KR890016117A - 열경화성 수지 조성물 및 전기용 적층판 - Google Patents

열경화성 수지 조성물 및 전기용 적층판 Download PDF

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KR890016117A
KR890016117A KR1019890004475A KR890004475A KR890016117A KR 890016117 A KR890016117 A KR 890016117A KR 1019890004475 A KR1019890004475 A KR 1019890004475A KR 890004475 A KR890004475 A KR 890004475A KR 890016117 A KR890016117 A KR 890016117A
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thermosetting resin
resin composition
composition according
acid
weight
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KR1019890004475A
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KR920009536B1 (ko
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아끼노리 하나와
미쓰오 요꼬다
아끼라 시미즈
가즈유끼 다나까
유끼히꼬 야마시따
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요꼬야마 료오지
히다찌가세이고오교가부시끼가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C08F290/126—Polymers of unsaturated carboxylic acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/026—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from the reaction products of polyepoxides and unsaturated monocarboxylic acids, their anhydrides, halogenides or esters with low molecular weight
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

열경화성 수지 조성물 및 전기용 적층판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (16)

  1. 브롬-함유 에폭시수지를, 탄소 원자 4이상인 이기염산과 반응시키고 아크릴산 또는 메타크릴산과 더 반응시켜 수득된 (A) 이염기산 변성된 에폭시(메트)아크릴레이트 수지, 수지(A)와 공중합할 수 있는 불포화기를 측쇄에 갖고 있는 (B) 열경화성 수지, 및 (C) 중합할 수 있는 단량체를 함유하는 열경화성 수지 조성물.
  2. 제 1 항에 있어서, 브롬-함유 에폭시 수지가 브롬화 에폭시 수지인 열경화성 수지 조성물.
  3. 제 1 항에 있어서, 브롬-함유 에폭시 수지가 (a) 브롬화 에폭시 수지 및 (b) 비브롬화 에폭시 수지의 혼합물로서, 적어도 25중량%의 브롬화 에폭시 수지(a)를 함유하는 혼합물인 열경화성 수지 조성물.
  4. 제 2 항 또는 제 3 항에 있어서, 브롬화 애폭시 수지(a)가 비스페놀 A형 에폭시 수지인 열경화성 수지 조성물.
  5. 제 4 항에 있어서, 브롬화 에폭시 수지(a)의 브롬 함량이 15 내지 55중량%인 열경화성 수지 조성물.
  6. 제 1 항에 있어서, 이기염산이 불포화 지방산을 중합시켜 수득되는 중합체성 지방산인 열경화성 수지 조성물.
  7. 제 6 항에 있어서, 불포화 지방산을 중합시켜 수득되는 중합체성 지방산인 열경화성 수지 조성물.
  8. 제 1 항에 있어서, 브롬-함유 에폭시 수지 1당량에 대해 이염기산 0.1 내지 0.9당량 및 아크릴산 또는 메타크릴산0.1 내지 0.9당량을 사용하고, 이염기산 및 아크릴산 또는 메타크릴산의 총 당량을 1당량 또는 그 이하로 하는 열경화성 수지 조성물.
  9. 제 1 항에 있어서, 수지(A)의 브롬함량이 12 내지 50중량%인 열경화성 수지 조성물.
  10. 제 1 항에 있어서, 열경화성 수지(B)의 주쇄가 아크릴기 공중합체인 열경화성 수지 조성물.
  11. 제10항에 있어서, 말레산무수물을 스티렌/2-히드록시에틸 메타크릴레이트/부틸 아크릴레이트 공중합체에서 첨가반응시킴으로써 열경화성 수지(B)를 수득하는 열경화성 수지 조성물.
  12. 제10항에 있어서, 아크릴산 또는 메타크릴산을 에틸 아크릴레이트/부틸 아크릴레이크/글리시딜 메타크릴레이트 공중합체에 첨가 반응시킴으로써 열경화성 수지(B)를 수득하는 열경화성 수지 조성물.
  13. 제 1 항에 있어서, 중합가능할 수 있는 단량체(C)가 한분자내에 적어도 1개의 불포화 결합을 갖으며 실온에서 액상인 열경화성 수지 조성물.
  14. 제13항에 있어서, 중합가능할 수 이쓴 단량체(C)가 스티렌인 열경화성 수지 조성물.
  15. 제 1 항에 있어서 열경화성 수지 조성물이 수지(A) 100중량부, 열경화성 수지(B) 5 내지 400중량부및 중합할 수 있는 단량체(C) 25내지 400중량부를 함유하며, 열경화성 수지 조성물의 브롬 함량이 8 내지 30중량%인 열경화성 수지 조성물.
  16. 기재를 제 1 항의 열경화성 수지 조성물로 함침시킨 후 경화하여 제조되는 전기용 적층판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004475A 1988-04-04 1989-04-04 열경화성 수지 조성물로 제조된 전기용 적층판 KR920009536B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP82574 1988-04-04
JP63-82574 1988-04-04
JP8257488 1988-04-04

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KR890016117A true KR890016117A (ko) 1989-11-28
KR920009536B1 KR920009536B1 (ko) 1992-10-19

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KR (1) KR920009536B1 (ko)
AT (1) ATE134686T1 (ko)
DE (1) DE68925745T2 (ko)

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WO1996008525A1 (fr) * 1994-09-14 1996-03-21 Nippon Shokubai Co., Ltd. Procede de production de resine photosensible et composition liquide de resine photosensible

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524901A (en) * 1968-01-22 1970-08-18 Dow Chemical Co Flame retardant vinyl esters containing acrylic or methacrylic phosphate esters
JPS5966476A (ja) * 1982-10-08 1984-04-14 Toshiba Chem Corp フレキシブル印刷配線板用接着剤組成物
JPS6084350A (ja) * 1983-10-14 1985-05-13 Matsushita Electric Works Ltd 樹脂組成物

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ATE134686T1 (de) 1996-03-15
EP0336266A3 (en) 1991-08-07
DE68925745D1 (de) 1996-04-04
EP0336266B1 (en) 1996-02-28
KR920009536B1 (ko) 1992-10-19
DE68925745T2 (de) 1996-10-02
EP0336266A2 (en) 1989-10-11

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