JP3161896B2 - Manufacturing method of metal base circuit board - Google Patents
Manufacturing method of metal base circuit boardInfo
- Publication number
- JP3161896B2 JP3161896B2 JP32964893A JP32964893A JP3161896B2 JP 3161896 B2 JP3161896 B2 JP 3161896B2 JP 32964893 A JP32964893 A JP 32964893A JP 32964893 A JP32964893 A JP 32964893A JP 3161896 B2 JP3161896 B2 JP 3161896B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- metal base
- outer shape
- base material
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、バネ性金属層を有する
金属べ−ス回路基板の製造法に関するものである。The present invention relates to a metal base having a spring metal layer - a manufacturing method of the scan circuit board.
【０００２】[0002]
【従来技術とその問題点】この種の金属べ−ス材を有す
る従来の回路基板は、予め可撓性回路基板を別体に形成
した後、これを金属べ−ス材に貼着する手法が採用され
ている。2. Description of the Related Art A conventional circuit board having a metal base material of this kind is a method in which a flexible circuit board is formed separately in advance and then attached to the metal base material. Has been adopted.
【０００３】しかしこの方法では、バネ性金属層を有す
る回路基板に於いては、可撓性回路基板を十分に薄く形
成することができず、バネ性能を著しく損なうなどの問
題があった。However, this method has a problem that a flexible circuit board cannot be formed sufficiently thin in a circuit board having a springy metal layer, and the spring performance is significantly impaired.
【０００４】また、この方法では、高精度に位置決めす
ることができず、微細且つ高精度な金属べ−ス回路基板
を形成することができない等の問題もあった。In addition, this method has a problem that positioning cannot be performed with high accuracy, and a fine and high-precision metal-based circuit board cannot be formed.
【０００５】[0005]
【課題を解決するための手段】本発明は、バネ性金属を
有する回路基板に於いて、そのバネ性能を損なうことな
く微細且つ高精度に回路基板を構成できる金属べ−ス回
路基板及の製造法を提供するものである。SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing a metal-based circuit board and a circuit board having a resilient metal, wherein the circuit board can be finely and precisely formed without impairing the spring performance. It provides the law.
【０００６】[0006]
【０００７】その為に本発明では、金属べ−ス材の少な
くとも一方の面に回路基板の外形と同一形状のチタンの
薄膜層を形成し、次に、そのチタンの薄膜層の表面に回
路配線パタ−ンとの層間絶縁膜としての絶縁皮膜を回路
基板の外形より小さく形成し、次いで、アディティブ法
により上記絶縁皮膜上に所要の回路配線パタ−ンを形成
した後、この回路配線パタ−ンの表面に表面保護層を回
路基板の外形より小さく形成し、次に、上記チタンの薄
膜層を外形エッチングレジスト層として用いながら上記
金属べ−ス材をエッチングすることにより回路基板の外
形分離加工する工程を有する金属べ−ス回路基板の製造
法が提供される。For this purpose, in the present invention, a thin film layer of titanium having the same shape as the outer shape of the circuit board is formed on at least one surface of the metal base material, and then a circuit wiring is formed on the surface of the thin film layer of titanium. An insulating film as an interlayer insulating film with a pattern is formed to be smaller than the outer shape of the circuit board, and then a required circuit wiring pattern is formed on the insulating film by an additive method. The surface protection layer is formed smaller than the outer shape of the circuit board on the surface of the substrate, and then the outer shape of the circuit board is separated by etching the metal base material while using the titanium thin film layer as the outer shape etching resist layer. A method for manufacturing a metal-based circuit board having a process is provided.
【０００８】[0008]
【実施例】以下、図示の実施例を参照しながら本発明を
更に詳述する。図１は本発明の一実施例に従って構成さ
れた金属べ−ス回路基板の概念的断面構成図であって、
ステンレス等のバネ材からなる金属べ−ス材１の少なく
とも一方面にはポリイミド等の絶縁皮膜３を介して銅、
チタン又は金等からなる所要の回路配線パタ−ン５を備
え、この回路配線パタ−ン５の表面にはポリイミド等の
絶縁性皮膜によって表面保護層６が形成されており、ま
た、絶縁皮膜３が形成された側の金属べ−ス材１の表面
には回路基板の外形と同一形状のチタンの薄膜層２を具
備するように構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in further detail with reference to the illustrated embodiments. FIG. 1 is a conceptual cross-sectional view of a metal-based circuit board configured according to an embodiment of the present invention.
At least one surface of a metal base material 1 made of a spring material such as stainless steel is coated with copper, via an insulating film 3 such as polyimide.
A required circuit wiring pattern 5 made of titanium, gold, or the like is provided. A surface protection layer 6 is formed on the surface of the circuit wiring pattern 5 by an insulating film such as polyimide. On the surface of the metal base material 1 on the side where is formed, a thin film layer 2 of titanium having the same shape as the outer shape of the circuit board is provided.
【０００９】図２の（１）〜（３）及び図３の（４）〜
（６）はその為の製造工程図を示しており、先ず、図２
（１）のように、金属べ−ス材１の表面に回路基板の外
形と同一形状のチタン薄膜層２を形成し、次に、同図
（２）の如くこのチタン薄膜層２の上にポリイミド等の
絶縁皮膜３を回路基板の外形より小さく形成し、次いで
同図（３）のように、レジスト皮膜４を利用した通常の
アディティブ法によって絶縁皮膜３の上に銅、チタン又
は金等からなる所要の回路配線パタ−ン５を形成する。FIG. 2 (1)-(3) and FIG. 3 (4)-
(6) shows a manufacturing process diagram for that purpose.
As shown in (1), a titanium thin film layer 2 having the same shape as the outer shape of the circuit board is formed on the surface of the metal base material 1, and then, as shown in FIG. An insulating film 3 of polyimide or the like is formed to be smaller than the outer shape of the circuit board, and then, as shown in FIG. A required circuit wiring pattern 5 is formed.
【００１０】そこで、図３の（４）の如くレジスト皮膜
４を剥離し、次いで、同図（５）のようにポリイミド等
の絶縁性皮膜によって表面保護層６を回路基板の外形よ
り小さくなるように回路配線パタ−ン５の表面に形成す
ると共に、金属べ−ス材１が露出する底面にエッチング
レジストとして作用する裏面保護膜７を形成する。Then, the resist film 4 is peeled off as shown in FIG. 3 (4), and then the surface protective layer 6 is made smaller than the outer shape of the circuit board with an insulating film such as polyimide as shown in FIG. 3 (5). Then, a back surface protective film 7 acting as an etching resist is formed on the bottom surface where the metal base material 1 is exposed, while being formed on the surface of the circuit wiring pattern 5.
【００１１】更に、同図（６）の如く、チタンの薄膜層
２をエッチングレジスト層として用いながら金属べ−ス
材１の所定部分にエッチング処理を施すことによって所
要の回路基板の外形形状に分離加工すると、金属べ−ス
材が本来有するバネ性を損なうことのない微細で高精度
な回路基板を製作することができる。なお、裏面保護膜
７はそのまま残すか又は剥離してもよい。Further, as shown in FIG. 6 (6), a predetermined portion of the metal base material 1 is subjected to an etching process while using the titanium thin film layer 2 as an etching resist layer, thereby separating the outer shape of the required circuit board. When processed, a fine and high-precision circuit board can be manufactured without impairing the inherent spring properties of the metal base material. Note that the back surface protective film 7 may be left as it is or may be peeled off.
【００１２】また、金属べ−ス材１の表面に形成される
チタン薄膜層２は、これを金属べ−ス材１の両面に形成
することもでき、この場合には回路基板の外形を決定す
る為のエッチング加工の際、両面からエッチング処理す
ることにより更に加工精度を高めることができる。The titanium thin film layer 2 formed on the surface of the metal base material 1 can be formed on both sides of the metal base material 1, in which case the external shape of the circuit board is determined. In performing the etching process for performing the etching, the etching accuracy can be further improved by performing the etching process on both surfaces.
【００１３】[0013]
【発明の効果】本発明によれば、金属べ−ス材にバネ性
の金属部材を用いた場合でもそのバネ性能を損なうこと
なく、高精度な回路基板を提供できる。According to the present invention, a high-precision circuit board can be provided without impairing the spring performance even when a spring-like metal member is used as the metal base material.
【００１４】また、金属べ−ス材の外形を決定する為の
チタンの薄膜層とその上に形成される絶縁皮膜とは通常
のフォトリソグラフィ工程で位置合わせできるので、高
精度な外形加工が可能となり、更にチタンの薄膜層が絶
縁皮膜と金属べ−ス材の被着強度を高めるように作用す
るので、信頼性の高い回路基板を安定的に提供すること
ができる。Further, since the titanium thin film layer for determining the outer shape of the metal base material and the insulating film formed thereon can be aligned by the ordinary photolithography process, highly accurate outer shape processing is possible. Further, the thin film layer of titanium acts to increase the adhesion strength between the insulating film and the metal base material, so that a highly reliable circuit board can be stably provided.
【図１】 本発明の一実施例に従って構成された金属べ
−ス回路基板の概念的断面構成図。FIG. 1 is a conceptual cross-sectional configuration diagram of a metal-based circuit board configured according to one embodiment of the present invention.
【図２】 （１）〜（３）は本発明による製造工程図。FIGS. 2A to 2C are manufacturing process diagrams according to the present invention.
【図３】 （４）〜（６）は図２の（１）〜（３）に続
く製造工程図。FIGS. 3 (4) to (6) are manufacturing process diagrams following (1) to (3) in FIG. 2;
１ 金属べ−ス材 ２ チタン薄膜層 ３ 絶縁皮膜 ４ レジスト皮膜 ５ 回路配線パタ−ン ６ 表面保護層 ７ 裏面保護膜 DESCRIPTION OF SYMBOLS 1 Metal base material 2 Titanium thin film layer 3 Insulation film 4 Resist film 5 Circuit wiring pattern 6 Surface protection layer 7 Back surface protection film
───────────────────────────────────────────────────── フロントページの続き (72)発明者 松本 博文 茨城県稲敷郡茎崎町天宝喜757 日本メ クトロン株式 会社南茨城工場内 (72)発明者 田中 康行 茨城県稲敷郡茎崎町天宝喜757 日本メ クトロン株式 会社南茨城工場内 (56)参考文献 特開 昭62−214689（ＪＰ，Ａ) 特開 昭63−203329（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/05 B32B 15/08 H05K 3/44 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hirofumi Matsumoto 757 Tentakaki Kusazaki-cho, Inashiki-gun, Ibaraki Japan Nippon Mektron Co., Ltd. Minami-Ibaraki Plant (72) Inventor Yasuyuki Tanaka 757 Tentakaki Kusazaki-cho, Inashiki-gun, Ibaraki Japan (56) References JP-A-62-214689 (JP, A) JP-A-63-203329 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 1/05 B32B 15/08 H05K 3/44
Claims (1)
路基板の外形と同一形状のチタンの薄膜層を形成し、次
に、そのチタンの薄膜層の表面に回路配線パタ−ンとの
層間絶縁膜としての絶縁皮膜を回路基板の外形より小さ
く形成し、次いで、アディティブ法により上記絶縁皮膜
上に所要の回路配線パタ−ンを形成した後、この回路配
線パタ−ンの表面に表面保護層を回路基板の外形より小
さく形成し、次に、上記チタンの薄膜層を外形エッチン
グレジスト層として用いながら上記金属べ−ス材をエッ
チングすることにより回路基板の外形分離加工する工程
を有する金属べ−ス回路基板の製造法。1. A thin film layer of titanium having the same shape as the outer shape of a circuit board is formed on at least one surface of a metal base material, and then a circuit wiring pattern is formed on the surface of the thin film layer of titanium. An insulating film as an interlayer insulating film is formed to be smaller than the outer shape of the circuit board, and then a required circuit wiring pattern is formed on the insulating film by an additive method, and then the surface of the circuit wiring pattern is protected. Forming a layer smaller than the outer shape of the circuit board, and then performing a process of separating the outer shape of the circuit board by etching the metal base material while using the titanium thin film layer as an outer shape etching resist layer. -A method of manufacturing a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32964893A JP3161896B2 (en) | 1993-12-01 | 1993-12-01 | Manufacturing method of metal base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32964893A JP3161896B2 (en) | 1993-12-01 | 1993-12-01 | Manufacturing method of metal base circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07162117A JPH07162117A (en) | 1995-06-23 |
| JP3161896B2 true JP3161896B2 (en) | 2001-04-25 |
Family
ID=18223697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32964893A Expired - Fee Related JP3161896B2 (en) | 1993-12-01 | 1993-12-01 | Manufacturing method of metal base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3161896B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4939476B2 (en) * | 2007-07-09 | 2012-05-23 | 日東電工株式会社 | Method for manufacturing suspension board with circuit |
-
1993
- 1993-12-01 JP JP32964893A patent/JP3161896B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07162117A (en) | 1995-06-23 |
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