KR890013673A - Pressure Sensitive Adhesive Tape of Electrical Conduction - Google Patents

Pressure Sensitive Adhesive Tape of Electrical Conduction Download PDF

Info

Publication number
KR890013673A
KR890013673A KR1019890002193A KR890002193A KR890013673A KR 890013673 A KR890013673 A KR 890013673A KR 1019890002193 A KR1019890002193 A KR 1019890002193A KR 890002193 A KR890002193 A KR 890002193A KR 890013673 A KR890013673 A KR 890013673A
Authority
KR
South Korea
Prior art keywords
adhesive layer
electrically conductive
pattern
adhesive
exposed
Prior art date
Application number
KR1019890002193A
Other languages
Korean (ko)
Other versions
KR970008547B1 (en
Inventor
데이비드 캘혼 클리드
죤 플레밍 마우리스
델만 포스 죠지
루이스 렌스트롬 리챠드
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도날드 밀러 셀, 미네소타 마이닝 앤드 매뉴팩츄어링 컴패니 filed Critical 도날드 밀러 셀
Publication of KR890013673A publication Critical patent/KR890013673A/en
Application granted granted Critical
Publication of KR970008547B1 publication Critical patent/KR970008547B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/906—Roll or coil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1424—Halogen containing compound
    • Y10T428/1429—Fluorine
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/2438—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24413—Metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

내용 없음.No content.

Description

전기 전도의 압감성 접착 테이프Pressure Sensitive Adhesive Tape of Electrical Conduction

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 바람직한 전기 전도성 접착 테이프를 제공하기위해 전달 테이프의 접착층 위에 전기 전도성 입자를 인쇄하는 방법을 나타낸 도면이다.1 shows a method of printing electrically conductive particles on an adhesive layer of a transfer tape to provide a preferred electrically conductive adhesive tape of the present invention.

제2도는 로울로 감기 이전에 제1도의 테이프를 관통한 단편적인 확대 단면도이다.FIG. 2 is a fragmentary enlarged cross-sectional view through the tape of FIG. 1 prior to winding into a roll.

제3도는 전기적 접속이 접착적으로 이루어짐으로써 제1도의 테이프 일부분을 관통한 단편적인 확대 단면도이다.FIG. 3 is a fragmentary enlarged cross-sectional view through a portion of the tape of FIG. 1 as the electrical connection is adhesive.

제4도는 제1도에서 나타낸 압갑성 접착 테이프 노출면의 현미경 사진이다.4 is a micrograph of the pressure-sensitive adhesive tape exposed surface shown in FIG.

Claims (2)

전기전도성 입자가 구형이며, 크누우프(knoop)경도 값이 최소한 300인 코어 및 두께가 0.1-2㎛인 연질의 전기 전도면의 층을 가지며, 따라서 전기 전도 성분을 포함한 기판이 테이프의 일부와 함께 접착된 경우, 입자기 일반적인 손의 압력을 사용하여 상기 성분으로 침투 되도록 하는 개선점을 포함하는, 바람직하게는 25-150㎛의 거의 일정한 두께를 갖는 접착층, 특히 압감성 접착층을 수반한 받침(backing)을 함유하는 접착 테이프로서, 이것은 측면 간격의 예정된 패턴으로 각각 위치하여 접착제 두께와 동일하거나 약간 큰, 거의 일정한 직경의 전기 전도성 등축 입자이며, 따라서 그것의 두께를 통하여 전기 전도성 및 측면의 전기 절연성이 있는 접착층을 제조한 접착 테이프.The electroconductive particles are spherical, have a core with a knoop hardness value of at least 300 and a layer of soft electrical conducting surfaces of 0.1-2 μm in thickness, so that the substrate containing the electrically conductive component may When bonded together, backing with an adhesive layer, in particular a pressure sensitive adhesive layer, preferably having a substantially constant thickness of 25-150 μm, comprising an improvement that allows the particle to penetrate into the component using a general hand pressure. Adhesive tapes, which are electrically conductive equiaxed particles of approximately constant diameter, each of which is located at a predetermined pattern of lateral spacing, which is equal to or slightly larger than the thickness of the adhesive, and thus its electrical conductivity and Adhesive tape which produced the adhesive layer. a) 금속호일의 한면을 고무로, 그리고 다른 면을 광저항체로 피복학하고, b) 광 저항체를 예정된 패턴으로 빛에 노출시키고, c) 상기 패턴에 일치하는 광저항체의 부위를 제거하고, d) 금속 호일 부위를 제거하여 상기 패턴의 고무를 노출시키고, e) 전기 전도성 등축 입자를 노출된 고무 부위로 흡인하고, 및 f) 노출된 고무 부위와 동시에 노출된 접착층을 이동시키고, 상기 흡입된 입자들을 상기 패턴의 접착층으로 가압하는 단계들을 포함한, 노출된 접착층을 갖는 통상적인 접착 테이프를 상기 전기 전도성 층으로 변형시키는 방법.a) coating one side of the metal foil with rubber and the other side with photoresist, b) exposing the photoresist to light in a predetermined pattern, c) removing the portion of the photoresist that matches the pattern, d. A) removing the metal foil portion to expose the rubber of the pattern, e) sucking the electrically conductive equiaxed particles into the exposed rubber portion, and f) moving the exposed adhesive layer simultaneously with the exposed rubber portion, Depressing the conventional adhesive tape with the exposed adhesive layer into the electrically conductive layer, comprising pressing them into the adhesive layer of the pattern. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890002193A 1988-02-26 1989-02-24 Electrically conductive pressure sensitive adhesive tape KR970008547B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16077388A 1988-02-26 1988-02-26
US160773 1988-02-26
US160,773 1988-02-26

Publications (2)

Publication Number Publication Date
KR890013673A true KR890013673A (en) 1989-09-25
KR970008547B1 KR970008547B1 (en) 1997-05-27

Family

ID=22578381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890002193A KR970008547B1 (en) 1988-02-26 1989-02-24 Electrically conductive pressure sensitive adhesive tape

Country Status (9)

Country Link
US (2) US5300340A (en)
EP (1) EP0330452B1 (en)
JP (1) JPH02160311A (en)
KR (1) KR970008547B1 (en)
AU (1) AU612771B2 (en)
BR (1) BR8900822A (en)
CA (1) CA1317002C (en)
DE (1) DE68914867T2 (en)
ES (1) ES2053975T3 (en)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE67319B1 (en) * 1989-10-11 1996-03-20 Waterford Res & Dev Ltd Antistatic adhesive tape
US5141790A (en) * 1989-11-20 1992-08-25 Minnesota Mining And Manufacturing Company Repositionable pressure-sensitive adhesive tape
TW226406B (en) * 1991-04-12 1994-07-11 Minnesota Mining & Mfg
US5087494A (en) * 1991-04-12 1992-02-11 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
US5273805A (en) * 1991-08-05 1993-12-28 Minnesota Mining And Manufacturing Company Structured flexible carrier web with recess areas bearing a layer of silicone on predetermined surfaces
US5308667A (en) * 1992-10-16 1994-05-03 Minnesota Mining And Manufacturing Company Electrically conductive adhesive web
JP3415845B2 (en) * 1993-07-27 2003-06-09 シチズン時計株式会社 Electrical connection structure and electrical connection method thereof
US5366140A (en) * 1993-09-30 1994-11-22 Minnesota Mining And Manufacturing Company Patterned array of uniform metal microbeads
US6440880B2 (en) * 1993-10-29 2002-08-27 3M Innovative Properties Company Pressure-sensitive adhesives having microstructured surfaces
MX9504078A (en) * 1994-01-27 1997-06-28 Loctite Ireland Ltd Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors.
TW277152B (en) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
US5527591A (en) * 1994-12-02 1996-06-18 Augat Inc. Electrical contact having a particulate surface
US5685939A (en) * 1995-03-10 1997-11-11 Minnesota Mining And Manufacturing Company Process for making a Z-axis adhesive and establishing electrical interconnection therewith
US5801446A (en) * 1995-03-28 1998-09-01 Tessera, Inc. Microelectronic connections with solid core joining units
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
US5795636A (en) * 1995-11-15 1998-08-18 Minnesota Mining And Manufacturing Company Positionable and repositionable adhesive article
US5839188A (en) * 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
US6402876B1 (en) 1997-08-01 2002-06-11 Loctite (R&D) Ireland Method of forming a monolayer of particles, and products formed thereby
US5916641A (en) * 1996-08-01 1999-06-29 Loctite (Ireland) Limited Method of forming a monolayer of particles
US6977025B2 (en) 1996-08-01 2005-12-20 Loctite (R&D) Limited Method of forming a monolayer of particles having at least two different sizes, and products formed thereby
AU734452B2 (en) 1996-08-01 2001-06-14 Loctite (Ireland) Limited A method of forming a monolayer of particles, and products formed thereby
DE19642178A1 (en) * 1996-10-12 1998-04-16 Beiersdorf Ag Electrically conductive transfer tape
US5897930A (en) * 1996-12-31 1999-04-27 Minnesota Mining And Manufacturing Company Multiple embossed webs
US6197397B1 (en) * 1996-12-31 2001-03-06 3M Innovative Properties Company Adhesives having a microreplicated topography and methods of making and using same
JP3097619B2 (en) * 1997-10-02 2000-10-10 日本電気株式会社 Method of manufacturing field emission cold cathode
US6217981B1 (en) * 1997-10-13 2001-04-17 3M Innovative Properties Company Adhesive sheet and method for producing the same
US6096982A (en) * 1998-02-18 2000-08-01 Nanopierce Technologies, Inc. Method and apparatus for conductively joining components
GB9808221D0 (en) * 1998-04-17 1998-06-17 Sharp Kk Liquid crystal device manufacturing methods
US20010008169A1 (en) * 1998-06-30 2001-07-19 3M Innovative Properties Company Fine pitch anisotropic conductive adhesive
DE19853805B4 (en) 1998-11-21 2005-05-12 Tesa Ag Electrically conductive, thermoplastic and heat-activatable adhesive film and their use
US6524675B1 (en) * 1999-05-13 2003-02-25 3M Innovative Properties Company Adhesive-back articles
