KR900001288A - 마이크로 웨이브 발진회로 장치의 설치구조. - Google Patents
마이크로 웨이브 발진회로 장치의 설치구조. Download PDFInfo
- Publication number
- KR900001288A KR900001288A KR1019890012169A KR890012169A KR900001288A KR 900001288 A KR900001288 A KR 900001288A KR 1019890012169 A KR1019890012169 A KR 1019890012169A KR 890012169 A KR890012169 A KR 890012169A KR 900001288 A KR900001288 A KR 900001288A
- Authority
- KR
- South Korea
- Prior art keywords
- nut
- screws
- chassis base
- circuit device
- installation structure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B1/00—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10075—Non-printed oscillator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Waveguide Connection Structure (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제7도는 본 발명의 한 바람직한 실시예에 따른 마이크로 웨이브 발진회로 장치의 설치 구조의 평면도.
제8도 제7도에서의 선 Ⅷ-Ⅷ을 따라 취해진 단면도.
Claims (1)
- 그의 다른 표면상에 회로기판을 가지는 섀시 베이스의 한 표면상에 마이크로 웨이브 발진회로 장치를 설치하는 설치구조에 있어서, 상기 장치는 적어도 2개의 나사, 섀시 베이스 상에 설치될때 섀시 베이스에 직면하는 그의 한 표면상에 출력단자와 전원단자를 가지고 그 개랑은 나사들 중의 상기 한 나사에 상기 첫째 너트를 죄임으로서 발생되는 토크가 섀시 베이스에서 작동하도록 출력단자와 전원단자에 인접하여 위치하는 나사들 중의 하나에 나삿니를 내게되는 첫째 너트와 그리고 상기 첫째 너트는 회로기판에서 명백하게 되고 그리고 나사들중의 상기 다른 것에 다른 것에 둘째 너트를 죄임으로서 발생되는 토크가 섀시 베이스와 회로기판 둘다에서 작동하도록 출력단자와 전원단자에서 떨어져 위치하는 나사들 중의 다른 것에 나삿니를 내게되는 둘째 너트로 되어 있는 마이크로 웨이브 발진회로 장치의 설치구조.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988076160U JPH054299Y2 (ko) | 1988-06-08 | 1988-06-08 | |
JP88-76160 | 1988-06-08 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019890007830 Division | 1989-06-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900001288A true KR900001288A (ko) | 1990-01-31 |
Family
ID=13597307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890012169A KR900001288A (ko) | 1988-06-08 | 1989-08-25 | 마이크로 웨이브 발진회로 장치의 설치구조. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5008638A (ko) |
JP (1) | JPH054299Y2 (ko) |
KR (1) | KR900001288A (ko) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4091232A (en) * | 1976-07-19 | 1978-05-23 | Motorola, Inc. | Low microphonic circuit housing |
-
1988
- 1988-06-08 JP JP1988076160U patent/JPH054299Y2/ja not_active Expired - Lifetime
-
1989
- 1989-06-07 US US07/362,506 patent/US5008638A/en not_active Expired - Lifetime
- 1989-08-25 KR KR1019890012169A patent/KR900001288A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH054299Y2 (ko) | 1993-02-02 |
US5008638A (en) | 1991-04-16 |
JPH01179480U (ko) | 1989-12-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |