CN106413542A - Epidermal sensor system and process - Google Patents
Epidermal sensor system and process Download PDFInfo
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- CN106413542A CN106413542A CN201580028107.XA CN201580028107A CN106413542A CN 106413542 A CN106413542 A CN 106413542A CN 201580028107 A CN201580028107 A CN 201580028107A CN 106413542 A CN106413542 A CN 106413542A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/05—Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves
- A61B5/053—Measuring electrical impedance or conductance of a portion of the body
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/0002—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/251—Means for maintaining electrode contact with the body
- A61B5/257—Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes
- A61B5/259—Means for maintaining electrode contact with the body using adhesive means, e.g. adhesive pads or tapes using conductive adhesive means, e.g. gels
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/25—Bioelectric electrodes therefor
- A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
- A61B5/296—Bioelectric electrodes therefor specially adapted for particular uses for electromyography [EMG]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/683—Means for maintaining contact with the body
- A61B5/6832—Means for maintaining contact with the body using adhesives
- A61B5/6833—Adhesive patches
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/04—Constructional details of apparatus
- A61B2560/0406—Constructional details of apparatus specially shaped apparatus housings
- A61B2560/0412—Low-profile patch shaped housings
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
- A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
- A61B2562/164—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted in or on a conformable substrate or carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
Abstract
Epidermal electronics are sensors with mechanical properties matching human epidermis. Their manufacturing process includes photolithography and dry and wet etching within clean room facilities. The high cost of manpower, materials, photo masks, and facilities greatly hinders the commercialization potential of disposable epidermal electronics. In contrast, an embodiment of the invention includes a low cost, high throughput, bench top "cut and paste" method to complete the freeform manufacture of epidermal sensor system (ESS) in minutes. This versatile method works for many types of thin metal and polymeric sheets and is compatible with many tattoo adhesives or medical tapes. The resultant ESS is highly multimaterial and multifunctional and may measure ECG, EMG, skin temperature, skin hydration, as well as respiratory rate. Also, a stretchable planar coil made of serpentine ribbons can be used as a wireless strain gauge and/or a near field communication (NFC) antenna. Other embodiments are described herein.
Description
Financial support
The present invention is in the government according to grant number CMMI1301335 and CMMI1351875 being authorized by National Science Foundation
Make under support.Government has some power of the present invention.
Priority request
This application claims the priority of the U.S. Provisional Patent Application Serial No. 61/971,945 of on March 28th, 2014 submission, should
The content of U.S. Provisional Patent Application is incorporated herein by.
Technical field
Embodiments of the invention are in the field of flexible and extensile sensor.
Background technology
Animal body radiates with regard to the data of itself.Can be from body(For example, animals or humans)The wearing of transmission information
The equipment of wearing has the ability changing two prominent fields:Mobile health(mHealth)And man-machine interface(HMI).Except body-building is followed the tracks of
Outside, the long-term follow of physiological signal contributes to detecting heart failure, epilepsy and other situations.However, the electronics based on chip
Device keeps substantially plane, rigid and frangible.As a result, state of the art based on integrated circuit(IC)Wear
The equipment of wearing has " chip on band " or the form factor of " fragment of brick on belt ", and it can not maintain and bend, soft and dynamic people
Class body closely with contact to retrieve long-term, Hi-Fi physiological signal for a long time.
Latest developments in flexible and extensile electronic device have been provided for for electronic device and biosystem
The feasible solution being closely integrated.In addition to many breakthrough,(One or more)Epidermis electronic system represents its engineering properties
The wearable device mating with the engineering properties of human skin.As a result, epidermis electronic system can be tatooed as interim transfer
Comply with human skin like that and be deformed without departing from as the natural stretching, extension of skin or rupture.Epidermis electronic system is permissible
Monitoring electricity physiological signal, skin temperature, skin hydration, perspiration and ataxia.
Brief description
The feature and advantage of embodiments of the invention will from appended claims, following detailed description of one or more show
Example embodiment and respective drawings become obvious.In the case of being considered as suitably, repeated reference mark among each accompanying drawing
To indicate corresponding or similar element.
Fig. 1(a)-(h)Depict the process in embodiments of the invention.
Fig. 2(a)-(b)Depict the sensor in embodiments of the invention.
Fig. 3(a)-(f)Solve the strain in various embodiments of the present invention.
Fig. 4(a)-(l)Image including various embodiments of the present invention.
Fig. 5(a)-(g)Including in embodiments of the invention with regard to the image of deformeter and antenna.
Fig. 6(a)-(h)Including image and the analysis with regard to respiration rate sensor in embodiments of the invention.
Fig. 7 includes the system for using for various embodiments of the present invention.
Fig. 8 depicts the processing stage in embodiments of the invention.
Fig. 9 include in embodiments of the invention for forming epidermis sensing system(ESS)Process.
Figure 10 includes the process for forming ESS in embodiments of the invention.
Specific embodiment
Now with reference to accompanying drawing, wherein identical structure can be provided with identical suffix reference instruction.In order to clearly
The structure of various embodiments is shown, the accompanying drawing including herein is the graphic representation of sensor/circuit structure.Thus, for example exist
The actual look of the obtained integrated circuit structure in microphoto is it may appear that difference, and is still incorporated to illustrated simultaneously
Embodiment structure required for protection.Additionally, accompanying drawing may only illustrate the knot useful for understanding shown embodiment
Structure.Additional structure as known in the art may not yet be included to maintain the clearness of accompanying drawing.For example, may not illustrate that semiconductor sets
Each standby layer.The instruction such as " embodiment ", " various embodiment " so description(One or more)Embodiment can include
Special characteristic, structure or characteristic, but not each embodiment necessarily includes this special characteristic, structure or characteristic.One
A little embodiments can have for some in the feature described by other embodiment, all, or not for other enforcements
Feature described by example." first ", " second ", " the 3rd " etc. describe the same object that shared object and indicating just is being mentioned
Different instances.Such adjective do not imply that such description object must in time, spatially, ranking aspect or appoint
What other modes is according to given order." connection " can be with indicator elment physically or electrically gas contact directly with one another, and " coupling " can
Cooperated or interactd with indicator elment, but they can or can not directly physically or electrically gas contact.
The carefully thin property of conventional epidermis electronic system and flexibility cause collapsing of equipment at them after human skin stripping
Collapse and wrinkling, so that its ideal is using of short duration.As a result, the success of epidermis electronic system technology depends on the low one-tenth of equipment
Originally, the realization that high-throughput manufactures.However, the current manufacture of epidermis electronic equipment depends on standard micro manufacturing process, including rotation
Turn coating, photoetching, wet method or dry etching and trans-printing.Although verified its is effective, exist with so
Process be associated some restrictions.First, the high cost resistance being associated with toilet's facility, photomask and lithographic chemical article
Hindered epidermis sensor become enough low cost to become disposable.Secondly, high vacuum process can for thick metal deposit
Can be taking very much and unpractiaca.3rd, epidermis electronic system size-constrained in wafer size, it must be true with all
Plenum chamber is compatible.4th it is desirable to the manufacture process of manpower significantly limit epidermis electronic system for academic research up to
Property.
Comparatively speaking, embodiment provides for creating " epidermis sensing system "(ESS)" cutting and paste " method,
It provides the very simple solution for above-mentioned challenge.Replace in execution high vacuum metal deposit, various thickness
On thin polymer, the metal laminated industry manufacturer that can directly carry from shielding buys.Replace in using lithographic patterning,
Mechanically carve out designed band shape using electronic table cutting machine with removing excess material(Or other shapes).
This is the manufacture process of free form, and it is contrary with popular increases material manufacturing technology.Because pattern can be directly formed at heat
Release band(TRT)On, thus in the case of there is no " pickup " step patterning band can directly be printed onto various types of
The tatooing on adhesive and medical belt of type(For example, such as when using dimethyl silicone polymer(PDMS)The marking is from substrate transferred silicon
During epidermis electronics-system components).In an embodiment, some cutting machines form up to 12 inches in thin sheet of metal and polymer
The long pattern of wide and some foot(And other such machines can dispose wider or longer material), that is out laboratory
The wafer size of rank(Thus increase output and reduces cost compared to the process based on photoetching).Whole process is permissible
In a few minutes(For example, 10 minutes)Complete on inherent table top and do not use wet process(For example, wet etching), this gives to make
The technical staff of product quickly trains and generally readily has enough to meet the need very much(turnaround).
As described in this article shown in embodiment, manufacture many materials ESS using " cutting and stickup " technology.Gained
ESS has been applied successfully to measure electrocardiogram(ECG), electromyogram(EMG), electroencephalogram(EEG), skin temperature, skin hydration
And respiratory rate.In an embodiment, the extensible coil of the plane of thick aluminum strip also serves as wireless strain instrument and is integrated on ESS.
Deformeter acts also as antenna in certain embodiments(For example, NFC antenna).
Fig. 1(a)-(h)Depict the process in embodiments of the invention, including the signal of desk-top " cutting and stickup " process
Figure.Because the metallic film of polymer support is more extensible than the sheet metal of free support much, so embodiment is using polymerization
The sheet metal that thing supports is as parent material.Parent material can be bought from industry retailer(Polyimides including gold coating
Or the PET of aluminium lamination pressure(PET)).Embodiment is deposited on 13 μm of transparent PET bands 101 using thermal evaporation
100nm golden film 102(Fig. 1(a), the element 905 of Fig. 9).
In order to manufacture based on golden extensible electro physiology(EP)Electrode, temperature sensor and concentric points ring impedance transducer,
The PET sheet of gold coating is equably attached to hot release band, wherein golden side to TRT adhesive side 103, such as Fig. 1(b)Shown in
(Element 910 referring further to Fig. 9).The opposite side 104 of TRT bonds or is placed on cutting pad, such as Fig. 1(c)Shown in(Referring further to
The element 910 of Fig. 9).
As Fig. 1(b)(e)(f)Seen in, pet layer 101, Au layer 102, TRT adhesive phase 103 and TRT layer 104 are entirely
Fed by other carrier instruments known in roller 113,114,131,132,133,134 or manufacture field(From right to left
Or vice versa as the same)The material of length length part.This is less may be used for hard silicon wafer, lithography tool, toilet etc.
Can.
In Fig. 1(c)In, cutting pad 116 is fed to electronic cutter device(For example, Silhouett CAMEO,
Silhouette America, Inc., West Orem, Utah, USA), wherein PET side 101 faces upwardly toward cutting tool
115(The element 915 of Fig. 9).Although cutting tool can be blade or sharp objects in certain embodiments, it can be
It is laser instrument or other cutting tools in other embodiment.By will be by business software(For example, AutoCAD design)Generate
Design imports in cutting machine, and cutting machine automatically utilizes self-defined patterning otch 121,122,123,124 engraving Au/
PET sheet 101,102 is to produce desired pattern 125,126(Fig. 1(c)Element 920 with Fig. 9).Cutting machine be fully able to
200 μm of resolution ratio(Although other embodiment can have finer or bigger resolution ratio)With acceptable feature uniformity and
Roughness and generate feature.
Once forming pattern 125,126, the just cutting pad on heating element heater 117 at 115 DEG C by TRT(Fig. 1(d)
Remove and reach 1 ~ 2 minute(Element 925 referring to Fig. 9).In other embodiments, heating element heater may be coupled to cutting tool, institute
With compound do not need from cutting tool remove in case make TRT adhesive component invalid.TRT is made to carry to the exposure of heating element heater
On adhesive 103 invalid so that excessive portion 127,128,129 can be from TRT(Fig. 1(d)Element 930 with Fig. 9)Remove,
Thus only stay loosely resting in TRT(Fig. 1(e))On equipment pattern 125,126.Can manually released part 127,
128th, 129 and remove them.In other embodiments, they can be moved using vacuum/pressurized gradient cup 118,119,120
Remove.In other embodiments, they can use the patterned adhesives being aligned with material to be removed to remove.
Using natural glue, equipment pattern will be printed onto in target substrate, such as skin tape 141 or adhesive of tatooing
(For example, Silhouette temporary tatt paper), medical belt transparent dressing(For example, 3M TegadermTM)Or 3M type removes silicon
Band(Fig. 1(e)Element 935 with Fig. 9), thus producing based on golden ESS(Fig. 1(f)), it is coated with liner 142 until preparing
It is used on use(Element 940 with reference to Fig. 9).
Once printing and adding the cushions, just by ESS(Together with Fig. 1(a)-(f)Printed before and after the ESS of middle focusing
Other ESS of brush)It is stored in roller 143(Fig. 1(g))In.In other words, Fig. 1(a)-(f)In process repeated in assembly line mode,
Thus create and easily storing, transporting and carrying from the long of disposable ESS of the deployment such as roller 143 or pleated sheet.Each ESS then can
To remove at perforation 111,112(Referring to Fig. 1(h)Element 945 with Fig. 9).Fig. 1(h)Including from the band of ESS or the portion of roller
Point, this ESS includes the perforated portion 111,112 around the ESS comprising sensor 125,126.Additional ESS is located at and comprises to sense
On the either side of ESS of device 125,126.
In an embodiment, Fig. 1(a)-(f)In process repeat, but other thin slices using metal and polymer(Example
As, be formed at using Al rather than Au 102 on skin tape 141 and liner 142 formed pattern, such as aerial coil or should
Become instrument)All on final band, assume many materials, multi-parameter ESS.In other words, process can repeat to form ESS on each other
The layer of system or ESS can be interlaced with each other(Solve with regard to Fig. 8).
The design of multi-parameter ESS and skin are integrated
Fig. 2(a)-(b)Depict the sensor in embodiments of the invention, including being printed on the many materials tatooed on paper, join more
Number ESS(Silhouette).In Fig. 2(a)In, it is snakelike that ESS 200 includes three filamentous(FS)Golden 228, FS of EP electrode
Golden resistance temperature detector(RTD)225th, two point ring gold impedance transducers(226), it serves as hydration sensor device.ESS 200 is also
Including the plane FS coil based on Al band(227), in the face of skin tape 203, it serves as wireless strain instrument and also fills wherein Al
Work as NFC antenna.ESS 200 is extensile, such as in Fig. 2(b)Three pictures seen in.For three FS EP electrodes 228,
Interelectrode distance 281 is configured to 2cm for effective EP signal record.FS electrode 228 is with 1/5 bandwidth of arc radius
Degree is designed to equalize in extensibility and real estate(real estate)Between balance.Same design is not suitable for Al
Coil 227, because coil will consume too many space for ESS.
In an embodiment, design coil 227 by considering inductance, extensibility and overall dimension.The resonance of rlc circuit
Frequency(f)The inductance being determined by below equation depending on it and electric capacity:
Wherein L is inductance and C is electric capacity.Embodiment includes for the purpose being easier measurement and operates into the low of < 100MHz
Frequency coil.In certain embodiments, same low frequency coil is used as NFC coil.Equation(1)Show that coil should have high inductance
And/or electric capacity is to have relatively low resonant frequency in an embodiment.
The electric capacity of plane-parallel capacitor is given by the following:
WhereinRepresent the absolute dielectric constant of dielectric layer, A is the overlapping area of parallel-plate, and d is electricity Jie between plate
The thickness of matter layer.There is the upper limit of the feasible electric capacity for ESS, because the area of parallel-plate is for the system based on skin
Can not be too big, dielectric thickness can not be too little, and some embodiments do not include rigid chips capacitor.
Therefore, replace bulky capacitor, in certain embodiments using the coil with big inductance.It is desired to have mainly by electricity
The Another reason of the resonant frequency that sensor sets(In certain embodiments)It is, any change in strain produces in inductance
Big change.Thus, frequency shift (FS) is more sensitive for strain.Inductance depends on the layout of circuit.For planar circuit, electricity
Sense depends on the area that number, the shape of circle and the circuit of circle are covered.Usually, area is bigger and circle is more, inductance
Higher.However, this is had with following demand conflicting:Set up suitably little wireless strain instrument so that it can rightly fit in
On the great majority of body.Embodiment also has coil that is highly extensible and being obedient to so that skin will not mechanically be born by coil.
In the case of keeping in mind aforementioned coil characteristics and/or challenge, embodiment includes Fig. 2(a)In double-strand serpentine design
227.For example, chain 261,262 constitutes a double-strand, and chain 263,264 constitutes another double-strand, and chain 265,266 composition is another
Individual double-strand.This design contributes to maximizing limited praedial use to fill the circle of serpentine shaped as much as possible.Meanwhile,
It leaves reasonable clearance between serpentine portion, it is ensured that the extensibility of coil(Fig. 3(a)With(b), Fig. 5(c)).Implement
Example is included along ESS patch(patch)Outer circumferential coil 227, its coil is around sensor, such as ECG sensor.
The upper left corner of patch 200 is served as the different materials on identical band with two gold " elongate antenna " designs at the upper right corner
The alignment mark of the coherent printing of material(For example, referring to Fig. 8 and relevant discussion).In an embodiment, the overall dimension of device area
For 7.5cm x 5cm, its big by 6''x 8'' and 47 μ m-thick skin tape 203 is supported.
Used in ESS, the Young's modulus of different polymer is different.TegadermTMIt is in measured all polymer
Compliance.Its modulus(7.4MPa)Modulus close to human skin(0.32-4MPa)High-end.Test and model difference
Serpentine shaped and the extensibility of material.It is used for carrying out extensibility measurement with the dynamo-electric measurement result that original position is observed up and down.
When the function as the uniaxial tension tension force applied measures resistance, the institute that resistance significantly/" blast " increases at which
The strain of application is considered strain fracture or extensibility.Although straight Al_PET and Au_PET band represents very limited amount of
Extensibility(It is respectively 2.89% and 13.72%), but its snakelike peer-to-peer is more extensible(It is all beyond human skin
Elastic limit(30%)).Al serpentine pattern 227 ruptures at 68% strain, at this point it can be observed that at snakelike crest
Failpoint.Golden EP sensor 228 utilizes FS network design, and it ruptures at 115% strain, and wherein failpoint is in chain infall.
Golden RTD sensor 225 includes one-dimensional(1D)The snakelike band of FS, it shows that among sensor 225,227,228 existing maximum can be stretched
Malleability(199%), and find rupture place again at the crest of snakelike chain.Fracture position can be built by using finite element
Mould(FEM)Find maximum principal strain to predict.FEM model(Fig. 3(b)、(d)、(f))For the snakelike chain of three differences(Fig. 3(a)、
(c)、(e))And create.Although maximum strain occurs at the snakelike crest of 1D(Fig. 3(b)With(f)), but FS network is due to answering
Become and assemble and the infall most fragile in orthogonal snakelike band(Fig. 3(d)).
The interaction of the ESS on different skin band and human skin is different.Although TegadermTMIt is thin with paper of tatooing
, transparent and extraordinary image skin, but webbing(3MTMSpecies removes silicon ribbon)Thicker.Although however,
TegadermTMIt is disposable with paper of tatooing, but webbing is will not wrinkling and silicones after skin peeling
Adhesive allowed to be used for multiple times before losing adhesiveness.The snakelike thing of Au and Al is in various types of skin deformation(Stretching, pressure
Contracting, shear, stamp)Before and after resistance very consistent, wherein stretching " before " resistance and stretch " afterwards " resistance between
There's almost no change.Obviously, ESS can most possibly hold out through the skin deformation that skin can experience.
EP based on Au, skin temperature and skin hydration sensor
Embodiment including multi-parameter ESS has been applied successfully to execute in EP, skin temperature, skin hydration and respiratory rate
Real-time, continuous measurement.The embodiment of the sensor based on Au and Al is in Fig. 2(a)Shown in.EP on the surface of human skin
Signal is relevant with the flowing of the ion in biological tissue and organ, and reflects their function and health.For example, from mankind's brain
EEG measured by the surface in portion not only captures cognition and memory performance, but also reflects that brain is lacked of proper care, such as epilepsy and apoplexy.
The monitoring of walking about of the non-intrusion type of the ECG in human breast contributes to detecting irregular heartbeat(For example, arrhythmia cordis).In mankind's flesh
On meat, the EMG of measurement contributes to identifying neuromuscular disease and can function as the control for prosthesis apparatus or other machines
Signal.
There are three FS EP sensors being integrated on ESS patch(Jointly it is labeled as 228).One is served as elimination greatly
Difference between the reference of Earth noise, and two other sensor is EP signal.Gently swipe first with paper handkerchief
(abrase)Skin surface, to remove dead skin, is then cleaned with alcohol swab to remove any skin oil stain.Skin sensitization test it
Afterwards, applicant applies an ESS on left chest(Referring to Fig. 2(a)Embodiment)With two conventional Ag/AgCl electrodes.Simultaneously
The ECG waveform of measurement(Measured by connecting conventional Ag/AgCl gel electrode and ESS electrode)It is sent to EP recorder, quilt
Record, and processed using rolling average calculating and DC bias compensation.Usually identical from the heart rate of two measurement results
, wherein ESS actually can disclose the more tiny characteristic of ECG than Ag/AgCl gel electrode(For example, micro- on sensing chest
The more preferable ability of weak signal).
Muscle activity is reflected by EMG.Applicant is by identical ESS embodiment(Fig. 2(a))It is placed on forearm(Especially
Ground is on musculus flexor)To measure EMG.Record hand via ESS to hold with a firm grip two examples of action.Held by commercial dynamometer measurement
The intensity of power, wherein higher gripping force corresponds to the large magnitude in measured EMG.ESS provides reliable and accurate survey
Amount result.
Applicant passes through conventional Ag/AgCl electrode and ESS(Fig. 2(a))It is bonded in measure EEG on mankind's forearm, its
Middle reference FS electrode is after human ear.Conventional exist significantly unanimously and the EEG of ESS measurement between, and their FFT frequency
Spectrum is almost completely overlapped.And, eyes are opened and are all measured by ESS with the frequency spectrum of the EEG of eyes closed.Alpha rhythm
(10Hz peak value)Clearly manifest when clear-headed object closes its eye.
In addition to EP, skin temperature and skin hydration are also the useful designator of Human physiology.For example, skin temperature with
Cardiovascular health, cognitive state, malignant tumour etc. are associated.Skin hydration be widely used in dermatology and cosmetic operation with
For detecting disease(For example, eczema, atopic dermatitis etc.), assess nervous or hormonal readiness, and evaluation medical therapies
Or lift face measure.
Temperature fluctuation affects the collision of the electronics in metal, thus leading to the change in resistance.Resistance temperature detector
(RTD)225 in one embodiment by wavy snakelike golden film(Thickness 100nm)Make, it is schemed in affined region
Case.Due to serpentine shaped, the overall length of RTD is of about 0.3m.Applicant passes through to place on hot plate RTD 225 simultaneously
With both commercial thermocouples and the temperature that records the resistance of RTD and the reading of thermocouple and increase heating plate step by step to execute simultaneously
Calibration test.Result indicates the change of fraction of resistance with temperature linearly, and it is
WhereinIt is the temperature coefficient of resistance, T is the temperature increasing, and T0It is the original temperature before temperature increases to T
Degree, R is the initial resistance before temperature increases(That is, T0The R at place), andIt is to be brought by the change in temperature
Change in resistance.For RTD'sIt is 0.001690C-1, its with for golden resistance normal temperature coefficient(It is
0.00340C-1)Highly consistent.Next applicant by using epidermis RTD 225 together with the identical thermocouple for reference
Temperature survey is executed on mankind's forearm.In beginning, the temperature stabilization of skin at 30 degrees Celsius, and at the about the 100th second
At the 180th second, respectively ice bag is taken to skin(Install sensor is in this place)Around and then take away ice bag.Result indicates
Epidermis RTD 225 successfully indicates(And thermocouple)The change of temperature(That is, skin temperature reduces and skin when applying ice bag
Temperature is recovered when withdrawing ice bag).Additionally, epidermis RTD 225 will be obedient to much than thermocouple, it has the firm of polyimides encapsulation
Property sensor most advanced and sophisticated as detecting.
For skin hydration monitoring, by aforementioned cutting and taping process by hydration sensor device(H sensor)226 manufacture
On ESS.By using moisture meter(For example, MoistureMeterSC Compact, Delfin Co., Ltd)Measurement hydration
To operate sensor 226, this moisture meter is used for impedance transformation becomes the calibration curve of hydration level.In ESS patch 200
Hydration sensor device 225 continuously measures impedance, and is removed for by the reference hydration level measurement of moisture meter
(For example, in skin upper 3 second, and 2 points and 50 seconds between different situations).However, observing two kinds of inhomogeneities during testing
The noise pattern of type, " Contact Effect " and " perspiration effect ", and both noise patterns cause insecure result.It is still in
Correct measurement curve is realized after eliminating Contact Effect and the impact of perspiration effect.By body paint, knot are applied on skin
Fruit is shown in from 32 to 90 different hydration level as impedance measured by the hydration sensor device of the function of frequency.Due to impedance
Imaginary part reduction, impedance reduces with the increase of frequency.And, impedance reduces with the increase of hydration level, because
The dielectric constant of skin and conductance increase.
Further define at the different measuring frequency of 10kHz to 100kHz as hydration level function impedance.With
The increase of frequency, impedance reduces, because the imaginary part of impedance(Capacitance part)Reduce.Resistance between relatively 10kHz and 100kHz
The reduction of anti-value, has 87% and 85% respectively.This represents that sensitivity is higher than in 100kHz in 10kHz.More than being based on
Described, execute test at the fixed frequency of 10kHz, the increase with hydration level is shown, impedance magnitude reduces.
Applicant executes real-time skin hydration monitoring using the sensor 225 on ESS patch 200 in human body.For
Show the hydration level change in volunteer's object, execute " concentrated coffee scene ", wherein object is from initial measurement point to 240
Second keeps tranquil, and and then drinks tank concentrated coffee on the rocks.In zone of silence, hydration level somewhat increases to 83 from 69
And somewhat increase to 90 from 78, as passed through measured by sensor 225 and control instrument respectively.Comparatively speaking, hydration level exists
Notable lifting in ensuing 360 seconds(78 to 93 being measured by sensor 225, and arrive by control instrument measures 90
103).This is likely due to concentrated coffee and causes body to perspire and lifting hydration level.Enjoyably, hydration level is last
Gradually reduce in 240 seconds, this is the reason being cooled down due to body.During whole measurement period, measured by sensor 225
Converted impedance results illustrate the remarkable uniformity of the result corresponding to control instrument.
Wireless strain instrument based on AL coil
The deformation of skin is by the wireless and passive Al coil around sensor(227)To capture and can be wireless via electromagnetic field
Be transferred to reader(Referring to Fig. 5(a)).This passive Al coil can also be used as in some cases for EP, hydration and
The NFC antenna of temperature sensor, it guarantees the potential ability of the radio communication of ESS patch.The resonant frequency of LRC circuit depends on
Its inductance and electric capacity(Referring to equation(1)).Miniaturized capacitance device is low cost and is desirably integrated in little chip and holds
Change places in the most of circuit of insertion.However, because ESS structure needs for plane, flexible and thin, so adding discrete electric capacity
Device is related to connect more multicompartment, and it is likely to reduced robustness, increases cost and increases real estate footprint.Ask to solve this
Topic, embodiment has mainly by inductor(As discussed above)The resonant frequency setting, so any change in inductance
Produce the big change in frequency(Then it can change into change in temperature etc.).Inductance depends on the electricity in embodiment mostly
The layout on road(For example, Fig. 2(a)Element 227).As discussed above, the circle that the inductance of planar circuit is taken depending on chain
Number, the area that covered of the shape of circle and circuit.
In an embodiment, passive wireless sensor 220 includes Al in two-layer PET(Al-on-PET)Film, wherein ground floor shape
Become the great majority of serpentine configuration 225,226,227,228, and the second layer is formed at the feelings of its aluminum side to ground floor for PET side
The bridge 253 of ground floor is crossed under condition.Al-PET-Al structure at planchet 251,252 forms the parallel-plate electricity being connected in series
Container(In one embodiment, the electric capacity being calculated is 3.76 x 10-12F), and snakelike wire serves as inductor and resistance
Both devices, this leads to standard rlc circuit(Referring to Fig. 5(a)Bottom panel).Because inductance depends largely on sensor 227
In the number of the circle of chain, the area that covered of the shape of circle and circuit, so embodiment has envisioned, by stretching or pressing
Contracting or even bend sensor 227 and make the resonance frequency shift of circuit.
For example, in Fig. 5(a)In, reader coil 528 is connected to electric impedance analyzer via BNC-RCA adapter.Reader
Coil 528 is inductively coupled to sensor 527(Similar to coil 227), its serve as this as in the setting of transformer time
Level coil(That is, two coils are separated from one another reaches a certain distance).By measurement as the circuit being coupled of the function of frequency
Impedance response is obtaining the resonant frequency of sensor 527.Resonant frequency correspond to impedance response Phase-Frequency curve under
Heavy.In Fig. 5(b)In show test setting.
Before making any measurement on wireless senser 527, applicant measures the resonant frequency of reader 528.So
Afterwards, applicant executes the extension test of coil(Fig. 5(c)And Fig. 5(a)Centre panel), and record what each was applied
The resonant frequency of the reader at strain(Fig. 5(d)).Fig. 5(d)Show at 38.6MPa to 27% strain at 0% strain
The skew of the resonant frequency of the coil of 34.2MPa.Obviously, the ability reading resonant frequency at 27.0% strain demonstrates in itself
Sensor keeps the strain of complete up to 27%.Resonant frequency as the function of the strain applied is plotted as Fig. 5(e)
In lines 529, it illustrates and between resonant frequency and the strain applied, there is dull negative relation.Answered corresponding to each
The details of the resonant frequency of strain can find in the following table:
The strain applied | 0% | 6.8% | 13.5% | 20.3% | 27.0% |
RF(MPa) | 38.6 | 36.6 | 35.4 | 34.3 | 34.2 |
Change in RF(%) | 0 | -5.18 | -8.29 | -11.14 | -11.40 |
Explanation for the negative monotonic relationshi between resonant frequency and the strain applied(Proportional relation)It is antenna 527
Stretching increased the area of antenna, which increase inductance and thus decrease resonant frequency.The inductance of coil and coil institute
The square root of the area covering is approximately in proportion
Wherein l1And l2It is the yardstick in vertical and horizontal/horizontal direction for the most external circle of planar coil.
For stretching(WhereinIt is the Poisson's ratio of material):
Then:
Wherein there is subscriptCharacter representation stretching when characteristic and subscript " 0 " represent stretching before characteristic.
Equation(6)With(7)In " ~ " symbol represents " proportional ".
The inductance of the circuit in the chain of planar rectangular inductor theoretical prediction different application.In this theory, have straight
The geometry of the rectangular circuit of lines is used for iteratively calculating sub- inductance and mutual inductance, and final inductance be all from
Inductance(L0)And mutual inductance(M)Summation.
It is plotted in Fig. 5 by using the result that two theories are predicted(e)In(Referring to the lines corresponding to equation 7 and 8).
Notional result and experimental result represent the one of brilliance in prediction during the trend of the resonant frequency as the function of the strain applied
Cause property.
The effect to the distance between reader coil 528 and cell winding 527 for the test(Coupling factor k)And it shows
Go out the resonant frequency of coil 527 almost unrelated with the distance between coil but regardless of phase place how.Specifically, reader is away from coil
Nearer, phase place is bigger from 90 degree of deviations, 90 degree be only reader phase place(That is, in people, reader 528 is positioned to connect
Before nearly reader), thus Q factor is higher.
In Fig. 5(f)In, by passive and wireless coil pickoff 527 being placed on the outside of wrist and making with line
The wrist of circle executes deformation measurement on skin close to reader 528.Three laminated striation bodies are applied between coil pickoff and skin
Binder film is to strengthen bonding.Applicant executes three positions of hand, and it is " flat ", " stretching " and " compression ", such as Fig. 5
(f)Shown in.For " flat " position, object keeps its hand, so that hand and arm form straight lines.For " stretching "
Position, hand bends downward into extreme position, so that coil pickoff 527 is completely stretched.For " compression " stage, hand is upwards
Bend to extreme position, so that coil pickoff compresses completely.In Fig. 5(g)The middle knot drawing the resonant frequency in three positions
Really, this discloses some interesting phenomenons.First, when coil 527 is applied on skin, resonant frequency declines from 38.6Mpa
To 13.92MPa.This is due to the reason of the burden of skin.Second observation is that " stretching " reduces resonant frequency(From 13.92MPa
To 12.99MPa, change -6.69%), and " compression " somewhat increases resonant frequency(From 13.92MPa to 14.41MPa, change
3.53%).Different from extension test, it is due to the deformation of coil 527 and to reading that the resonant frequency during skin is tested changes
The result of the combination of the change of the relative position of device 528.The reason increase for the phase place of the resonant frequency of position " stretching " be
Because when hand bends away from reader, the coverage of reader to coil increases and longer distance leads to frequency to be swept
Retouch the shallower sinking in curve.By being repeated twice hand position sequence(" flat ", then " stretches ", then " compresses ")To enter
The repeatable test of row, it illustrates that early results are repeatable.
In an embodiment, the local signal of ECG sensor 228 wirelessly can be turned by passive Al coil 527 via coil 528
Move to remote server(With reference to Fig. 7, such as remote receiver), it diagnoses exceedingly useful for noncontact.In order to rightly turn
Move data, embodiment guarantees that resonant frequency will not significantly change during transfer process.Al coil 527 is placed on by applicant
On the chest of object, and object represent deep air-breathing and exhale and for deep air-breathing and exhale the two show that from
The resonant frequency of 13.06MPa to 12.80MPa changes(That is, change 1.99%)When obtain resonant frequency result.However, being used for inhaling
The curve that the curve ratio of gas is exhaled more seriously tilts, and this is due to the fact that:When object sucks, chest is towards reading
Device moves, but when object breathes out, chest moves away from reader.The non-sensitivity to air-breathing and expiration for the resonant frequency(Its
Can accumulate)Make it possible in antenna applications using coil.
Thus, coil 527 intentionally can represent offseting in resonant frequency under tension and can be used for one
Measurement stretching in a little applications(For example, limbs are bent, as in Fig. 5(f)Shown in as).However, be alternative in or except
As deformeter, 227 can also potentially be designed to wireless antenna to transmit data.For example, less warpage/stretched wherein
In the case of existing, serving as antenna is probably preferably.Such situation can the system 200 on chest be used for via sensor
228 record EP signals and and then occur via in the case of antenna/coil 227 this data of transmission.Although not in Fig. 2(a)
Shown in coupling between element 228 and 227, but such coupling can be performed by those of ordinary skill in the art.Institute
The data of transmission can use the system of the system of such as Fig. 7 etc to be processed.
Fig. 8 depicts the processing stage in embodiments of the invention.Fig. 8 assumes to be derived from Fig. 2(a)-(e)Process steps
Through occurring, thus producing the skin tape 141 being coupled to chain 125,126, but remove TRT layer 103,104.Fig. 8 is further
Assume to be derived from Fig. 2(a)-(e)Process steps have occurred and that second, but in this case, from Fig. 2(a)PET/Au
101st, 102 combinations replace with Al/PET element, and it has " stirring with regard to PET/Au orientation(flipped)”.As a result, Al
Chain 109,110 is contacted with band 141 now, and PET 101 carries 141 further away from each other.In fig. 8, TRT layer 103', 104'(Class
It is similar to from Fig. 1(a)Layer 103,104)Still contact chain 191,192.However, as Fig. 1(f)In situation like that, TRT layer
103', 104' will be removed and replace with liner 142, its then will directly or indirectly cover each chain 191,
192、125、126.Obviously, in an embodiment, aluminium element 109,110 have bigger than the height 194 for Au element 125,126
Height 193.In addition, chain 191,192 has the height 195 bigger than the height 196 for chain 125,126.
Thus, Fig. 8 discusses alternative embodiment, and two independent transfers thus occur(It is Au pattern and so first
After be Al pattern, or vice versa), wherein " long angle " pattern(Referring to Fig. 2(a))As alignment mark, so that can root
Realize the relative position between Au and Al pattern according to design.Different materials in single ESS using allow thick metal is used for
Antenna 227(And thin metal is used for other sensors, such as sensor 228).Thick metal provides contrast for sensor 228 grade
The thin lower resistance of chain.Relatively low resistance reduces aerial loss.Using Al, because for the quantity increasing required for thick chain
In, Au is probably high cost.
Although Fig. 8 implies " passing through twice " to include Al layer and Au layer, process can repeat still attached to add
Plus layer and/or material.And, the use herein for the term " layer " will not weaken the importance of following facts:In an embodiment,
Both Au with Al directly contact substrate, such as skin tape 141.It should be noted that the thickness for Al increases by increasing its height
Degree 193(Relative altitude 194)And obtain.The width 197 of Al chain is equal to the width 198 of Au chain in this embodiment.This facilitate
Al chain flexibility or stretching(And the Al chain with wider width 197 is caused under the typical pressure being experienced by ESS
Bigger crash rate).Additionally, increasing width 197 will consume the valuable real estate on ESS, thus reduce for multi-parameter ESS
In other sensors space(Wherein real estate is of great rarity).In an embodiment, the height 190,199 of the PET assembly of chain
Can be equal to each other or unequal.In an embodiment, for the width of the PET assembly of chain(197、198)Can be equal to each other or
Unequal.In addition, Al/PET's and PET/Au " stirs and sways(flip flopping)" help to maintain Au directly contact skin
(Once any liner is removed and ESS is applied to patient)And Al does not contact skin(To promote biocompatibility to consider,
Wherein exposure from skin to Al possibly undesirably).
Figure 10 includes process 900' with element 901'(" using the first material for the first conducting element(For example,
Au)" conduct the element 905,910,915,920,925,930,935 being derived from Fig. 9);905'(" using for the second conducting element
The second material(For example, metal, such as Al, or semiconductor element, such as Si)In additional first substrate(For example, polymer,
Such as PET)Upper offer the second conducting element ");910'(" additional first substrate is attached to additional second substrate(For example, TRT)
To form the second compound and additional second substrate be coupled to manufacturing platform/additional manufacturing platform(For example, cutting pad)”);
915'(" the second compound is positioned at formation instrument/be additionally formed instrument(For example, the construction work based on cutter or laser instrument
Tool, it is configured to form chain from the second conducting element)In ", it may inevitably include in the formation instrument/instrument of being additionally formed
Multiple substrates(For example, " additional first substrate " and " additional second substrate ");920'(" form pattern in the second conducting element
(For example, chain)”);925'(" the second compound is exposed to heat ");930'(" remove undesired second from the second compound
Conductive member portion ");935'(" in the position adjacent or between of the first compound on the 3rd substrate, second is being combined
Thing is coupled to the 3rd substrate(For example, skin tape), and remove the second additional substrate ");940'(" the second compound is coupled
To the 4th substrate(For example, the liner in order to prevent Au and Al chain from exposing too early ");945'(" multiple ESS are positioned at continuous portion
In administration's system(For example, the big roller of ESS, thus perforation allows ESS to remove from deployment system one by one)”).
Respiratory rate measures
Different from conventional micro-fabrication technology, cutting and stickup scheme can apply to the material of wider classification.Applicant manufactures work(
The stretchable strain-ga(u)ge system of energy, it includes conductive rubber by using the embodiment cut with method of attaching(ECR;
Elastosil LR 3162, Wacker Silicones)As resistor component and the 100nm snakelike wire of gold is as can
Stretching interconnection.
As Fig. 6(a)Shown in as manufacture three types deformeter.Longitudinal strain instrument 601 and transverse strain instrument 602
For the strain corresponding to vertical and horizontal direction is measured by the change in the resistance in measuring instrument.Based on Wheatstone bridge
Instrument 603 be used for measuring the strain of not temperature influence by the voltage in measuring instrument.The property of deformeter is that it should
Variable coefficient(gauge factor)(GF), it is defined as partial ohmic and changesWith the strain appliedIt
Than:
Measure 601 and 602 GF using the tensile strain vertically applied, and in Fig. 6(b)Middle this result of drafting.
601 GF is 5.4 and 602 GF is -2.7, because it is due to TegadermTMThe poisson effect of substrate and stand horizontal compression
Strain.
In an embodiment, the general principle of the instrument of skin installation is followed in the design of strain-ga(u)ge system, and wherein idea is logical
Cross and configure system using geometry in Different Plane and different materials, so that the overall resistance of system changes close to resistor
Local electrical resistance change.
For the accuracy increasing, adopt Wheatstone bridge 603 to eliminate temperature effect.Two of bridge apply to angular vertex
Input voltage, and across two other, output voltage is measured to angular vertex.The knot changing as the portion voltage of the function of strain
Fruit is in Fig. 6(c)Middle drafting.This illustrates that curve up to 5% strains as linear, and slope(It is the class GF ginseng for Wheatstone bridge
Number)Equal to 20.2.FEM result is in Fig. 6(d)In and illustrate that longitudinal electrical resistance device rightly adapts to longitudinal strain and lateral resistance
Transverse strain is responsible for by device.
Fig. 6(e)-(h)Illustrate by Fig. 6 being applied on the chest of object during various breathing patterns(a)Strain
Instrument and test on the skin that executes.Fig. 6(f)Show by using longitudinal electrical resistance device 601 and be directed to the electricity of normal breathing rates
The real-time measurement of resistance result.The respiratory rate of human male subject was measured as the circulation of 6 inspiration-expiration in 20 seconds, its represent with often
The good uniformity of the normal statistics respiratory rate of a minute 16-20 time.Fig. 6(g)-(h)It is shown respectively three of real-time measurement
Different breathing patterns, breathe, deeply breathe and cough including quiet.Illustrating deeply breathes causes the voltage stronger than quiet breathing
Change, it means that chest is morely more mobile than quiet breathing for deeply breathing.And, deep breathing respiratory rate is little
Respiratory rate in quiet breathing.Specifically, in deep breathing, objects costs are used for air-breathing and spend be used for exhaling for 3 seconds for 2 seconds
Gas, it is more much longer than the time of quiet breathing.Respiratory rate for cough captures also by Wheatstone bridge, wherein in Fig. 6
(h)Shown in due to the repeat patterns of multiple cough.
The ESS being discussed herein can utilize the system of the system of such as Fig. 7 etc, and this is discussed below.For example, carry out autobiography
The EP signal of sensor 228 can be routed to node, such as node 1000(Via direct wiring engagement pad 228'), by this node
1000 process and show signal and execute measurement(For example, R-R interval).However, in other embodiments, signal can make
Passed on via wireless device with antenna 227.Embodiment can use in many different types of systems.For example, at one
In embodiment, communication equipment(For example, smart phone)May be arranged to execute various methods described herein and technology.Certainly,
The scope of the present invention is not limited to communication equipment, and alternatively, other embodiment can be for other classes for process instruction
The device of type.
Programmed instruction may be used to execute operation described herein with the universal or special processing system of instruction programming.
These instructions can be used for process signal(For example, EP signal)Or programming machine is to cut or otherwise to be formed(For example, warp
By cutter or laser instrument)Chain for ESS.Alternatively, operation can be by comprising the hardwire logic for execution operation
Particular hardware assembly, or executed by any combinations of programmed computer components and custom hardware assembly.Retouch herein
The method stated can be provided as(a)Computer program, it can include or many with the instruction being stored thereon
Individual machine readable media, this instruction can be used for programmed process system or other electronic equipments executing method, or is provided as
(b)At least one storage medium with the instruction being stored thereon is for making system execute method.Terms used herein
" machine readable media " or " storage medium " should include any medium, and it can store or coded command sequence(Including signal
Provisional medium, or non-transitory medium)For being executed by machine and so that machine is implemented in method described herein
Any one.Term " machine readable media " or " storage medium " should correspondingly should include but is not limited to, memory, such as
Solid-state memory, CD and disk, read-only storage(ROM), programming ROM(PROM), erasable PROM(EPROM), electricity
EPROM(EEPROM), disc driver, floppy disk, compact disk ROM(CD-ROM), digital versatile disk(DVD), flash memory, magnetic
CD, and more exotic mediums, the bio-logic state reservation of such as machine-accessible or signal reservations storage device.Medium
ESS can be coupled on ESS or via direct or indirect means.Medium can be to include in the form of machine-readable
Any mechanism of storage, transmission or receive information, and medium can include the medium that program code can pass through, such as sky
Line, optical fiber, communication interface etc..Program code can be transmitted in the form of bag, serial data, parallel data etc., and can be with
Compression or encryption format use.Additionally, in this area commonly in one form or another kind of form(For example, program, enter
Journey, process, application, module, logic etc.)Software is said into and takes action or cause result.Such statement is only to state
Short hand notation processor implementation action being made by processing system to the execution of software or producing result.
Referring now to Fig. 7, show the block diagram of the system embodiment 1000 according to embodiments of the invention.System 1000 can
To include in such as mobile computing node, this mobile computing node such as cell phone, smart phone, flat board, Ultrabook
, notebook, kneetop computer, personal digital assistant and the platform based on mobile processor.
Show the multicomputer system 1000 including the first treatment element 1070 and second processing element 1080.Although showing
Two treatment elements 1070 and 1080 are gone out, it is appreciated that the embodiment of system 1000 can also include only one so
Treatment element.System 1000 is illustrated as point-to-point interconnection system, the wherein first treatment element 1070 and second processing element
1080 couple via point-to-point interconnection 1050.It is to be understood that illustrated any or all of interconnection to can be implemented as multiple spot total
Line rather than point-to-point interconnection.As indicated, each treatment element 1070 and 1080 can be polycaryon processor, including the first He
Second processing device core(That is, processor core 1074a and 1074b and processor core 1084a and 1084b).Such core 1074,
1074b, 1084a, 1084b be configurable to with the method similar mode execute instruction code being discussed herein.
Each treatment element 1070,1080 can include at least one shared buffer memory.This shared buffer memory can store number
According to(For example, instruct), its by processor one or more assemblies utilize, such as respectively earth's core 1074a, 1074b, 1084a,
1084b.For example, the data that shared buffer memory can be stored with local cache in memory 1032,1034 is for by processor
Assembly more rapid access.In one or more embodiments, shared buffer memory can include one or more intergrade cachings,
Such as 2 grades(L2), 3 grades(L3), 4 grades(L4)Or other levels caching, afterbody caching(LLC)And/or a combination thereof.
Although only being illustrated with two treatment elements 1070,1080, it is appreciated that the scope of the present invention is not so subject to
Limit.In other embodiments, one or more additional processing elements may reside in given processor.Alternatively, one
Or multiple treatment element 1070,1080 can be element in addition to processors, such as accelerator or field programmable gate array.
For example,(One or more)Additional processing elements can include and first processor 1070 identical(One or more)Additional place
Reason device and first processor 1070 foreign peoples or asymmetrical(One or more)Attached Processor, accelerator(Such as figure
Accelerator or Digital Signal Processing(DSP)Unit), field programmable gate array or any other treatment element.Treatment element
1070th, there may be advantage between 1080(merit)Each species diversity of the frequency spectrum aspect of tolerance, including framework, micro-architecture, heat
, power consumption characteristics etc..These differences can as the asymmetry among treatment element 1070,1080 and heterogeneity and effectively
Prove itself.For at least one embodiment, various treatment elements 1070,1080 may reside in same die encapsulation.
First treatment element 1070 may further include Memory Controller logic(MC)1072 and point-to-point(P-P)
Interface 1076 and 1078.Similarly, second processing element 1080 can include MC 1082 and P-P interface 1086 and 1088.MC
1072 and 1082 couple the processor to respective memory that is to say, that memory 1032 and memory 1034, and it can be this
Be attached to respective processor main storage part.Although MC logic 1072 and 1082 is illustrated as being integrated into treatment element
1070th, in 1080, but for alternative embodiment, MC logic can be the discreet logic outside treatment element 1070,1080
Rather than be integrated in.
First treatment element 1070 and second processing element 1080 can respectively via P-P interface 1076,1086, via
I/O subsystem 1090 is coupled in P-P interconnection 1062,10104.As indicated, I/O subsystem 1090 includes P-P interface 1094 He
1098.Additionally, I/O subsystem 1090 includes interface 1092 to couple I/O subsystem 1090 with high performance graphics engine 1038.
In one embodiment, bus can be used for for graphics engine 1038 being coupled to I/O subsystem 1090.Alternatively, point-to-point
Interconnection 1039 can couple these assemblies.
And then, I/O subsystem 1090 can be coupled to the first bus 10110 via interface 1096.In one embodiment,
First bus 10110 can be periphery component interconnection(PCI)Bus, or such as PCI Express or other third generation I/O
The bus of interconnection bus etc, although the scope of the present invention is not so limited.
As indicated, various I/O equipment 1014,1024 may be coupled to the first bus 10110, together with can be by the first bus
10110 bus bridges 1018 being coupled to the second bus 1020.In one embodiment, the second bus 1020 can be low pin count
(LPC)Bus.Various equipment may be coupled to the second bus 1020, including such as keyboard/mouse 1022,(One or more)Logical
Letter equipment 1026(Itself so can be with computer network communication)And data storage cell 1028, such as disc driver or
Other mass-memory units, it can include code 1030 in one embodiment.Code 1030 can be included for executing
The instruction of the embodiment of one or more of process as described above.In addition, audio frequency I/O 1024 to may be coupled to second total
Line 1020.
It is to be noted, that being susceptible to other embodiment.For example, replace shown Peer to Peer Architecture, system can realize multiple spot
Bus or another such Communication topology.And, the element of Fig. 7 can alternatively use than shown in Fig. 7
More or less of integrated chip is dividing.
The example below is related to further embodiment.
Example 1 includes a kind of sensing system, including:First epidermis sensing system(ESS), it includes:First substrate;
First chain of the first metal of the first polymer including directly contact first substrate and directly contact first polymer;Including straight
Additional the of additional first metal of the contact additional first polymer of the first substrate and the additional first polymer of directly contact
One chain;And first metal and additional first on metal first protect substrate.
For example, substrate can include skin tape or paper of tatooing.
In example 2, the theme of example 1 can alternatively include, and the wherein first chain includes Part I and additional the
One chain includes the additional Part I parallel with Part I.
For example, part 261,262 have wherein the two towards ESS 200 center is mobile and region parallel to each other.
In example 3, the theme of example 1-2 can alternatively include, and the wherein first chain directly contact adds the first chain.
For example, at position 289, chain has the transition from chain 265 to chain 266 to 265,266, and two of which chain is straight each other
Contact.
In example 4, the theme of example 1-3 can alternatively include the 2nd ESS, and it includes:Second substrate;Including directly
Contact the second polymer of the second substrate and bimetallic second chain of directly contact second polymer;Including directly contact
The additional second polymer of two substrates and additional bimetallic additional second chain of the additional second polymer of directly contact;And
Second metal and additional second on metal second protect substrate;Wherein first and second ESS are in the centre progressively surrounding roller
Adjacent one another are on the roller of three or more partial ESS.
Thus, embodiment allows to launch the roller of the ESS of an ESS at that time.Other system can dispose the bar of ESS
Band, including four in single band or five ESS, it is all co-linear with one another.Some embodiments can include thering is three row ESS
Rectangular sheet, each of which row includes three to four ESS.
In example 5, the theme of example 1-4 can alternatively include, and the wherein first and second substrates are each included each other
Become monolithic(monolithic)Skin tape part, the first and second polymer each include PET
(PET), the first and second metals each include gold, and the first and second protection substrates each include liner.
However, in other embodiments, the first and second substrates each include the paper part of tatooing each other in monolithic.
Thus, embodiment can provide the continuous tape that the roller along ESS extends, and thus this band has perforation or other areas
Domain, it lacks structural integrity and allows user simply to remove another ESS from an ESS.Embodiment can provide edge
The continuous monolithic liner that the roller of ESS extends, wherein liner have perforation or other regions, and it lacks structural integrity and makes user
Simply another ESS can be removed from an ESS.Embodiment can include continuous skin tape and the lining extending across multiple ESS
Pad, the roller of such as ESS or piece.
In example 6, the theme of example 1-5 can alternatively include, and the wherein first and second protection substrates are each other in list
Piece and include the perforation joint between the first and second protection substrates.
In example 7, the theme of example 1-6 can alternatively include, and the wherein the first ESS includes:Including directly contact
3rd metal of one substrate and the 3rd chain of third polymer;And include directly contact first substrate additional 3rd metal and
Additional 3rd chain of additional third polymer;Wherein first protection substrate is on the 3rd metal and additional 3rd metal;Wherein
One metal includes first materials different from the 3rd material including in the 3rd metal.
In an embodiment, the first and second metals include Au and the 3rd metal includes Al.Of course, it is possible to be led using other
Conductive metal, including Cu, Si, SiGe etc..
In example 8, the theme of example 1-7 can alternatively include, and the wherein the first ESS includes:Including directly contact
Second metal of one substrate and the second chain of second polymer;And include directly contact first substrate additional second metal and
Additional second chain of additional second polymer;Wherein first protection substrate is on the second metal and additional second metal;Wherein
One metal includes first materials different from the second material including in the second metal.
In example 9, the theme of example 1-8 can alternatively be included, wherein(a)First substrate is included in horizontal plane
Major axis,(b)First metal includes first height orthogonal with horizontal plane,(c)Second metal includes orthogonal with horizontal plane
Second height, and(d)Second height is more than the first height.
In example 10, the theme of example 1-9 can alternatively be included, wherein(a)First metal includes and horizontal plane
The first parallel width,(b)Second metal includes second width parallel with horizontal plane, and(d)Second width is equal to the
One width.
In example 11, the theme of example 1-10 can alternatively include, and the wherein first material includes gold and the second material
Material includes aluminium.
In example 12, the theme of example 1-11 can alternatively include, and the wherein second chain and additional second chain are in complementation
Formed in serpentine pattern;Wherein second chain includes maximum curvature radius, and it is directly adjacent to additional second chain and includes minimum curvature
The place of radius;Wherein second chain includes minimum profile curvature radius, and it is directly adjacent to additional second chain and includes maximum curvature radius
Place.
For example, in figure 3, minimum profile curvature radius 389 are aligned for complementary serpentine pattern with maximum curvature radius 399
390.
In example 13, the theme of example 1-12 can alternatively include, and the wherein second material includes aluminium and the second chain
Each include in deformeter and antenna with additional second chain.
In example 14, the theme of example 1-13 can alternatively include, including being configured to via inductive and antenna
Second coil of communication.
For example, coil 528 can be included in the external member with some ESS.
In example 15, the theme of example 1-14 can alternatively include, the wherein first protection substrate directly contact first
Metal and additional first metal.
In example 16, the theme of example 1-15 can alternatively include, and the wherein first chain in the first intersection and adds
First chain intersects;Wherein first chain includes minimum diameter and mobile and broaden away from intersection with the first chain in intersection.
For example, Fig. 4(a)-(l)Show the image of various embodiments.Fig. 4(a)、(b)With(c)Respectively illustrate new,
Use and damage blade.The cutting of various combination using the selected cutting parameter in Cameo cutting machine software
Cut result to be given below(Wherein KT represents Kapton thickness, and Sh represents sharpness, and Ra represents rate of cutting, Th representative thickness, NB
Represent new blade, UB represents the blade of use):Fig. 4(d)KT=25.4 μm, Sh=5, Ra=1, Th=7, NB, Fig. 4(e)KT=
25.4 μm, Sh=10, Ra=1, Th=7, NB, Fig. 4(f)KT=25.4 μm, Sh=5, Ra=10, NB, Fig. 4(g)KT=25.4 μm, Sh=5,
Ra=1, Th=20, NB, Fig. 4(h)KT=12.7 μm, Sh=5, Ra=1, Th=7, NB, Fig. 4(i)KT=25.4 μm, Sh=10, Ra=1, Th
=7, UB.Minimum diameter illustrates at 372,371, and wherein significantly then part widens at 362,361.Part 372,373,
371 instructions in this place cutter knife stop and pivot or otherwise offset cut and be not present in based on photoetching so that crossing
Epidermis sensor in region.Fig. 4(j)(k)(l)Different intersections are shown.
Example 17 includes a kind of method, and it includes:First conducting element is provided on the first substrate;By the first conducting element
It is coupled to the second substrate to form compound;Second substrate is coupled to manufacturing platform;Compound, shape is positioned in formation instrument
One-tenth instrument includes the component selected from the group comprising cutter and laser instrument;Form pattern in the first conducting element;Compound is sudden and violent
It is exposed to heat;Remove undesired first conductive member portion from compound;And by compound be coupled to the 3rd substrate and
Remove the second substrate.
In an embodiment, manufacturing platform can include table tool, cutting pad, peel off plane, ceramic flat surface etc..In embodiment
In, conducting element can include metal(Al、Cu、Au), conductive straight polymer or polymer complex etc..
In example 18, the theme of example 17 can alternatively include, including in the mid portion surrounding roller step by step
On the roller of three or more ESS, positioning includes the first epidermis sensing system of first conducting element adjacent with the 2nd ESS
(ESS).
Example 19 includes a kind of sensing system, and this sensing system includes:First epidermis sensing system(ESS), its
Including:First substrate;Including the first polymer being coupled to the first substrate and the first metal of being coupled to first polymer the
One chain;Including the additional first polymer being coupled to the first substrate and additional first metal being coupled to additional first polymer
Additional first chain;And first metal and additional first on metal first protect substrate.
Thus, in an embodiment, first polymer does not need directly contact first substrate, but can alternatively indirectly connect
Touch the first substrate.
In example 20, the theme of example 19 can alternatively include, and the wherein the first ESS includes:Including being coupled to first
Second metal of substrate and the second chain of second polymer;And include being coupled to additional second metal of the first substrate and add
Additional second chain of second polymer;Wherein first protection substrate is on the second metal and additional second metal;Wherein first gold medal
Belong to and include first materials different from the second material including in the second metal.
Example 21 includes a kind of sensing system, and this sensing system includes:First epidermis sensing system(ESS), its
Including:First substrate;Including the first polymer being coupled to the first substrate and the first conducting element being coupled to first polymer
The first chain;Lead including the additional first polymer and be coupled to additional first polymer additional first being coupled to the first substrate
Additional first chain of electric device;And first the first protection substrate on conducting element and additional first conductive element.
In example 22, the theme of example 21 can alternatively include, and the wherein the first ESS includes:Including being coupled to first
Second conducting element of substrate and the second chain of second polymer;And include the additional second conductive unit being coupled to the first substrate
Part and additional second chain of additional second polymer;Wherein first protection substrate is in the second conducting element and additional second conductive unit
On part;Wherein first conducting element includes first materials different from the second material including in the second conducting element.
Present the above description of embodiments of the invention for description and descriptive purpose.It is not intended to be poor
Act property or limit the invention to disclosed precise forms.This description and following claims include such as left and right, top,
Bottom, on, under, above, below, first, second or the like term, it is only used for descriptive purpose and should not be construed as
Limit.For example it is intended that the term of relative vertical position refers to the equipment side of wherein substrate or integrated circuit(Or active surface)It is
The situation on " top " surface of substrate;Substrate can essentially be in any orientation so that " top " side of substrate is joined in Standard Earth (SE)
According to can be lower than " bottom " side and still fall in the implication of term " top " in being.As used in this article term " ... on "
(Including in the claims)Do not indicate the second layer " on " ground floor directly closely connect on the second layer and with the second layer
Touch, unless clearly so stated;There may be third layer or other structures between the second layer on the first layer and ground floor.