US6569494B1 (en) 2000-05-09 2003-05-27 3M Innovative Properties Company Method and apparatus for making particle-embedded webs
US20020119255A1 (en) 2000-05-09 2002-08-29 Ranjith Divigalpitiya Method and apparatus for making particle-embedded webs
AU3409702A (en) * 2000-10-24 2002-05-06 Nanopierce Technologies Inc Method and materials for printing particle-enhanced electrical contacts
CA2350853A1 (en) * 2001-06-15 2002-12-15 Groupe Minutia Inc. Method of establishing electrical conductivity between oxide-coated electrical conductors
US6926725B2 (en) * 2002-04-04 2005-08-09 Rex Medical, L.P. Thrombectomy device with multi-layered rotational wire
DE10259549A1 (en) * 2002-12-19 2004-07-08 Tesa Ag PSA article with at least one layer of an electrically conductive PSA and process for its production
US7034403B2 (en) * 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
US7309837B1 (en) * 2003-09-17 2007-12-18 Rauckman James B Wildlife guard for electrical power distribution and substation facilities
DE102004031189A1 (en) * 2004-06-28 2006-01-19 Tesa Ag Heat-activated and crosslinkable adhesive tape for the bonding of electronic components and printed conductors
KR20060018453A (en) * 2004-08-24 2006-03-02 삼성전자주식회사 Semiconductor device comprising heat sink
FR2880540B1 (en) * 2005-01-13 2008-07-11 Aventis Pharma Sa USE OF PURINE DERIVATIVES AS INHIBITORS OF HSP90 PROTEIN
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US7773337B2 (en) * 2006-02-10 2010-08-10 Seagate Technology Llc Tamper evident tape with integrated EMI shielding
JP2007299907A (en) * 2006-04-28 2007-11-15 Nitto Denko Corp Structure having property of conducting or absorbing electromagnetic wave
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
US20110214735A1 (en) * 2008-11-07 2011-09-08 3M Innovative Properities Company Conductive laminated assembly
DE102011075009B4 (en) 2011-04-29 2019-11-14 Continental Automotive Gmbh On a support arranged contact surface for connection to a arranged on a further carrier mating contact surface
US9061478B2 (en) 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
DE102011080729A1 (en) 2011-08-10 2013-02-14 Tesa Se Electrically conductive pressure-sensitive adhesive and pressure-sensitive adhesive tape
DE102011080724A1 (en) 2011-08-10 2013-02-14 Tesa Se Electrically conductive heat-activatable adhesive
US9102851B2 (en) * 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
AT511655B1 (en) * 2011-10-20 2013-02-15 Prelonic Technologies Gmbh METHOD FOR BONDING CIRCUIT ELEMENTS AND ADHESIVES
US9426878B2 (en) 2011-10-25 2016-08-23 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom
DE102012207462A1 (en) 2012-05-04 2013-11-07 Tesa Se Three-dimensional electrically conductive adhesive film
US9352539B2 (en) * 2013-03-12 2016-05-31 Trillion Science, Inc. Microcavity carrier with image enhancement for laser ablation
GB2521678A (en) * 2013-12-31 2015-07-01 Intelligent Energy Ltd Fuel cell flow plate
CN106413542A (en) * 2014-03-28 2017-02-15 得克萨斯系统大学评议会 Epidermal sensor system and process
US10492703B2 (en) 2014-03-28 2019-12-03 Board Of Regents, The University Of Texas System Epidermal sensor system and process
TWI686999B (en) 2014-10-28 2020-03-01 日商迪睿合股份有限公司 Anisotropic conductive film, its manufacturing method and connecting structure
JP6682804B2 (en) * 2014-10-28 2020-04-15 デクセリアルズ株式会社 Anisotropic conductive film
JP6682805B2 (en) * 2014-10-28 2020-04-15 デクセリアルズ株式会社 Anisotropic conductive film
US9595501B1 (en) * 2015-10-30 2017-03-14 Automated Assembly Corporation Wire bonded electronic devices to round wire
EP3436259A4 (en) 2016-03-30 2020-02-05 3M Innovative Properties Company Article featuring a predetermined pattern of randomly distributed microspheres and methods of making the same
JP7119288B2 (en) * 2016-05-05 2022-08-17 デクセリアルズ株式会社 filler placement film
WO2017191772A1 (en) 2016-05-05 2017-11-09 デクセリアルズ株式会社 Filler alignment film
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
GB2572649A (en) * 2018-04-06 2019-10-09 Illinois Tool Works Improved adhesive roll
CN110437762A (en) * 2019-07-17 2019-11-12 苏州微邦材料科技有限公司 A kind of pressure sensitive conductive adhesive tape and its application in photovoltaic cell fitting
WO2021124038A1 (en) * 2019-12-17 2021-06-24 3M Innovative Properties Company Transfer tape articles for preparing dry electrodes

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475213A (en) * 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3511178A (en) * 1967-01-06 1970-05-12 Minnesota Mining & Mfg Printing plate and method
US3514326A (en) * 1967-11-17 1970-05-26 Minnesota Mining & Mfg Tape
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4054714A (en) * 1976-06-07 1977-10-18 E. I. Du Pont De Nemours And Company Electrically conductive adhesive composition
JPS5724456Y2 (en) * 1977-09-09 1982-05-27
US4447492A (en) * 1977-11-21 1984-05-08 Occidental Chemical Corporation Articles having an electrically conductive surface
US4247594A (en) * 1979-04-30 1981-01-27 Marshall & Pike Enterprises Inc. Electrically conductive resinous composition
US4472480A (en) * 1982-07-02 1984-09-18 Minnesota Mining And Manufacturing Company Low surface energy liner of perfluoropolyether
US4568602A (en) * 1983-01-24 1986-02-04 Minnesota Mining And Manufacturing Company Sheet material adapted to provide long-lived stable adhesive-bonded electrical connections
US4606962A (en) * 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US4546037A (en) * 1984-09-04 1985-10-08 Minnesota Mining And Manufacturing Company Flexible tape having stripes of electrically conductive particles for making multiple connections
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
JPS63249393A (en) * 1987-04-03 1988-10-17 シャープ株式会社 Method of connecting electronic component
DE8708027U1 (en) * 1987-06-05 1987-09-10 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Electrical contact device
US5225966A (en) * 1991-07-24 1993-07-06 At&T Bell Laboratories Conductive adhesive film techniques

Also Published As

Publication number Publication date
JPH02160311A (en) 1990-06-20
DE68914867D1 (en) 1994-06-01
ES2053975T3 (en) 1994-08-01
AU612771B2 (en) 1991-07-18
EP0330452B1 (en) 1994-04-27
EP0330452A3 (en) 1991-12-27
US5300340A (en) 1994-04-05
DE68914867T2 (en) 1994-11-10
AU2866189A (en) 1989-08-31
CA1317002C (en) 1993-04-27
EP0330452A2 (en) 1989-08-30
KR970008547B1 (en) 1997-05-27
US5494730A (en) 1996-02-27
BR8900822A (en) 1989-10-17

Similar Documents

Publication Publication Date Title
KR890013673A (en) Pressure Sensitive Adhesive Tape of Electrical Conduction
KR900003326A (en) Conductive Adhesive Tape
KR940006425A (en) Transparent plane heater and its manufacturing method
EP1005086A3 (en) Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
EP0395443A3 (en) Circuit board and overlay
KR900004226A (en) Manufacturing method of flexible double-sided circuit board electrically connected in through hole
ATE118028T1 (en) ANTISTATIC ADHESIVE TAPE.
EP0170703A4 (en) Film-shaped connector and method of manufacturing the same.
DE68904667T2 (en) MANUFACTURING METHOD FOR A THICK LAYER TYPE RESISTOR.
KR880001182A (en) Pre-photosensitive circuit material
EP0232127A3 (en) Anisotropic electrically conductive film connector
EP0099227A3 (en) Electrosensitive transfer material
EP0200460A3 (en) A semiconductor laser device
EP0335425A3 (en) Composite facestocks
TW352450B (en) Semiconductor device with electrical connection between semiconductor chip and substrate less breakable during shrinkage of adhesive compound and process of assemblage thereof
JPS5659340A (en) Preparation of keyboard for electronic desk computer
EP0891127A3 (en) TAB circuit protective coating
MY103340A (en) Heat and humidity stable heat bondable connector tape
KR830002970A (en) Method of manufacturing a thin plate structure having a double layer
KR830004645A (en) Electroconductive laminate
EP0386918A3 (en) An electrical device
KR900019218A (en) Thick film elements
JPS5614384A (en) Coordinate input device
JP3161896B2 (en) Manufacturing method of metal base circuit board
JPS58184788A (en) Flexible circuit board

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee