KR890007412A - 모울드방법 및 장치 - Google Patents

모울드방법 및 장치 Download PDF

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Publication number
KR890007412A
KR890007412A KR1019880013640A KR880013640A KR890007412A KR 890007412 A KR890007412 A KR 890007412A KR 1019880013640 A KR1019880013640 A KR 1019880013640A KR 880013640 A KR880013640 A KR 880013640A KR 890007412 A KR890007412 A KR 890007412A
Authority
KR
South Korea
Prior art keywords
mold
brush
cleaner
sealed
resin
Prior art date
Application number
KR1019880013640A
Other languages
English (en)
Other versions
KR910009778B1 (ko
Inventor
미노루 다나까
겡 이찌로 사까모도
가쓰히꼬 야마사기
Original Assignee
시기 모리야
미쓰비시 뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시기 모리야, 미쓰비시 뎅끼 가부시끼가이샤 filed Critical 시기 모리야
Publication of KR890007412A publication Critical patent/KR890007412A/ko
Application granted granted Critical
Publication of KR910009778B1 publication Critical patent/KR910009778B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

내용 없음

Description

모울드 방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도, 제2도는 본 발명에 관한 모울드 장치를 중요부를 확대하여 표시하는 정면도와 측면도.
* 도면의 주요부분에 대한 부호의 설명
2 : 하부플라텐 3 : 아랫금형
5 : 윗금형 7 : 상부플라텐
11 : 클리너

Claims (2)

  1. 상하 금형의 양 금형면에 접한 브러쉬를 가지는 클리너로서 반도체장치에 대하여 수지로 봉하여 막은 후에 상기 양금형면을 청소하는 반도체장치의 수지로 봉하여 막는방법에 있어서 상기 클리너를 상부플라텐에 지지한 상태에서 상기 브러쉬를 회전시키면서 상기 양 금형면에 평행으로 진퇴시켜서 상기 양 금형면을 청소하는 것을 특징으로 하는 모울드방법 및 장치.
  2. 상하 플라텐에 부착된 상하 금형의 금형면에 접하는 브러쉬를 가지고 이 브러쉬를 회전시키면서 금형면에 평행으로 진퇴시키는 것에 의하여 금형면에 부착한 이물질을 제거하는 클리너를 구비한 반도체장치의 수지로 봉하여 막는 장치에 있어서 상기 클리너를 상부플라텐에 부착시킨 것을 특징으로 하는 모울드방법 및 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880013640A 1987-10-19 1988-10-19 모울드 방법 및 장치 KR910009778B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP87-264155 1987-10-19
JP62264155A JPH01105708A (ja) 1987-10-19 1987-10-19 モールド装置
JP62-264155 1987-10-19

Publications (2)

Publication Number Publication Date
KR890007412A true KR890007412A (ko) 1989-06-19
KR910009778B1 KR910009778B1 (ko) 1991-11-30

Family

ID=17399227

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880013640A KR910009778B1 (ko) 1987-10-19 1988-10-19 모울드 방법 및 장치

Country Status (4)

Country Link
US (1) US4983115A (ko)
JP (1) JPH01105708A (ko)
KR (1) KR910009778B1 (ko)
BR (1) BR8805379A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5297897A (en) * 1989-11-24 1994-03-29 Asm Fico Tooling B.V. Single-strip molding apparatus
JPH09123206A (ja) * 1995-10-30 1997-05-13 Towa Kk 電子部品の樹脂封止成形装置
KR0174982B1 (ko) * 1996-02-23 1999-02-01 김광호 프리히팅을 이용한 타블렛 먼지 제거 장치 및 제거방법
US6425751B1 (en) * 1999-06-21 2002-07-30 Besser Company Apparatus for molding blocks
NL2007110C2 (nl) * 2011-07-14 2013-01-15 Fico Bv Inrichting voor het reinigen van een omhulinrichting voor elektronische componenten.
JP2020006600A (ja) * 2018-07-10 2020-01-16 Ｔｏｗａ株式会社 成形型クリーニング装置及び方法、樹脂成形装置、並びに樹脂成形品製造方法
CN111495866A (zh) * 2020-05-07 2020-08-07 宁波引智信息科技有限公司 一种具备便捷固定的模具用清洗系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3086431A (en) * 1959-12-28 1963-04-23 Jr Charles I Perry Machine for forming highway markers in situ
US3479678A (en) * 1967-08-17 1969-11-25 Amsted Ind Inc Mold cleaner
DE1935887C3 (de) * 1969-07-15 1975-07-10 G. Siempelkamp & Co, 4150 Krefeld Anlage zur Herstellung von Spanplatten, Faserplatten und dergleichen
CH522489A (it) * 1970-07-24 1972-06-30 Italtrade Pressa per lo stampaggio di materie plastische, gomma e simili
US3941537A (en) * 1975-03-24 1976-03-02 Caterpillar Tractor Co. Rotary spray cleaner for circular dies
JPS5919367A (ja) * 1982-07-26 1984-01-31 Toshiba Corp メモリ付ゲ−トアレイ
JPS5976207A (ja) * 1982-10-25 1984-05-01 Kazuo Bando プラスチツク成形金型面のクリ−ニング装置
DE3584139D1 (de) * 1984-11-22 1991-10-24 Hitachi Ltd Kompressorkaeltemaschine mit einem fluessigkeitsdampfabscheider.
JPS61148016A (ja) * 1984-12-24 1986-07-05 Hitachi Ltd モールド装置
DD232873A1 (de) * 1984-12-27 1986-02-12 Thuringia Sonneberg Veb Vorrichtung zum putzen des oberstempels an formpressen
US4626184A (en) * 1985-03-14 1986-12-02 Kimberly-Clark Corporation Scarfing apparatus

Also Published As

Publication number Publication date
US4983115A (en) 1991-01-08
JPH01105708A (ja) 1989-04-24
BR8805379A (pt) 1989-06-13
KR910009778B1 (ko) 1991-11-30

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