KR850700100A - Electronic circuit assembly - Google Patents

Electronic circuit assembly

Info

Publication number
KR850700100A
KR850700100A KR1019850700044A KR850700044A KR850700100A KR 850700100 A KR850700100 A KR 850700100A KR 1019850700044 A KR1019850700044 A KR 1019850700044A KR 850700044 A KR850700044 A KR 850700044A KR 850700100 A KR850700100 A KR 850700100A
Authority
KR
South Korea
Prior art keywords
electronic circuit
circuit assembly
assembly
electronic
circuit
Prior art date
Application number
KR1019850700044A
Other languages
Korean (ko)
Inventor
존 패트릭 버어크
Original Assignee
도트렐 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도트렐 리미티드 filed Critical 도트렐 리미티드
Publication of KR850700100A publication Critical patent/KR850700100A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1019850700044A 1983-09-27 1985-05-17 Electronic circuit assembly KR850700100A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08325803A GB2147148A (en) 1983-09-27 1983-09-27 Electronic circuit assembly
PCT/GB1984/000330 WO1985001634A1 (en) 1983-09-27 1984-09-27 Electronic circuit assembly

Publications (1)

Publication Number Publication Date
KR850700100A true KR850700100A (en) 1985-10-21

Family

ID=10549343

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850700044A KR850700100A (en) 1983-09-27 1985-05-17 Electronic circuit assembly

Country Status (6)

Country Link
EP (1) EP0159331A1 (en)
JP (1) JPS61500047A (en)
KR (1) KR850700100A (en)
DK (1) DK229285A (en)
GB (1) GB2147148A (en)
WO (1) WO1985001634A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3675734D1 (en) * 1985-09-30 1991-01-03 Siemens Ag BUILDING ELEMENT FOR SURFACE MOUNTING AND METHOD FOR FIXING A BUILDING ELEMENT FOR SURFACE MOUNTING.
GB2200801B (en) * 1986-12-25 1991-01-09 Tdk Corp Electronic circuit element
GB8727926D0 (en) * 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
DE3806738C1 (en) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
FR2629953B1 (en) * 1988-04-06 1991-07-05 Sagem ELECTRICAL COMPONENT, ESPECIALLY ELECTRIC MOTOR, EQUIPPED WITH DOUBLE PAIRS OF CONTACTS, PARTICULARLY FOR ALLOWING TWO DIFFERENT LOCATIONS ON A PRINTED CIRCUIT PLATE
DE69015375T2 (en) * 1989-01-13 1995-05-04 Matsushita Electric Ind Co Ltd Adhesive composition for use in mounting electronic components and method for mounting electronic components on a circuit board using the adhesive.
DE58909875D1 (en) * 1989-05-31 2000-08-31 Osram Opto Semiconductors Gmbh Method for mounting a surface mount opto component
JPH03145186A (en) * 1989-10-30 1991-06-20 Mitsubishi Electric Corp Semiconductor module
JPH0828565B2 (en) * 1990-09-06 1996-03-21 ティーディーケイ株式会社 How to mount electronic components on printed circuit boards

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1221914A (en) * 1969-06-13 1971-02-10 Standard Telephones Cables Ltd Manufacture of integrated circuits
GB1467245A (en) * 1973-07-10 1977-03-16 Lucas Industries Ltd Method of securing component to a substrate
JPS53130831A (en) * 1977-04-20 1978-11-15 Schreiber Klaeranlagen Apparatus for cleaning dust receiving grate arranged in water way
JPS54155810A (en) * 1978-05-29 1979-12-08 Tdk Corp Bonding method of electronic parts
JPS5541793A (en) * 1978-09-20 1980-03-24 Matsushita Electric Ind Co Ltd Method of mounting microminiature part
JPS5726379Y2 (en) * 1978-09-21 1982-06-08
JPS5582487A (en) * 1978-12-18 1980-06-21 Sony Corp Electronic circuit device
JPS55144828A (en) * 1979-04-24 1980-11-12 Onishi Hitoshi Malt producing method and movable malt chamber
JPS55156482U (en) * 1979-04-26 1980-11-11
JPS5750497A (en) * 1980-09-11 1982-03-24 Mitsubishi Electric Corp Method of mounting electric part on printed board
DE3042043A1 (en) * 1980-11-07 1982-05-27 Nagel, Hans-Joachim, Dr., 2800 Bremen DEVICE FOR Fattening poultry
JPS5880894A (en) * 1981-11-10 1983-05-16 パイオニア株式会社 Method of producing printed board
JPS5885592A (en) * 1981-11-18 1983-05-21 パイオニア株式会社 Method of producing printed board
DE3226222A1 (en) * 1982-07-14 1984-01-26 Diehl GmbH & Co, 8500 Nürnberg DEVICE FOR CONNECTING AN ELECTRODE TO A CARRIER

Also Published As

Publication number Publication date
DK229285D0 (en) 1985-05-23
GB2147148A (en) 1985-05-01
DK229285A (en) 1985-05-23
EP0159331A1 (en) 1985-10-30
JPS61500047A (en) 1986-01-09
WO1985001634A1 (en) 1985-04-11
GB8325803D0 (en) 1983-10-26

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Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination