KR860005571A - 땜납의 납접장치 - Google Patents

땜납의 납접장치

Info

Publication number
KR860005571A
KR860005571A KR1019850009362A KR850009362A KR860005571A KR 860005571 A KR860005571 A KR 860005571A KR 1019850009362 A KR1019850009362 A KR 1019850009362A KR 850009362 A KR850009362 A KR 850009362A KR 860005571 A KR860005571 A KR 860005571A
Authority
KR
South Korea
Prior art keywords
soldering device
solder soldering
solder
soldering
Prior art date
Application number
KR1019850009362A
Other languages
English (en)
Other versions
KR900007239B1 (ko
Inventor
후토미 하야카와
카주오 오노다
Original Assignee
가부시키가이샤 하이-베크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 하이-베크 filed Critical 가부시키가이샤 하이-베크
Publication of KR860005571A publication Critical patent/KR860005571A/ko
Application granted granted Critical
Publication of KR900007239B1 publication Critical patent/KR900007239B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Control Of Resistance Heating (AREA)
KR1019850009362A 1984-12-14 1985-12-12 땜납의 납접장치 KR900007239B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP84-262691 1984-12-14
JP59262691A JPS61140368A (ja) 1984-12-14 1984-12-14 非接触型のハンダ付け加工装置

Publications (2)

Publication Number Publication Date
KR860005571A true KR860005571A (ko) 1986-07-23
KR900007239B1 KR900007239B1 (ko) 1990-10-06

Family

ID=17379255

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850009362A KR900007239B1 (ko) 1984-12-14 1985-12-12 땜납의 납접장치

Country Status (4)

Country Link
US (1) US4650950A (ko)
EP (1) EP0184943B1 (ko)
JP (1) JPS61140368A (ko)
KR (1) KR900007239B1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227970Y2 (ko) * 1985-05-08 1990-07-27
JPS6221462A (ja) * 1985-07-18 1987-01-29 Haibetsuku:Kk Ｘ軸、ｙ軸方向の連続加工装置
JPH01161692A (ja) * 1987-12-18 1989-06-26 Japan Ranpu Kk ランプ熱源装置
JPH0230371A (ja) * 1988-07-15 1990-01-31 Haibetsuku:Kk 被加工材の四辺を同時加工するための熱源ユニット装置
US5060288A (en) * 1990-08-27 1991-10-22 Sierra Research And Technology, Inc. Infrared heater array for IC soldering
US5309545A (en) * 1990-08-27 1994-05-03 Sierra Research And Technology, Inc. Combined radiative and convective rework system
US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
GB2259039A (en) * 1991-09-02 1993-03-03 Pdr Microelectronics Limited Directed infra-red rework station
DE4302976A1 (de) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen
WO1997012714A2 (de) * 1995-09-18 1997-04-10 Hahn-Meitner-Institut Berlin Gmbh Vorrichtung zum berührungslosen, selektiven ein- oder auslöten von bauelementen
TW491409U (en) * 2001-04-27 2002-06-11 Hannstar Display Corp Mechanism for pressing the outer leads of thin film package
US20080116245A1 (en) * 2006-11-17 2008-05-22 General Electric Company Lamp-based swet welding apparatus
JP5407285B2 (ja) * 2008-11-12 2014-02-05 岩崎電気株式会社 白熱ランプヒータ装置
DE102010055087A1 (de) * 2010-12-18 2012-01-19 Robert Bosch Gmbh Vorrichtung zum Anbringen von elektronischen Bauelementen an Bauelementeträgern
CN109926717A (zh) * 2019-04-30 2019-06-25 苏州沃特维自动化系统有限公司 一种红外灯管加热焊接装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE635733A (ko) *
US2318533A (en) * 1940-12-06 1943-05-04 Western Electric Co Apparatus for heating material
FR1366277A (fr) * 1962-07-02 1964-07-10 Ibm Dispositifs de chauffage sélectifs pour soudage de modules
US3520055A (en) * 1967-04-26 1970-07-14 Western Electric Co Method for holding workpieces for radiant energy bonding
US3486004A (en) * 1968-02-12 1969-12-23 Time Research Lab Inc High speed bonding apparatus
US3522407A (en) * 1968-03-05 1970-08-04 Argus Eng Co Heating method
US3683146A (en) * 1969-08-04 1972-08-08 Time Research Lab Inc Methods for assembling solid state devices
US3674975A (en) * 1969-11-06 1972-07-04 Time Research Lab Inc Apparatus for assembling stacks
SU491457A1 (ru) * 1972-03-28 1975-11-15 Центральное Проектно-Конструкторское И Технологическое Бюро Устройство дл сварки угловых кольцевых швов
JPS5631902Y2 (ko) * 1972-12-30 1981-07-29
JPS49131333U (ko) * 1973-03-15 1974-11-12
JPS5091555A (ko) * 1973-12-14 1975-07-22
JPS50107730A (ko) * 1974-02-04 1975-08-25
JPS5812106A (ja) * 1981-07-15 1983-01-24 Hitachi Ltd 磁気記録再生装置

Also Published As

Publication number Publication date
EP0184943A3 (en) 1987-06-03
US4650950A (en) 1987-03-17
KR900007239B1 (ko) 1990-10-06
JPS61140368A (ja) 1986-06-27
EP0184943A2 (en) 1986-06-18
EP0184943B1 (en) 1990-09-26
JPH0541351B2 (ko) 1993-06-23

Similar Documents

Publication Publication Date Title
DE3564540D1 (de) Soldering flux
KR880700480A (ko) 땜납지지리드
DE3569216D1 (en) Solder connector device
GB8404512D0 (en) Soldering device
ATA193788A (de) Loetverbindung
KR870001757A (ko) 납땜 장치
KR860005571A (ko) 땜납의 납접장치
NO850262L (no) Stroemlinjet t-formet intrauterininnretning
DK310485D0 (da) Elektronisk kontaktanordning
KR870007647A (ko) 자동 납땜 장치
KR910021406U (ko) 납땜장치
AT375182B (de) Loetverbindung
GB8504536D0 (en) Solder/desolder device
KR900008652A (ko) 땜납 결합재
GB8527810D0 (en) Wave soldering device
GB2198380B (en) Soldering device
DK362684A (da) Loddekolbe
ES289846Y (es) Dispositivo para soldadura de vastagos
DE3771103D1 (de) Loetvorrichtung.
DK89584D0 (da) Reaktionsloddemetal
KR860700077A (ko) 집적회로 조합소자
SE8406103D0 (sv) Lodanordning
GB8602504D0 (en) Soldering device
KR880011767U (ko) 납땜장치
IT8519632A0 (it) Dispositivo perfezionato di saldatura e dissaldatura

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19950207

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee