KR880020970U - 회로기판의 자동 솔더링 장치 - Google Patents

회로기판의 자동 솔더링 장치

Info

Publication number
KR880020970U
KR880020970U KR2019870006307U KR870006307U KR880020970U KR 880020970 U KR880020970 U KR 880020970U KR 2019870006307 U KR2019870006307 U KR 2019870006307U KR 870006307 U KR870006307 U KR 870006307U KR 880020970 U KR880020970 U KR 880020970U
Authority
KR
South Korea
Prior art keywords
circuit boards
soldering device
automatic soldering
automatic
boards
Prior art date
Application number
KR2019870006307U
Other languages
English (en)
Other versions
KR890009018Y1 (ko
Inventor
이광복
Original Assignee
이광복
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이광복 filed Critical 이광복
Priority to KR2019870006307U priority Critical patent/KR890009018Y1/ko
Publication of KR880020970U publication Critical patent/KR880020970U/ko
Application granted granted Critical
Publication of KR890009018Y1 publication Critical patent/KR890009018Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR2019870006307U 1987-04-28 1987-04-28 회로기판의 자동 솔더링 장치 KR890009018Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019870006307U KR890009018Y1 (ko) 1987-04-28 1987-04-28 회로기판의 자동 솔더링 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019870006307U KR890009018Y1 (ko) 1987-04-28 1987-04-28 회로기판의 자동 솔더링 장치

Publications (2)

Publication Number Publication Date
KR880020970U true KR880020970U (ko) 1988-11-30
KR890009018Y1 KR890009018Y1 (ko) 1989-12-12

Family

ID=19262262

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019870006307U KR890009018Y1 (ko) 1987-04-28 1987-04-28 회로기판의 자동 솔더링 장치

Country Status (1)

Country Link
KR (1) KR890009018Y1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100951460B1 (ko) * 2009-08-31 2010-04-07 손은규 솔더링장치
KR102047311B1 (ko) 2019-10-24 2019-11-21 권준화 자동 솔더링 장치

Also Published As

Publication number Publication date
KR890009018Y1 (ko) 1989-12-12

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19931011

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee