KR880013233A - Inspection method of semiconductor device and its inspection device - Google Patents

Inspection method of semiconductor device and its inspection device Download PDF

Info

Publication number
KR880013233A
KR880013233A KR1019880004226A KR880004226A KR880013233A KR 880013233 A KR880013233 A KR 880013233A KR 1019880004226 A KR1019880004226 A KR 1019880004226A KR 880004226 A KR880004226 A KR 880004226A KR 880013233 A KR880013233 A KR 880013233A
Authority
KR
South Korea
Prior art keywords
semiconductor device
light beam
scanning
light
inspection apparatus
Prior art date
Application number
KR1019880004226A
Other languages
Korean (ko)
Other versions
KR910006368B1 (en
Inventor
가토도시히로
신도마사미치
요시히토 후카사와
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62089713A external-priority patent/JPH0666370B2/en
Priority claimed from PCT/JP1987/000826 external-priority patent/WO1989004058A1/en
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR880013233A publication Critical patent/KR880013233A/en
Application granted granted Critical
Publication of KR910006368B1 publication Critical patent/KR910006368B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

내용 없음No content

Description

반도체장치의 검사방법 및 그 검사장치Inspection method of semiconductor device and its inspection device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1 도는 본 발명에 따른 검사장치로 반도체장치를 검사하는 경우의 배치상태를 도시해놓은 측면도, 제 2 도는 본발명에 따른 검사장치를 개략적으로 도시해놓은 블로도.1 is a side view showing an arrangement state when a semiconductor device is inspected by the inspection apparatus according to the present invention, and FIG.

Claims (9)

스테이지수단위에 반도체장치를 배치하는 과정과, 상기 배치된 반도체장치 위에 광원수단에 의해 발생되는 접속된 광빔을 주시하는 과정, 상기 반도체장치에서 반사되어온 광을 검출하는 과정, 접속된 광빔이 반사된 반사위치와 상기 광원수단사이의 거리에 대응되는 출력신호를 발생시키는 과정 및, 상기 출력신호와 미리 지정된 기준레벨을 비교하는 과정으로 이루어진 것을 특징으로 하는 반도체장치의 검출방법.Arranging a semiconductor device in units of stages, observing a connected light beam generated by a light source means on the arranged semiconductor device, detecting light reflected from the semiconductor device, and reflecting the reflected light beam Generating an output signal corresponding to a distance between a position and the light source means, and comparing the output signal with a predetermined reference level. 제 1 항에 있어서, 상기 접속된 광빔의 주사과정이 상기 반도체장치를 움직여 줌으로써 수행되도록 된것을 특징으로 하는 반도체장치의 검사방법.The method of claim 1, wherein the scanning of the connected light beams is performed by moving the semiconductor device. 제 1 항에 있어서, 다수의 본딩와이어가 설치된 반도체장치에 대해서 접속된 광빔을 주사시켜 주는 과정에는 상기 각 본딩와이어를 광빔에 노출시켜 주는 과정이 포함되어 있는 것을 특징으로 하는 반도체장치의 검사방법.The method of claim 1, wherein the scanning of the light beam connected to the semiconductor device having a plurality of bonding wires comprises exposing each of the bonding wires to a light beam. 제 1 항에 있어서, 다수의 외부리이드가 설치된 반도체장치에 대해서 접속된 광빔을 주사시켜 주는 과정에는 상기 각 외부리이드를 광빔에 노출시켜 주는 과정이 포함되어 있는 것을 특징으로 하는 반도체장치의 검사방법.2. The method of claim 1, wherein the scanning of the light beam connected to the semiconductor device having a plurality of external leads comprises exposing each external lead to a light beam. 반도체장치를 지지하기 위한 스테이지수단과, 접속된(촛점이 맞춰진)광빔을 발생시켜 주는 광원수단, 반도체장치위에 접속된 광빔을 주사해주는 주사수단, 상기 반도체장치에서 반사되어 온 광을 감지해서 접속된 광빔이 반사된 반사지점과 상기 광원수단사이의 거리에 대응되게 검출되는 출력신호를 발생시켜 주는 검출수단 및, 이 검출수단에 의해 발생되어진 출력신호의 레벨과 미리 정해진 기준레벨을 비교해 주는 비교수단이 갖추어져서 구성된 것을 특징으로 하는 반도체장치의 검사장치.Stage means for supporting the semiconductor device, light source means for generating a connected (focused) light beam, scanning means for scanning a light beam connected on the semiconductor device, and sensing and connected the light reflected from the semiconductor device. Detection means for generating an output signal detected corresponding to the distance between the reflection point where the light beam is reflected and the light source means, and comparing means for comparing the level of the output signal generated by the detection means with a predetermined reference level; An inspection apparatus for semiconductor devices, comprising: 제 5 항에 있어서, 상기 주사수단은 반도체장치상에 주사되는 접속된 광빔의 주사위치에 대응되는 부호화된 신호를 발생시켜 주는 부호화수단을 갖추고 있는 것을 특징으로 하는 반도체장치의 검사장치.6. The inspection apparatus of claim 5, wherein the scanning means has encoding means for generating an encoded signal corresponding to the dice of the connected light beams scanned on the semiconductor device. 제 5 항에 있어서, 상기 광원수단이 레이저수단과, 이 레이저수단으로 부터의 광을 접속시켜 주는(촛점을 일치시켜주는) 렌즈수단을 갖추고 있는 것을 특징으로 하는 반도체장치의 검사장치.6. An inspection apparatus according to claim 5, wherein the light source means comprises a laser means and lens means for connecting (focusing) light from the laser means. 제 5 항에 있어서, 상기 주사수단이 반도체장치상에 주사되게 되는 접속된 광빔을 이동시켜 주는 이동수단을 갖추고 있는 것을 특징으로 하는 반도체장치의 검사장치.6. An inspection apparatus for a semiconductor device according to claim 5, wherein said scanning means is provided with a moving means for moving a connected light beam to be scanned onto said semiconductor device. 제 5 항에 있어서, 상기 주사수단이 반도체장치상에 접속된 광빔을 주사시켜 주기 위해 반도체장치를 이동시켜 주는 이동수단을 갖추고 있는 것을 특징으로 하는 반도체장치의 검사장치.6. An inspection apparatus for a semiconductor device according to claim 5, wherein said scanning means is provided with a moving means for moving the semiconductor device to scan a light beam connected on the semiconductor device. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019880004226A 1987-04-14 1988-04-14 Retention vessel method and apparatus for inspecting semiconductor device of their bonding status KR910006368B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-89713 1987-04-14
JP62089713A JPH0666370B2 (en) 1987-04-14 1987-04-14 Visual inspection equipment for semiconductor devices
PCT/JP1987/000826 WO1989004058A1 (en) 1987-10-27 1987-10-27 Retention vessel

Publications (2)

Publication Number Publication Date
KR880013233A true KR880013233A (en) 1988-11-30
KR910006368B1 KR910006368B1 (en) 1991-08-21

Family

ID=26428256

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880004226A KR910006368B1 (en) 1987-04-14 1988-04-14 Retention vessel method and apparatus for inspecting semiconductor device of their bonding status

Country Status (1)

Country Link
KR (1) KR910006368B1 (en)

Also Published As

Publication number Publication date
KR910006368B1 (en) 1991-08-21

Similar Documents

Publication Publication Date Title
KR950034657A (en) Laminated Object Search Apparatus and Method
KR880006659A (en) Optical pickup
SE7514389L (en) PROCEDURE FOR OPTO-ELECTRONIC POSITION SENSORING AND INSPECTION AND FOR THE PERFORMANCE OF THE PROCEDURE DEVICE
KR870009305A (en) Optical information reader
US5070237A (en) Optical measurement and detection system
KR930010527A (en) Surface condition inspection method using irradiation and its device
KR950033416A (en) Vessel finish part irradiation device and method
MY113350A (en) Semiconductor laser device to detect a divided reflected light beam
KR930000934A (en) Micro displacement detection method
KR960701439A (en) Optics
KR880013233A (en) Inspection method of semiconductor device and its inspection device
KR910008401A (en) How to measure lens magnification
JPS59155825A (en) Scanner
JPS61288143A (en) Surface inspecting device
KR910010660A (en) Internal Lead Bonding Inspection
JPS5756704A (en) Detector for surface flaw of bloom
JPS61254834A (en) Scanning type photo-acoustic microscope device
JPH02176513A (en) Defect inspecting device
GB1441386A (en) Scanning apparatus
JPH032254B2 (en)
JPH05107043A (en) Visual inspecting apparatus
JPH10239014A (en) Focal point detecting device and inspecting device
JPH05215693A (en) Inspecting apparatus for appearance
KR960011438A (en) Device for detecting bad lead of device
JPS5539022A (en) Optical thickness meter

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030801

Year of fee payment: 13

LAPS Lapse due to unpaid annual fee