KR900006755A - 접착면 높이 검출 장치 - Google Patents

접착면 높이 검출 장치

Info

Publication number
KR900006755A
KR900006755A KR1019890014693A KR890014693A KR900006755A KR 900006755 A KR900006755 A KR 900006755A KR 1019890014693 A KR1019890014693 A KR 1019890014693A KR 890014693 A KR890014693 A KR 890014693A KR 900006755 A KR900006755 A KR 900006755A
Authority
KR
South Korea
Prior art keywords
detection device
adhesive surface
surface height
height detection
adhesive
Prior art date
Application number
KR1019890014693A
Other languages
English (en)
Other versions
KR920009797B1 (ko
Inventor
유우지 오오하시
요시미쯔 데라가도
미노루 도리하다
히로시 우시끼
Original Assignee
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 신가와 filed Critical 가부시끼가이샤 신가와
Publication of KR900006755A publication Critical patent/KR900006755A/ko
Application granted granted Critical
Publication of KR920009797B1 publication Critical patent/KR920009797B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B1/00—Measuring instruments characterised by the selection of material therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H01L2224/78823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
KR1019890014693A 1988-10-18 1989-10-13 접착면 높이 검출 장치 KR920009797B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63260448A JP2537672B2 (ja) 1988-10-18 1988-10-18 ボンデイング面高さ検出装置
JP88-260448 1988-10-18

Publications (2)

Publication Number Publication Date
KR900006755A true KR900006755A (ko) 1990-05-08
KR920009797B1 KR920009797B1 (ko) 1992-10-22

Family

ID=17348077

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890014693A KR920009797B1 (ko) 1988-10-18 1989-10-13 접착면 높이 검출 장치

Country Status (3)

Country Link
US (1) US5046655A (ko)
JP (1) JP2537672B2 (ko)
KR (1) KR920009797B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100245253B1 (ko) * 1997-12-31 2000-02-15 한상관 수압에 의해 자동개폐되는 자동수문

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148967A (en) * 1991-07-15 1992-09-22 Hughes Aircraft Company Apparatus and method for detecting missing interconnect material
US5699952A (en) 1995-06-06 1997-12-23 The Fusion Bonding Corporation Automated fusion bonding apparatus
US5884808A (en) * 1997-08-21 1999-03-23 Technical Concepts, L.P. Material dispensing method and apparatus having display feature
US5908140A (en) * 1997-08-21 1999-06-01 Technical Concepts, L.P. Material dispensing method and apparatus with stall detect

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4109846A (en) * 1977-05-17 1978-08-29 Sola Basic Industries, Inc. Automatic height sensor for semiconductor bonding tool, wafer probe or the like
JPS5854645A (ja) * 1981-09-28 1983-03-31 Toshiba Corp ワイヤボンデイング装置
JPS58184734A (ja) * 1982-04-22 1983-10-28 Toshiba Corp ワイヤボンデイング装置
JPS6057640A (ja) * 1983-09-08 1985-04-03 Tokyo Sokuhan Kk ボンデイング面高さ検出装置
US4598853A (en) * 1984-05-21 1986-07-08 Hughes Aircraft Company Open-center flexural pivot wire bonding head
JPH0744197B2 (ja) * 1985-03-19 1995-05-15 株式会社東芝 ボンデイング装置
US4653681A (en) * 1985-05-16 1987-03-31 Kulicke And Soffa Industries, Inc. Voice coil actuated fine wire clamp
JPS61290730A (ja) * 1985-06-19 1986-12-20 Hitachi Ltd ボンデイング装置
US4718591A (en) * 1986-12-19 1988-01-12 Hughes Aircraft Company Wire bonder with open center of motion
JP2765833B2 (ja) * 1987-02-27 1998-06-18 株式会社日立製作所 半導体装置のワイヤボンディング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100245253B1 (ko) * 1997-12-31 2000-02-15 한상관 수압에 의해 자동개폐되는 자동수문

Also Published As

Publication number Publication date
JPH02109345A (ja) 1990-04-23
JP2537672B2 (ja) 1996-09-25
US5046655A (en) 1991-09-10
KR920009797B1 (ko) 1992-10-22

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20070920

Year of fee payment: 17

EXPY Expiration of term