KR890015380A - 전자부품, 전자부품용 봉지제 및 봉지방법 - Google Patents

전자부품, 전자부품용 봉지제 및 봉지방법 Download PDF

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Publication number
KR890015380A
KR890015380A KR1019890004219A KR890004219A KR890015380A KR 890015380 A KR890015380 A KR 890015380A KR 1019890004219 A KR1019890004219 A KR 1019890004219A KR 890004219 A KR890004219 A KR 890004219A KR 890015380 A KR890015380 A KR 890015380A
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KR
South Korea
Prior art keywords
encapsulant
mold
electronic
electronic component
except
Prior art date
Application number
KR1019890004219A
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English (en)
Inventor
가꾸다로오 가우찌
도오루 도모시게
Original Assignee
다께바야시 쇼오고
미쓰이 세끼유 가가꾸 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 다께바야시 쇼오고, 미쓰이 세끼유 가가꾸 고오교오 가부시끼가이샤 filed Critical 다께바야시 쇼오고
Publication of KR890015380A publication Critical patent/KR890015380A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음

Description

전자부품, 전자부품용 봉지제 및 봉지방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 전자부품의 일실시예인 패키지의 단면도, 제 2 도는 본 발명의 전자부품의 다른 실시예인 패키지의 단면도.

Claims (6)

  1. 전자소자(발광소자 및 수광소자 제외)가 필수성분으로서 디알릴 화합물의 모노머 또는 올리고머의 단독 또는 그들의 혼합물(a)을 포함하는 중합가능한 액상조성물의 중합체로 봉지된 전자부품.
  2. 제 1 항에 있어서, 상기 액상조성물의 염소함량이 50ppm이하인 전자부품.
  3. 디알릴 화합물의 모노머 또는 올리고머의 단독 또는 그들의 혼합물을 포함하는 전자부품용 봉지제(A).
  4. 전자소자(발광소자 및 수광소자 제외)를 몰드내에 놓는 단계 : 제 2 항 기재의 봉지제(A)를 몰드내에 주입시키는 단계 : 상기 봉지제(A)를 중합시키는 단계로 구성되는 전자부품의 봉지방법.
  5. 전자소자(발광소자 및 수광소자 제외)를 몰드내에 놓는 단계 : 제 2 항 기재의 봉지제(A)를 몰드내에 주입시키는 단계 : 상기 봉지제(A)에 대해서 용해성이 낮고, 상기 봉지제(A)보다 밀도가 낮은 액상물(C)을 상기 봉지제(A)위에 존재시켜 상기 봉지제(A)를 경화시키는 단게로 구성되는 전자부품의 봉지방법.
  6. 전자소자(발광소자 및 수광소자 제외)를 몰드내에 놓는 단계 : 제 2 항 기재의 봉지제(A)를 몰드내에 주입시키는 단계 : 상기 봉지제(A)의 표면을 산소농도가 1%이하인 불활성 가스분위기와 접촉을 유지하면서 상기 봉지제(A)를 중합시키는 단계로 구성되는 전자부품의 봉지방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004219A 1988-03-31 1989-03-31 전자부품, 전자부품용 봉지제 및 봉지방법 KR890015380A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63078916A JPH02256261A (ja) 1988-03-31 1988-03-31 電子部品、電子部品用封止剤および封止方法
JP63-78916 1988-03-31

Publications (1)

Publication Number Publication Date
KR890015380A true KR890015380A (ko) 1989-10-30

Family

ID=13675173

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890004219A KR890015380A (ko) 1988-03-31 1989-03-31 전자부품, 전자부품용 봉지제 및 봉지방법

Country Status (4)

Country Link
JP (1) JPH02256261A (ko)
KR (1) KR890015380A (ko)
CN (1) CN1015584B (ko)
AU (1) AU619815B2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106634765A (zh) * 2016-12-16 2017-05-10 深圳市华星光电技术有限公司 黑色封口胶与lcd异形屏及其制作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3903027A (en) * 1974-05-13 1975-09-02 Cpc International Inc Diallyl isophthalate encapsulating compositions and process for preparing the same

Also Published As

Publication number Publication date
CN1038721A (zh) 1990-01-10
CN1015584B (zh) 1992-02-19
JPH02256261A (ja) 1990-10-17
AU3222289A (en) 1989-10-05
AU619815B2 (en) 1992-02-06

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