 채택하여 상기 전달기판과 상기 상층 사이에 Y 강도의 결합(Y는 X 보다 크다)을 지니는 전달 기판을 지닌 결합이 형성되도록 적어도 상기 상층위에 접착제층을 제공하고, d) 전달 테이트를 제공하여 이형지를 제거리 전달 기판에 상층을 전달시키고, 상기 전달기판을 상기 접착제층과 접촉시킨뒤, 전달 테이프 및 전달 기판을 분리되도록 상기 접착제층과 이형지를 접촉시키는 단계를 포착하는 상 전달 테이프로서 사용하도록 채택된 제11항의 복합재로된 로울의 제조 방법.
- a) 제1표면을 가진 열가소성 또는 열경화성 중합기판을 제공하고, b)표면 릴리프 형상을 가지며 상기 중합체의 연화점 이상의 온도로 가열할 수 있는 양각 로울 또는 플레이트를 제고하고, c) 상기 중합체 기판의 제1표면을 금속 입자층으로 코팅하고 d) 양각 로울 또는 플레이트의 표면 릴리프 형상을 재생산 하는 형상에서 금속 입자를 제1표면에 함침시키는데 충분한 온도 및 압력을 중합 기판의 입자 코팅면에 대하여 양각 플레이트 또는 로울을 고온 압착한 다음, e) 제1표면을 용융 금속에 침지하거나, 또는 부가 금속을 침지된 금속 입자상에서 전기도금 함으로써 함침된 금속 입자 형상을 금속화하는 단계로 구성되는 중합체 기판의 표면에 접착된 금속 형상을 지니는 금속/중합체 복합재를 형성하기 위해 중합체 기판을 선택적으로 금속화 하는 방법.
- a) 상기 돌출 표면부 및 오목하게 들어간 표면부를 지닌 릴리프 형상을 /속에 형성시킨 가요성 중합기판; 및 b) 상기 오목하게 들어간 표면부에 접착된 무기층으로 구성되는 무기/기판 복합재.
- 제14항에 있어서, 상기 무기층이 금속인 복합재.
- 제15항애 있어서, 상기 음각 표면부에 접착된 무기층이 길이방향으로 전도성인 복수의 평행 스트립을 포함하는 복합재.
- 제16항에 있어서, 상기 양각 표면부에 접착된 무기층이 길이 방향으로 전도성인 복수의 평행 스트립을 포함하며, 상기 양각 표면부 위에 있는 스트립이 상기 음각 표면부 위에서 스트립으로부터 절연되는 복합재.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/300,334 US5017255A (en) | 1989-01-23 | 1989-01-23 | Method of transferring an inorganic image |
US300,334 | 1989-01-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900011604A true KR900011604A (ko) | 1990-08-01 |
Family
ID=23158674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900000818A KR900011604A (ko) | 1989-01-23 | 1990-01-22 | 무기상을 포함하는 복합재 및 이러한 상을 전달하는 방법 |
Country Status (6)
Country | Link |
---|---|
US (2) | US5017255A (ko) |
EP (1) | EP0384072A3 (ko) |
JP (1) | JPH02235681A (ko) |
KR (1) | KR900011604A (ko) |
CA (1) | CA2003675A1 (ko) |
MY (1) | MY104280A (ko) |
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CN102340928B (zh) * | 2010-07-20 | 2013-09-11 | 王定锋 | 用扁平导线并置排列制作的单面电路板及其制作方法 |
BR112016003050A2 (pt) * | 2013-08-19 | 2017-12-12 | Bemis Co Inc | estruturas laminadas metalizadas para embalagem de alimento |
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-
1989
- 1989-01-23 US US07/300,334 patent/US5017255A/en not_active Expired - Fee Related
- 1989-11-22 EP EP19890312100 patent/EP0384072A3/en not_active Ceased
- 1989-11-23 CA CA002003675A patent/CA2003675A1/en not_active Abandoned
- 1989-12-01 MY MYPI89001674A patent/MY104280A/en unknown
-
1990
- 1990-01-17 JP JP2008072A patent/JPH02235681A/ja active Pending
- 1990-01-22 KR KR1019900000818A patent/KR900011604A/ko not_active Application Discontinuation
-
1993
- 1993-02-22 US US08/021,155 patent/US5328534A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0384072A2 (en) | 1990-08-29 |
MY104280A (en) | 1994-02-28 |
US5328534A (en) | 1994-07-12 |
EP0384072A3 (en) | 1990-09-26 |
JPH02235681A (ja) | 1990-09-18 |
CA2003675A1 (en) | 1990-07-23 |
US5017255A (en) | 1991-05-21 |
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