KR870003031A - 세라믹스-금속접합체 - Google Patents

세라믹스-금속접합체 Download PDF

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Publication number
KR870003031A
KR870003031A KR1019860007615A KR860007615A KR870003031A KR 870003031 A KR870003031 A KR 870003031A KR 1019860007615 A KR1019860007615 A KR 1019860007615A KR 860007615 A KR860007615 A KR 860007615A KR 870003031 A KR870003031 A KR 870003031A
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South Korea
Prior art keywords
ceramic
ceramics
metal
copper plate
ceramic substrate
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KR1019860007615A
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English (en)
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KR890002161B1 (ko
Inventor
가즈오 마쯔무라
미쯔히로 나가따
다다시 다나까
Original Assignee
와다리 스기이찌로오
가부시끼가이샤 도시바
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Publication of KR870003031A publication Critical patent/KR870003031A/ko
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Publication of KR890002161B1 publication Critical patent/KR890002161B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6565—Cooling rate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/54—Oxidising the surface before joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

내용 없음

Description

세라믹스-금속접합체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명의 한실시예를 모형적으로 나타낸 단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 세라믹스 기판 2 : 동판
3 : 홈

Claims (4)

  1. 세라믹스 기판의 편면 또는 양면에 동판을 직접 접합하여서된 세라믹스-금속접합체로서, 동판과 세라믹스 기판이 접합하는면에 홈이 형성되어 있는 것을 특징으로 하는 세라믹스-금속접합체.
  2. 제1항에 있어서, 홈은 여러개의 대략 평행하는 홈인 것을 특징으로 하는 세라믹스-금속 접합체.
  3. 제2항에 있어서, 여러줄의 평행하는 홈의 폭이 0.01-3mm 핏치가 1-25mm 깊이가 0.01mm 이상으로써 동판 두께의 1/2 이하인 것을 특징으로 하는 세라믹스-금속 접합체.
  4. 제1항에 있어서, 세라믹스 기판의 휘어짐이 20μm/50mm 이하인 것을 특징으로 하는 세라믹스-금속 접합체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860007615A 1985-09-26 1986-09-09 세라믹스-금속접합체 KR890002161B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP60211056A JPS6272576A (ja) 1985-09-26 1985-09-26 セラミツクス−金属接合体
JP60-211056 1985-09-26
JP211056 1985-09-26

Publications (2)

Publication Number Publication Date
KR870003031A true KR870003031A (ko) 1987-04-14
KR890002161B1 KR890002161B1 (ko) 1989-06-21

Family

ID=16599659

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860007615A KR890002161B1 (ko) 1985-09-26 1986-09-09 세라믹스-금속접합체

Country Status (5)

Country Link
US (1) US4985097A (ko)
EP (1) EP0219254B1 (ko)
JP (1) JPS6272576A (ko)
KR (1) KR890002161B1 (ko)
DE (1) DE3650438T2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200023830A (ko) 2018-08-27 2020-03-06 (주)코모텍 조립식 벌통

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JPH01161892A (ja) * 1987-12-18 1989-06-26 Toshiba Corp セラミックス回路基板およびその製造方法
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
JPH01272183A (ja) * 1988-04-25 1989-10-31 Toshiba Corp セラミックス回路基板
JP2527760Y2 (ja) * 1991-05-30 1997-03-05 ティアック株式会社 磁気ヘッドの支持装置
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US5751324A (en) * 1996-03-14 1998-05-12 Lexmark International, Inc. Ink jet cartridge body with vented die cavity
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
DE10010461A1 (de) * 2000-03-03 2001-09-13 Infineon Technologies Ag Vorrichtung zum Verpacken elektronischer Bauteile mittels Spritzgußtechnik
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
AU2003229282A1 (en) * 2002-05-15 2003-12-02 Jurgen Schulz-Harder Method for producing a ceramic-copper composite substrate
US7159757B2 (en) * 2002-09-26 2007-01-09 Dowa Mining Co., Ltd. Metal/ceramic bonding article and method for producing same
US7204871B2 (en) * 2005-05-24 2007-04-17 Wolverine Plating Corp. Metal plating process
DE102010023637B4 (de) * 2010-06-14 2012-01-12 Ixys Semiconductor Gmbh Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten
JP2013055264A (ja) * 2011-09-05 2013-03-21 Toshiba Corp セラミックス銅回路基板の製造方法
CN102820405B (zh) * 2012-07-17 2015-06-24 大连理工大学 一种led器件的硅基板与铜微热管集成制造方法
US10000423B1 (en) 2016-03-31 2018-06-19 Ixys, Llc Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier
CN107295755A (zh) 2016-04-13 2017-10-24 讯芯电子科技（中山）有限公司 覆铜陶瓷基板的制造方法

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Publication number Priority date Publication date Assignee Title
US2638430A (en) * 1950-07-06 1953-05-12 Meyercord Co Method of making surface-covering articles
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
DE3036128C2 (de) * 1980-09-25 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten Verbinden von Kupferfolien mit Oxidkeramiksubstraten
US4413766A (en) * 1981-04-03 1983-11-08 General Electric Company Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
GB2099742B (en) * 1981-06-05 1985-07-31 Philips Electronic Associated Bonding metals to non-metals
DE3324661A1 (de) * 1983-07-08 1985-01-17 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metall mit keramik

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200023830A (ko) 2018-08-27 2020-03-06 (주)코모텍 조립식 벌통

Also Published As

Publication number Publication date
EP0219254A1 (en) 1987-04-22
DE3650438T2 (de) 1996-05-02
US4985097A (en) 1991-01-15
DE3650438D1 (de) 1995-12-21
JPS6272576A (ja) 1987-04-03
EP0219254B1 (en) 1995-11-15
KR890002161B1 (ko) 1989-06-21

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