The embodiment of equipment described herein or article can with several positions and orientation to manufacture, using or transport.In association area
Technical staff it is to be appreciated that in view of teachings above, many modifications and deformation are possible.Those skilled in the art will recognize that
To the various equivalent combinations for the various assemblies shown in accompanying drawing and replacement.Therefore it is intended that the scope of the present invention not
Thus describe in detail and limit, but limited by the claim being appended hereto it.
Claims (20)
1. a kind of sensing system, including:
First epidermis sensing system(ESS), it includes:
First substrate;
First chain of the first metal of the first polymer including directly contact first substrate and directly contact first polymer;
Additional first polymer including directly contact first substrate and additional first gold medal of the additional first polymer of directly contact
Additional first chain belonging to;And
First metal and additional first on metal first protect substrate.
2. the system described in claim 1, the wherein first chain includes Part I and additional first chain includes and Part I
Parallel additional Part I.
3. the system described in claim 2, the wherein first chain directly contact adds the first chain.
4. the system described in claim 1, including:
2nd ESS, it includes:
Second substrate;
Second polymer including directly contact second substrate and bimetallic second chain of directly contact second polymer;
Additional second polymer including directly contact second substrate and additional second gold medal of the additional second polymer of directly contact
Additional second chain belonging to;And
Second metal and additional second on metal second protect substrate;
Wherein first and second ESS are adjacent one another are on the roller of three or more ESS in the mid portion progressively surrounding roller.
5. the system described in claim 4, the wherein first and second substrates each include the skin tape part each other in monolithic, the
One and second polymer each include PET(PET), the first and second metals each include gold, and
One and second protects substrate each to include liner.
6. the system described in claim 5, the wherein first and second protection substrates each other in monolithic and include first and second
Perforation joint between protection substrate.
7. the system described in claim 4, the wherein the first ESS includes:
The 3rd metal including directly contact first substrate and the 3rd chain of third polymer;And
Additional 3rd metal including directly contact first substrate and additional 3rd chain of additional third polymer;
Wherein first protection substrate is on the 3rd metal and additional 3rd metal;
Wherein first metal includes first materials different from the 3rd material including in the 3rd metal.
8. the system described in claim 1, the wherein the first ESS includes:
The second metal including directly contact first substrate and the second chain of second polymer;And
Additional second metal including directly contact first substrate and additional second chain of additional second polymer;
Wherein first protection substrate is on the second metal and additional second metal;
Wherein first metal includes first materials different from the second material including in the second metal.
9. the system described in claim 8, wherein(a)First substrate includes the major axis in horizontal plane,(b)First metal includes
First height orthogonal with horizontal plane,(c)Second metal includes second height orthogonal with horizontal plane, and(d)Second
Highly it is more than the first height.
10. the system described in claim 9, wherein(a)First metal includes first width parallel with horizontal plane,(b)The
Two metals include second width parallel with horizontal plane, and(d)Second width is equal to the first width.
System described in 11. claims 8, the wherein first material includes gold and the second material includes aluminium.
System described in 12. claims 8:
Wherein second chain and additional second chain are formed in complementary serpentine pattern;
Wherein second chain includes maximum curvature radius, and it is directly adjacent to the place that additional second chain includes minimum profile curvature radius;
Wherein second chain includes minimum profile curvature radius, and it is directly adjacent to the place that additional second chain includes maximum curvature radius.
System described in 13. claims 12, the wherein second material includes aluminium and the second chain and additional second chain each include
In deformeter and antenna.
System described in 14. claims 13, including the second coil being configured to via inductive and antenna communication.
System described in 15. claims 1, the wherein first protection substrate directly contact first metal and additional first metal.
System described in 16. claims 1:
Wherein first chain is intersected with additional first chain in the first intersection;
Wherein first chain includes minimum diameter and mobile and broaden away from intersection with the first chain in intersection.
A kind of 17. methods, including:
First conducting element is provided on the first substrate;
First conducting element is coupled to the second substrate to form compound;
Second substrate is coupled to manufacturing platform;
Position compound in formation instrument, formation instrument includes the component selected from the group comprising cutter and laser instrument;
Form pattern in the first conducting element;
Compound is exposed to heat;
Remove undesired first conductive member portion from compound;And
Compound is coupled to the 3rd substrate and removes the second substrate.
Method described in 18. claims 17, including on the roller of three or more ESS of the mid portion surrounding roller step by step
Positioning includes the first epidermis sensing system of first conducting element adjacent with the 2nd ESS(ESS).
A kind of 19. sensing systems, including:
First epidermis sensing system(ESS), including:
First substrate;
The first chain including the first polymer being coupled to the first substrate and the first conducting element being coupled to first polymer;
First including the additional first polymer being coupled to the first substrate and the additional first conductive being coupled to additional first polymer
Additional first chain of part;And
The first protection substrate on first conducting element and additional first conductive element.
System described in 20. claims 19, the wherein the first ESS includes:
Including being coupled to the second conducting element of the first substrate and the second chain of second polymer;And
Additional second chain including the additional second conductive element being coupled to the first substrate and additional second polymer;
Wherein first protection substrate is on the second conducting element and additional second conductive element;
Wherein first conducting element includes first materials different from the second material including in the second conducting element.
Applications Claiming Priority (3)
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US201461971945P | 2014-03-28 | 2014-03-28 | |
US61/971945 | 2014-03-28 | ||
PCT/US2015/023052 WO2015148957A1 (en) | 2014-03-28 | 2015-03-27 | Epidermal sensor system and process |
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CN106413542A true CN106413542A (en) | 2017-02-15 |
Family
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CN201580028107.XA Pending CN106413542A (en) | 2014-03-28 | 2015-03-27 | Epidermal sensor system and process |
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EP (1) | EP3122248A4 (en) |
CN (1) | CN106413542A (en) |
WO (1) | WO2015148957A1 (en) |
Cited By (5)
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CN106821378A (en) * | 2017-03-21 | 2017-06-13 | 成都柔电云科科技有限公司 | A kind of portable muscular fatigue degree testing equipment based on electronics epidermis |
CN110461232A (en) * | 2017-04-04 | 2019-11-15 | 豪夫迈·罗氏有限公司 | The wearable Medical Devices of body |
CN111343902A (en) * | 2017-06-07 | 2020-06-26 | 得克萨斯大学体系董事会 | Wireless, wearable, and flexible biometric sensor |
CN111355308A (en) * | 2018-12-24 | 2020-06-30 | 中国科学院半导体研究所 | Wireless energy supply flexible light-emitting system and preparation method of wireless energy receiving end device thereof |
TWI802561B (en) * | 2017-04-28 | 2023-05-21 | 日商日東電工股份有限公司 | biometric sensor |
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US10492703B2 (en) | 2014-03-28 | 2019-12-03 | Board Of Regents, The University Of Texas System | Epidermal sensor system and process |
EP3318187A1 (en) * | 2016-11-07 | 2018-05-09 | Nokia Technologies OY | Electrode for physiological measurements |
US11786170B2 (en) | 2017-04-28 | 2023-10-17 | Board Of Regents, The University Of Texas System | Nanomaterial epidermal sensors |
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CN106821378A (en) * | 2017-03-21 | 2017-06-13 | 成都柔电云科科技有限公司 | A kind of portable muscular fatigue degree testing equipment based on electronics epidermis |
CN110461232A (en) * | 2017-04-04 | 2019-11-15 | 豪夫迈·罗氏有限公司 | The wearable Medical Devices of body |
TWI802561B (en) * | 2017-04-28 | 2023-05-21 | 日商日東電工股份有限公司 | biometric sensor |
CN111343902A (en) * | 2017-06-07 | 2020-06-26 | 得克萨斯大学体系董事会 | Wireless, wearable, and flexible biometric sensor |
CN111355308A (en) * | 2018-12-24 | 2020-06-30 | 中国科学院半导体研究所 | Wireless energy supply flexible light-emitting system and preparation method of wireless energy receiving end device thereof |
CN111355308B (en) * | 2018-12-24 | 2023-12-29 | 中国科学院半导体研究所 | Wireless energy supply flexible lighting system and preparation method of wireless energy receiving end device thereof |
Also Published As
Publication number | Publication date |
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WO2015148957A1 (en) | 2015-10-01 |
EP3122248A4 (en) | 2018-05-02 |
EP3122248A1 (en) | 2017-02-01 |
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