KR890700429A - 편향 연삭 어셈블리 - Google Patents

편향 연삭 어셈블리

Info

Publication number
KR890700429A
KR890700429A KR1019880701422A KR880701422A KR890700429A KR 890700429 A KR890700429 A KR 890700429A KR 1019880701422 A KR1019880701422 A KR 1019880701422A KR 880701422 A KR880701422 A KR 880701422A KR 890700429 A KR890700429 A KR 890700429A
Authority
KR
South Korea
Prior art keywords
grinding assembly
deflection
deflection grinding
assembly
grinding
Prior art date
Application number
KR1019880701422A
Other languages
English (en)
Other versions
KR930004542B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR890700429A publication Critical patent/KR890700429A/ko
Application granted granted Critical
Publication of KR930004542B1 publication Critical patent/KR930004542B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1019880701422A 1987-03-09 1987-12-24 편향연삭 어셈블리 KR930004542B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/023,821 US4748773A (en) 1985-09-03 1987-03-09 Biased grinding assembly
US23,821 1987-03-09
PCT/US1987/003421 WO1988006952A1 (en) 1987-03-09 1987-12-24 Biased grinding assembly

Publications (2)

Publication Number Publication Date
KR890700429A true KR890700429A (ko) 1989-04-24
KR930004542B1 KR930004542B1 (ko) 1993-06-01

Family

ID=21817392

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880701422A KR930004542B1 (ko) 1987-03-09 1987-12-24 편향연삭 어셈블리

Country Status (6)

Country Link
US (1) US4748773A (ko)
EP (1) EP0304472A4 (ko)
JP (1) JPH0649269B2 (ko)
KR (1) KR930004542B1 (ko)
CA (1) CA1300889C (ko)
WO (1) WO1988006952A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE459484B (sv) * 1987-08-10 1989-07-10 Tore Hesselgren Registrering av haalcentrum vid snittning av moensterkort
US4858479A (en) * 1987-12-21 1989-08-22 Struers A/S Methods and means for use in examining the quality of plated-through holes in circuit boards
US4895033A (en) * 1987-12-21 1990-01-23 Voss Jorgen T Sample holder for use in the grinding or polishing of samples
JP2613981B2 (ja) * 1991-03-11 1997-05-28 富山日本電気株式会社 プリント配線板の検査方法
KR100392320B1 (ko) * 1996-06-24 2003-11-17 삼성전자주식회사 금도금 단자부 세척장치
EP3982132A1 (en) * 2020-10-12 2022-04-13 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Coupon for testing quality of related component carriers by automated quality test apparatus
CN113079642B (zh) * 2021-03-10 2022-06-17 奥士康科技股份有限公司 一种消除厚铜板pth半孔毛刺的制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5224404B1 (ko) * 1971-04-29 1977-07-01
JPS5229607B2 (ko) * 1972-01-01 1977-08-03
DE2812976C2 (de) * 1978-03-23 1980-03-06 Erich Ing.(Grad.) 3003 Ronnenberg Luther Verfahren zur Feststellung des Versatzes zwischen Leiterbahnen und Kontaktlöchern bei einer Leiterplatte sowie eine Leiterplatte zur Verwendung in diesem Verfahren
US4511942A (en) * 1982-05-07 1985-04-16 Computer & Communications Technology Corp. Automatic throat height control for film heads
US4477968A (en) * 1982-09-30 1984-10-23 Magnetic Peripherals Inc. Method for using a machining sensor
JPS60108267A (ja) * 1983-11-17 1985-06-13 Sanyo Electric Co Ltd 薄膜磁気ヘツドの研摩装置
US4648211A (en) * 1985-09-03 1987-03-10 The Charles Stark Draper Laboratory, Inc. Grinding guide and method for controlling the automatic grinding of objects

Also Published As

Publication number Publication date
CA1300889C (en) 1992-05-19
EP0304472A1 (en) 1989-03-01
JPH0649269B2 (ja) 1994-06-29
US4748773A (en) 1988-06-07
KR930004542B1 (ko) 1993-06-01
WO1988006952A1 (en) 1988-09-22
JPH01500255A (ja) 1989-02-02
EP0304472A4 (en) 1991-12-18

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee