DK229285A - METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS - Google Patents

METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS Download PDF

Info

Publication number
DK229285A
DK229285A DK229285A DK229285A DK229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A
Authority
DK
Denmark
Prior art keywords
electronic circuits
assembling electronic
assembling
circuits
electronic
Prior art date
Application number
DK229285A
Other languages
Danish (da)
Other versions
DK229285D0 (en
Inventor
John Patrick Burke
Original Assignee
Dortrell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dortrell Ltd filed Critical Dortrell Ltd
Publication of DK229285A publication Critical patent/DK229285A/en
Publication of DK229285D0 publication Critical patent/DK229285D0/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DK229285A 1983-09-27 1985-05-23 METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS DK229285D0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08325803A GB2147148A (en) 1983-09-27 1983-09-27 Electronic circuit assembly
PCT/GB1984/000330 WO1985001634A1 (en) 1983-09-27 1984-09-27 Electronic circuit assembly

Publications (2)

Publication Number Publication Date
DK229285A true DK229285A (en) 1985-05-23
DK229285D0 DK229285D0 (en) 1985-05-23

Family

ID=10549343

Family Applications (1)

Application Number Title Priority Date Filing Date
DK229285A DK229285D0 (en) 1983-09-27 1985-05-23 METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS

Country Status (6)

Country Link
EP (1) EP0159331A1 (en)
JP (1) JPS61500047A (en)
KR (1) KR850700100A (en)
DK (1) DK229285D0 (en)
GB (1) GB2147148A (en)
WO (1) WO1985001634A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0218832B1 (en) * 1985-09-30 1990-11-22 Siemens Aktiengesellschaft Surface-mounted component and method of affixing a surface-mounted component
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
GB8727926D0 (en) * 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
DE3806738C1 (en) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
FR2629953B1 (en) * 1988-04-06 1991-07-05 Sagem ELECTRICAL COMPONENT, ESPECIALLY ELECTRIC MOTOR, EQUIPPED WITH DOUBLE PAIRS OF CONTACTS, PARTICULARLY FOR ALLOWING TWO DIFFERENT LOCATIONS ON A PRINTED CIRCUIT PLATE
EP0378233B1 (en) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same
DE58909875D1 (en) * 1989-05-31 2000-08-31 Osram Opto Semiconductors Gmbh Method for mounting a surface mount opto component
JPH03145186A (en) * 1989-10-30 1991-06-20 Mitsubishi Electric Corp Semiconductor module
JPH0828565B2 (en) * 1990-09-06 1996-03-21 ティーディーケイ株式会社 How to mount electronic components on printed circuit boards

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1221914A (en) * 1969-06-13 1971-02-10 Standard Telephones Cables Ltd Manufacture of integrated circuits
GB1467245A (en) * 1973-07-10 1977-03-16 Lucas Industries Ltd Method of securing component to a substrate
JPS53130831A (en) * 1977-04-20 1978-11-15 Schreiber Klaeranlagen Apparatus for cleaning dust receiving grate arranged in water way
JPS54155810A (en) * 1978-05-29 1979-12-08 Tdk Corp Bonding method of electronic parts
JPS5541793A (en) * 1978-09-20 1980-03-24 Matsushita Electric Ind Co Ltd Method of mounting microminiature part
JPS5726379Y2 (en) * 1978-09-21 1982-06-08
JPS5582487A (en) * 1978-12-18 1980-06-21 Sony Corp Electronic circuit device
JPS55144828A (en) * 1979-04-24 1980-11-12 Onishi Hitoshi Malt producing method and movable malt chamber
JPS55156482U (en) * 1979-04-26 1980-11-11
JPS5750497A (en) * 1980-09-11 1982-03-24 Mitsubishi Electric Corp Method of mounting electric part on printed board
DE3042043A1 (en) * 1980-11-07 1982-05-27 Nagel, Hans-Joachim, Dr., 2800 Bremen DEVICE FOR Fattening poultry
JPS5880894A (en) * 1981-11-10 1983-05-16 パイオニア株式会社 Method of producing printed board
JPS5885592A (en) * 1981-11-18 1983-05-21 パイオニア株式会社 Method of producing printed board
DE3226222A1 (en) * 1982-07-14 1984-01-26 Diehl GmbH & Co, 8500 Nürnberg DEVICE FOR CONNECTING AN ELECTRODE TO A CARRIER

Also Published As

Publication number Publication date
GB2147148A (en) 1985-05-01
EP0159331A1 (en) 1985-10-30
JPS61500047A (en) 1986-01-09
GB8325803D0 (en) 1983-10-26
WO1985001634A1 (en) 1985-04-11
DK229285D0 (en) 1985-05-23
KR850700100A (en) 1985-10-21

Similar Documents

Publication Publication Date Title
DK281784D0 (en) CYCLE DETERMINATION CIRCUIT
KR850009741U (en) Case for electronic devices
DK33291D0 (en) PROCEDURE FOR MANUFACTURING AN OPTICAL COMPONENT
DK361384D0 (en) PROCEDURE FOR MANUFACTURING A PRINTED CIRCUIT PLATE
KR850009742U (en) Case for electronic devices
DK164659C (en) METHOD FOR MANUFACTURING AROMATIC CARBOHYDRIDES
DK564082A (en) PROCEDURE FOR THE MANUFACTURING OF PRINTED CIRCUITS
DK382084A (en) PROCEDURE FOR PENEME MANUFACTURING
DK12385D0 (en) INTEGRATED CIRCUIT MODULE AND PROCEDURE FOR PRODUCING SAME
ES528336A0 (en) METHOD FOR ENCAPSULATING ELECTRONIC CIRCUITS
DK366684A (en) METHOD OF MANUFACTURING CEFUROXIMAXETIL
DK229285A (en) METHOD FOR ASSEMBLING ELECTRONIC CIRCUITS
DK210983A (en) PROCEDURE FOR MAKING CIRCUIT BOARDS
DK534783D0 (en) METHOD FOR OPTIMIZING DEHUMINATING DEVICES
DK133082A (en) METHOD FOR MANUFACTURING MERCAPTO-ACYL CARNITINES
DK614884A (en) PROCEDURE FOR MANUFACTURING BEEF
DK5283D0 (en) CIRCUIT FOR CREATING AN ACCOUNT DEPENDENT DEPENDENT
DK202983D0 (en) METHOD FOR MANUFACTURING L-LYSIN
DK132084D0 (en) PROCEDURE FOR MANUFACTURING MICROCAPPLES
DK166026C (en) METHOD FOR MANUFACTURING 20-KETO-DELTA16 STEROIDS
DK156389C (en) METHOD FOR MANUFACTURING NITROMETHAN
DK161754C (en) PROCEDURE FOR MANUFACTURING AN OPTICAL COMPONENT
DK614784A (en) PROCEDURE FOR MANUFACTURING BEEF
DK367684A (en) PROCEDURE FOR CONTROLING AN ELECTRONIC CIRCUIT FUNCTION
DK351883A (en) METHOD FOR MANUFACTURING NITROMETHAN

Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment