DE8708027U1 - - Google Patents

Info

Publication number
DE8708027U1
DE8708027U1 DE8708027U DE8708027U DE8708027U1 DE 8708027 U1 DE8708027 U1 DE 8708027U1 DE 8708027 U DE8708027 U DE 8708027U DE 8708027 U DE8708027 U DE 8708027U DE 8708027 U1 DE8708027 U1 DE 8708027U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8708027U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Preh GmbH
Original Assignee
Preh GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Priority to DE8708027U priority Critical patent/DE8708027U1/de
Publication of DE8708027U1 publication Critical patent/DE8708027U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
DE8708027U 1987-06-05 1987-06-05 Expired DE8708027U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8708027U DE8708027U1 (en) 1987-06-05 1987-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8708027U DE8708027U1 (en) 1987-06-05 1987-06-05

Publications (1)

Publication Number Publication Date
DE8708027U1 true DE8708027U1 (en) 1987-09-10

Family

ID=6808868

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8708027U Expired DE8708027U1 (en) 1987-06-05 1987-06-05

Country Status (1)

Country Link
DE (1) DE8708027U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0330452A2 (en) * 1988-02-26 1989-08-30 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
EP0562569A2 (en) * 1992-03-25 1993-09-29 Molex Incorporated Anisotropic adhesive for fixing an electronic component to a printed circuit module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0330452A2 (en) * 1988-02-26 1989-08-30 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
EP0330452A3 (en) * 1988-02-26 1991-12-27 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
US5300340A (en) * 1988-02-26 1994-04-05 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
US5494730A (en) * 1988-02-26 1996-02-27 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
EP0562569A2 (en) * 1992-03-25 1993-09-29 Molex Incorporated Anisotropic adhesive for fixing an electronic component to a printed circuit module
EP0562569A3 (en) * 1992-03-25 1993-11-10 Molex Inc Anisotropic adhesive for fixing an electronic component to a printed circuit module

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