KR900010983A - 리드 프레임의 제조방법 - Google Patents

리드 프레임의 제조방법

Info

Publication number
KR900010983A
KR900010983A KR1019890017797A KR890017797A KR900010983A KR 900010983 A KR900010983 A KR 900010983A KR 1019890017797 A KR1019890017797 A KR 1019890017797A KR 890017797 A KR890017797 A KR 890017797A KR 900010983 A KR900010983 A KR 900010983A
Authority
KR
South Korea
Prior art keywords
manufacturing
lead frame
lead
frame
Prior art date
Application number
KR1019890017797A
Other languages
English (en)
Other versions
KR930002815B1 (ko
Inventor
미쓰하루 시미즈
Original Assignee
신고오덴기고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신고오덴기고오교오 가부시끼가이샤 filed Critical 신고오덴기고오교오 가부시끼가이샤
Publication of KR900010983A publication Critical patent/KR900010983A/ko
Application granted granted Critical
Publication of KR930002815B1 publication Critical patent/KR930002815B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
KR1019890017797A 1988-12-12 1989-12-02 리드 프레임의 제조방법 KR930002815B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-313617 1988-12-12
JP63313617A JPH02158160A (ja) 1988-12-12 1988-12-12 リードフレームの製造方法

Publications (2)

Publication Number Publication Date
KR900010983A true KR900010983A (ko) 1990-07-11
KR930002815B1 KR930002815B1 (ko) 1993-04-10

Family

ID=18043474

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890017797A KR930002815B1 (ko) 1988-12-12 1989-12-02 리드 프레임의 제조방법

Country Status (2)

Country Link
JP (1) JPH02158160A (ko)
KR (1) KR930002815B1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03283643A (ja) * 1990-03-30 1991-12-13 Mitsui High Tec Inc リードフレームの製造方法
KR20020031719A (ko) * 2000-10-23 2002-05-03 마이클 디. 오브라이언 반도체 패키지 제조용 리드프레임 구조
JP4381009B2 (ja) 2003-03-12 2009-12-09 新光電気工業株式会社 パターン描画装置、パターン描画方法、および検査装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6240862A (ja) * 1985-08-19 1987-02-21 Canon Inc 電子表示記録装置
JPH0245967A (ja) * 1988-08-08 1990-02-15 Hitachi Cable Ltd 半導体装置用リードフレームの製造方法

Also Published As

Publication number Publication date
JPH02158160A (ja) 1990-06-18
KR930002815B1 (ko) 1993-04-10

Similar Documents

Publication Publication Date Title
KR880700736A (ko) 구리로바론 적층판의 제조방법
KR890016266A (ko) 전주 및 그 제조방법과 전주조립체
FI97892B (fi) Sakkaroosi-6-esterin tuotantomenetelmä
KR890010464A (ko) 풀리 및 그 제조방법
KR910001409A (ko) 광부품 및 그 제조방법
KR900009238A (ko) 장식품의 제조 방법
KR890700300A (ko) 제어유닛 및 그 제조방법
KR870700615A (ko) 감마-부티로락톤의 제조방법
KR900009790A (ko) 모노-n-알킬화된 폴리아자마크로사이클의 제조방법
KR900009566A (ko) 말레이미드류의 제조법
KR880004732A (ko) 본딩방법
KR900019181A (ko) 본딩방법
KR880701761A (ko) 석탄계 필러의 제조방법
KR900700532A (ko) 코폴리의 제조방법
KR900010983A (ko) 리드 프레임의 제조방법
KR870700632A (ko) 네틸마이신의 제조방법
KR850000785A (ko) 리이드 프레임
KR860700045A (ko) L-카르니틴의 제조방법
KR880003885A (ko) 퍼할로히드로카본 하이포클로라이트의 제조방법
KR870010952A (ko) 포장체 및 그의 제조방법
KR910009946U (ko) 리드프레임
KR900010984A (ko) 리드프레임의 가공방법
KR870009465A (ko) 리드프레임
KR900010024A (ko) 소결광의 제조방법
KR900007843A (ko) 신규 6-플루오로퓨린화합물과 그 제조방법

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20090326

Year of fee payment: 17

EXPY Expiration of term