KR890702213A - 벤조사이클로부텐-기본 다이 결합 접착제 조성물 - Google Patents
벤조사이클로부텐-기본 다이 결합 접착제 조성물Info
- Publication number
- KR890702213A KR890702213A KR1019890700570A KR890700570A KR890702213A KR 890702213 A KR890702213 A KR 890702213A KR 1019890700570 A KR1019890700570 A KR 1019890700570A KR 890700570 A KR890700570 A KR 890700570A KR 890702213 A KR890702213 A KR 890702213A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- independently
- integer
- bisbenzocyclobutene
- amount
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- C08L2666/44—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Die Bonding (AREA)
- Preparation Of Compounds By Using Micro-Organisms (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- (a) 하기 일반식(I)의 비스벤조사이클로부텐 단량체 ; (b) 오가노실란 접착 촉진제 ; 및 (c) 전기전도성 금속의 균질 혼합물을 함유함을 특징으로 하는 다이(die) 결합 접착제 조성물.상기 식에서, 각각의 R은 독립적으로 C1-6알킬, C4-6사이클로 알킬, 벤질 또는 페닐이고 ; 각각의 R1은 독립적으로 비닐, 알릴, 메탈릴 또는 스티릴이며 ; 각각의 R2는 독립적으로 C1-6알킬, C1-6할로알킬, 메톡시, 메톡시카르보닐, 트리플루오로메톡시카보닐, 니트로, 클로로, 브로모 또는 요오드이고 ; 각각의 R3는 독립적으로 클로로, 브로모, 요오도, 니트로, C1-6알킬, C1-6할로알킬 또는 시아노이며 ; n은 1이상의 정수이고 ; 각각의 q 및 r은 독립적으로 0 또는 1의 정수이다.
- 제 1 항에 있어서, n이 1 내지 1.000의 정수인 조성물.
- 제 2 항에 있어서, 비스벤조사이클로부텐 단량체가 하기 구조식(II)을 갖는 조성물.
- 제 1 항에 있어서, 오가노실란 접착 촉진제가 하기 일반식(III)을 갖는 조성물.R4mSiX(4-m)(III)상기식에서, R4는 비스벤조사이클로부텐-반응 작용성을 갖는 비가수분해성 유기 래디칼이고 ; X는 C1-6알콕시, C1-6아실옥시 또는 아미노이며 ; m은 1, 2 또는 3의 정수이다.
- 제 4 항에 있어서, m이 1인 조성물.
- 제 1 항에 있어서, 추가로 제 2 비스벤조사이클로부텐 단량체를 함유하는 조성물.
- 제 1 항에 있어서, 비스벤조사이클로부텐 단량체의 양이 조성물의 5 내지 30중량 %의 범위일 수 있는 조성물.
- 제 1 항에 있어서, 오가노실란 접착 촉진제의 양이 조성물의 1 내지 10중량 %의 범위일 수 있는 조성물.
- 제 1 항에 있어서, 전기전도성 금속의 양이 조성물의 60중량 % 이상인 조성물.
