KR900002440A - 피가공물 가열이송장치 - Google Patents
피가공물 가열이송장치 Download PDFInfo
- Publication number
- KR900002440A KR900002440A KR1019890009411A KR890009411A KR900002440A KR 900002440 A KR900002440 A KR 900002440A KR 1019890009411 A KR1019890009411 A KR 1019890009411A KR 890009411 A KR890009411 A KR 890009411A KR 900002440 A KR900002440 A KR 900002440A
- Authority
- KR
- South Korea
- Prior art keywords
- heat transfer
- cover
- workpiece
- heat
- transfer device
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Reciprocating Conveyors (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Tunnel Furnaces (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예를 나타내며, (a)는 평면도, (b)는 (a)의 A-A선 단면도.
제2도는 본 발명의 다른 실시예를 나타내는 단면도.
Claims (3)
- 피가공물을 가열하는 히트블록 위쪽에 덮개를 설치한 피가공물 가열이송장치에 있어서, 상기 덮개의 중앙부에 개구부를 설치하고, 상기 개구부를 덮도록 투명한 내열판을 설치한 것을 특징으로 하는 피가공물 가열이송장치.
- 피가공물을 가열하는 히트블록의 위쪽을 덮도록 덮개를 설치한 피가공물 가열이송장치에 있어서, 상기 덮개는 투명한 내열판으로 이루어지는 것을 특징으로 하는 피가공물 가열이송장치.
- 제1항 또는 제2항에 있어서, 상기 투명한 내열판을 내열유리로 이루어지는 것을 특징으로 하는 피가공물 가열이송장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63166544A JPH0793337B2 (ja) | 1988-07-04 | 1988-07-04 | ワーク加熱送り装置 |
JP63-166544 | 1988-07-04 | ||
JP88-166544 | 1988-07-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900002440A true KR900002440A (ko) | 1990-02-28 |
KR920005800B1 KR920005800B1 (ko) | 1992-07-18 |
Family
ID=15833241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890009411A KR920005800B1 (ko) | 1988-07-04 | 1989-07-03 | 피가공물 가열이송장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4975050A (ko) |
JP (1) | JPH0793337B2 (ko) |
KR (1) | KR920005800B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM468013U (zh) * | 2013-07-18 | 2013-12-11 | Pram Technology Inc | 電子業製程共用式可拆裝替換之打線熱板 |
CN104668693B (zh) * | 2015-01-22 | 2016-05-18 | 福建省万达汽车玻璃工业有限公司 | 一种舌片自动焊接及检测流水线 |
CN107976071B (zh) * | 2017-12-20 | 2023-08-01 | 大连重工机电设备成套有限公司 | 分体补偿式宽布料铁合金炉下料嘴 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3900145A (en) * | 1972-10-13 | 1975-08-19 | John C Diepeveen | Apparatus for incremental movement of die frame |
US3800716A (en) * | 1973-02-16 | 1974-04-02 | R Berger | Furnace closure |
US3859041A (en) * | 1974-01-21 | 1975-01-07 | Ney Co J M | Muffle furnace with sighting assembly |
US3980028A (en) * | 1975-05-30 | 1976-09-14 | Leon Ginsburg | Interchangeable see-through and opaque inserts for muffle furnace |
JPS5645040A (en) * | 1979-09-21 | 1981-04-24 | Hitachi Ltd | Wire bonding apparatus |
US4732313A (en) * | 1984-07-27 | 1988-03-22 | Kabushiki Kaisha Toshiba | Apparatus and method for manufacturing semiconductor device |
US4763826A (en) * | 1986-05-14 | 1988-08-16 | Kulicke And Soffa Ind., Inc. | Automatic wire feed system |
US4765531A (en) * | 1987-05-14 | 1988-08-23 | Kulicke And Soffa Industries Inc. | Quick change work station apparatus for automatic wire bonders |
US4855007A (en) * | 1988-06-03 | 1989-08-08 | Motorola Inc. | Automatic die attach workholder |
-
1988
- 1988-07-04 JP JP63166544A patent/JPH0793337B2/ja not_active Expired - Fee Related
-
1989
- 1989-06-30 US US07/374,533 patent/US4975050A/en not_active Expired - Lifetime
- 1989-07-03 KR KR1019890009411A patent/KR920005800B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR920005800B1 (ko) | 1992-07-18 |
JPH0793337B2 (ja) | 1995-10-09 |
JPH0216743A (ja) | 1990-01-19 |
US4975050A (en) | 1990-12-04 |
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G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
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FPAY | Annual fee payment |
Payment date: 20070702 Year of fee payment: 17 |
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EXPY | Expiration of term |