- 제 6 항에 있어서, 제 2 비스벤조사이클로부텐 단량체의 양이 조성물의 1 내지 20중량 %의 범위일 수 있는 조성물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US081,056 | 1987-08-03 | ||
US07/081,056 US4759874A (en) | 1987-08-03 | 1987-08-03 | Benzocyclobutene-based die attach adhesive compositions |
US?081,056? | 1987-08-03 | ||
PCT/US1988/002574 WO1989001225A1 (en) | 1987-08-03 | 1988-07-28 | Benzocyclobutene-based die attach adhesive compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890702213A true KR890702213A (ko) | 1989-12-23 |
KR970004547B1 KR970004547B1 (ko) | 1997-03-29 |
Family
ID=22161845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890700570A KR970004547B1 (ko) | 1987-08-03 | 1988-07-28 | 벤조사이클로부텐-기본 다이 결합 접착제 조성물 |
Country Status (13)
Country | Link |
---|---|
US (1) | US4759874A (ko) |
EP (1) | EP0372000B1 (ko) |
JP (1) | JPH03500707A (ko) |
KR (1) | KR970004547B1 (ko) |
AT (1) | ATE114659T1 (ko) |
BR (1) | BR8807646A (ko) |
CA (1) | CA1318983C (ko) |
DE (1) | DE3852311T2 (ko) |
DK (1) | DK28590A (ko) |
FI (1) | FI900533A0 (ko) |
IL (1) | IL87288A (ko) |
MY (1) | MY101032A (ko) |
WO (1) | WO1989001225A1 (ko) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5026892A (en) * | 1984-08-27 | 1991-06-25 | The Dow Chemical Company | Novel poly(arylcyclobutenes) |
US4999449A (en) * | 1984-08-27 | 1991-03-12 | The Dow Chemical Company | Novel poly(arylcyclobutenes) |
US4812588A (en) * | 1987-12-14 | 1989-03-14 | The Dow Chemical Company | Polyorganosiloxane-bridged bisbenzocyclobutene monomers |
US5026667A (en) * | 1987-12-29 | 1991-06-25 | Analog Devices, Incorporated | Producing integrated circuit chips with reduced stress effects |
US4831172A (en) * | 1988-03-23 | 1989-05-16 | The Dow Chemical Company | Benzocyclobutene-based organosilane adhesion aids |
US5002808A (en) * | 1988-03-23 | 1991-03-26 | The Dow Chemical Company | Adhesion methods employing benzocyclobutene-based organosilane adhesion aids |
US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
US5138081A (en) * | 1991-04-30 | 1992-08-11 | The Dow Chemical Company | Process for purifying vinylically-unsaturated organosilicon compounds |
US5136069A (en) * | 1991-03-28 | 1992-08-04 | The Dow Chemical Company | Process for preparing vinylically-unsaturated compounds (II) |
US5264646A (en) * | 1991-03-28 | 1993-11-23 | The Dow Chemical Company | Process for preparing vinylically-unsaturated compounds |
JP3213001B2 (ja) * | 1991-12-10 | 2001-09-25 | ザ ダウ ケミカル カンパニー | 光硬化性シクロブタレーン組成物 |
EP0728825B1 (en) * | 1994-06-29 | 2000-04-26 | Shin-Etsu Chemical Co., Ltd. | Adhesive silicone compositions |
US5668210A (en) * | 1994-10-24 | 1997-09-16 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
US5994489A (en) * | 1994-10-24 | 1999-11-30 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
FR2737639B1 (fr) * | 1995-08-02 | 1997-09-12 | Telecommunications Sa | Plaquette de circuit electronique en technologie couche epaisse |
US6110805A (en) * | 1997-12-19 | 2000-08-29 | Micron Technology, Inc. | Method and apparatus for attaching a workpiece to a workpiece support |
JP3401746B2 (ja) * | 1998-03-20 | 2003-04-28 | 信越化学工業株式会社 | 導電性オルガノポリシロキサン組成物 |
US6184284B1 (en) | 1998-08-24 | 2001-02-06 | The Dow Chemical Company | Adhesion promoter and self-priming resin compositions and articles made therefrom |
US7176044B2 (en) * | 2002-11-25 | 2007-02-13 | Henkel Corporation | B-stageable die attach adhesives |
US20040159923A1 (en) * | 2003-02-15 | 2004-08-19 | Sergei Skokov | Using benzocyclobutene based polymers as underfill materials |
JP2005083961A (ja) * | 2003-09-10 | 2005-03-31 | ▲高▼木 敏行 | 歪センサー |
US7115987B2 (en) * | 2003-12-31 | 2006-10-03 | Intel Corporation | Integrated stacked microchannel heat exchanger and heat spreader |
US20060275616A1 (en) * | 2005-06-03 | 2006-12-07 | Clough Robert S | Silane-based coupling agent |
US20070004844A1 (en) * | 2005-06-30 | 2007-01-04 | Clough Robert S | Dielectric material |
JP2011040603A (ja) * | 2009-08-12 | 2011-02-24 | Disco Abrasive Syst Ltd | ウエーハの加工方法および研削装置 |
US9223059B2 (en) * | 2012-06-27 | 2015-12-29 | Canon Kabushiki Kaisha | Benzocyclobutene compound, organic-inorganic composite particle, cross-linked organic-inorganic composite particle, organic-inorganic composite composition, cross-linked organic-inorganic composite composition, and optical device utilizing the same |
CN107586532A (zh) * | 2017-10-19 | 2018-01-16 | 江苏江永新材料科技有限公司 | 一种703室温固化灯具胶 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2970077A (en) * | 1955-06-28 | 1961-01-31 | American Can Co | Method of joining surfaces |
US3347978A (en) * | 1963-06-03 | 1967-10-17 | Lockheed Aircraft Corp | Electrically conductive joints and gaskets |
US3265640A (en) * | 1964-02-28 | 1966-08-09 | Grace W R & Co | Crosslinked polymers from alpha, alpha-dichloro-p-xylene and polysubstituted benzenes |
US3584027A (en) * | 1969-05-02 | 1971-06-08 | M & T Chemicals Inc | Process for producing organopolysiloxanes |
US3770768A (en) * | 1971-03-01 | 1973-11-06 | Gen Electric | Aliphatically unsaturated organopolysiloxanes |
US3803196A (en) * | 1971-03-01 | 1974-04-09 | Gen Electric | Aliphatically unsaturated organopolysiloxanes |
US3981762A (en) * | 1972-08-03 | 1976-09-21 | Usm Corporation | Method for bonding resin film to metal |
US4466850A (en) * | 1980-12-29 | 1984-08-21 | General Electric Company | Method for fabricating a one-time electrically activated switch |
US4743399A (en) * | 1984-08-27 | 1988-05-10 | The Dow Chemical Company | Adhesive compositions from arylcyclobutene monomeric compositions |
US4661193A (en) * | 1984-08-27 | 1987-04-28 | The Dow Chemical Company | Adhesive compositions for arylcyclobutene monomeric compositions |
US4540763A (en) * | 1984-09-14 | 1985-09-10 | The Dow Chemical Company | Polymers derived from poly(arylcyclobutenes) |
-
1987
- 1987-08-03 US US07/081,056 patent/US4759874A/en not_active Expired - Fee Related
-
1988
- 1988-07-28 KR KR1019890700570A patent/KR970004547B1/ko active IP Right Grant
- 1988-07-28 BR BR888807646A patent/BR8807646A/pt not_active Application Discontinuation
- 1988-07-28 WO PCT/US1988/002574 patent/WO1989001225A1/en active IP Right Grant
- 1988-07-28 AT AT88907945T patent/ATE114659T1/de not_active IP Right Cessation
- 1988-07-28 EP EP88907945A patent/EP0372000B1/en not_active Expired - Lifetime
- 1988-07-28 DE DE3852311T patent/DE3852311T2/de not_active Expired - Lifetime
- 1988-07-28 JP JP63507276A patent/JPH03500707A/ja active Pending
- 1988-08-01 IL IL87288A patent/IL87288A/xx not_active IP Right Cessation
- 1988-08-02 MY MYPI88000873A patent/MY101032A/en unknown
- 1988-08-02 CA CA000573551A patent/CA1318983C/en not_active Expired - Fee Related
-
1990
- 1990-02-02 DK DK028590A patent/DK28590A/da unknown
- 1990-02-02 FI FI900533A patent/FI900533A0/fi not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DK28590D0 (da) | 1990-02-02 |
BR8807646A (pt) | 1990-06-26 |
MY101032A (en) | 1991-06-29 |
DE3852311D1 (de) | 1995-01-12 |
IL87288A0 (en) | 1989-01-31 |
WO1989001225A1 (en) | 1989-02-09 |
EP0372000A1 (en) | 1990-06-13 |
CA1318983C (en) | 1993-06-08 |
FI900533A0 (fi) | 1990-02-02 |
IL87288A (en) | 1993-05-13 |
ATE114659T1 (de) | 1994-12-15 |
US4759874A (en) | 1988-07-26 |
EP0372000A4 (en) | 1990-09-05 |
EP0372000B1 (en) | 1994-11-30 |
JPH03500707A (ja) | 1991-02-14 |
DE3852311T2 (de) | 1995-04-06 |
DK28590A (da) | 1990-02-02 |
KR970004547B1 (ko) | 1997-03-29 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
NORF | Unpaid initial registration fee |