KR850005337A - How to Metallize a Substrate - Google Patents

How to Metallize a Substrate Download PDF

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Publication number
KR850005337A
KR850005337A KR1019840000047A KR840000047A KR850005337A KR 850005337 A KR850005337 A KR 850005337A KR 1019840000047 A KR1019840000047 A KR 1019840000047A KR 840000047 A KR840000047 A KR 840000047A KR 850005337 A KR850005337 A KR 850005337A
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KR
South Korea
Prior art keywords
varnish
substrate
transfer agent
electron beam
curing
Prior art date
Application number
KR1019840000047A
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Korean (ko)
Inventor
앨버트 팔(외 3) 커트
Original Assignee
원본미기재
유우로그라휙스 홀딩 나아무로오제 휀노오트샾
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Publication date
Application filed by 원본미기재, 유우로그라휙스 홀딩 나아무로오제 휀노오트샾 filed Critical 원본미기재
Priority to KR1019840000047A priority Critical patent/KR850005337A/en
Publication of KR850005337A publication Critical patent/KR850005337A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00Processes, not specifically provided for elsewhere, for producing decorative surface effects

Abstract

내용 없음No content

Description

기질을 금속화시키는 방법How to Metallize a Substrate

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

첨부도면은 본 발명에 따른 금속화 방법을 나타내는 순서도이다.The accompanying drawings are flowcharts showing the metallization method according to the present invention.

도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings

(20) : 전사제 (22) : 금속입자를 침착기시키는 단계 (24) : 기질 (26) : 바니쉬로 피복하는 단계 (28 ) : 적층단계 (30) : 전자비임에 의한 경화단계 (32) : 분리단계(20): transfer agent (22): depositing metal particles (24): substrate (26): coating with varnish (28): lamination step (30): curing step by electron beam (32) : Separation step

Claims (15)

두께가 실질적으로 1000Å 이하인 정도의 크기를 갖는 금속입자의 필름을 전사제상에 침착시키고, 이와 같이 금속화된 전사체와 기질중의 적어도 하나의 일부를 전자비임에 의한 경화가 가능한 바니쉬로 피복시키고, 이 바니쉬가 경화되기 전에 기질과 전사제를 적층시키고, 상기 바니쉬를 전자비임 조사(照射)에 의해 실질적으로 순간적으로 경화시키고, 이 경화단계가 완료된 직후에 기질로부터 전사제를 분리시키는 단계들로 구성되는, 재사용이 가능한 전사제를 사용하여 기질을 금속화시키는 방법.A film of metal particles having a size of about 1000 mm or less in thickness is deposited on the transfer agent, and at least one of the metallized transfer member and the substrate is coated with a varnish capable of curing with an electron beam, Stacking the substrate and the transfer agent before the varnish is cured, curing the varnish substantially instantaneously by electron beam irradiation, and separating the transfer agent from the substrate immediately after this curing step is completed. And metalizing the substrate using a reusable transfer agent. 제1항에 있어서, 상기 전사제가 폴리프로필렌, 폴리에틸렌, 폴리염화비닐, 폴리아미드, 재생 셀룰로우즈로 구성되는 군으로부터 선택된 수지인 방법.The method of claim 1 wherein the transfer agent is a resin selected from the group consisting of polypropylene, polyethylene, polyvinyl chloride, polyamide, regenerated cellulose. 제1항에 있어서, 상기 금속입자가 알루미늄, 은, 금, 구리, 니켈, 주석, 백금 및 이들 금속의 합금으로 구성되는 군으로부터 선택된 금속인 방법.The method of claim 1, wherein the metal particles are metals selected from the group consisting of aluminum, silver, gold, copper, nickel, tin, platinum and alloys of these metals. 제1항에 있어서, 상기 바니쉬가 기질의 전체 표면을 덮지는 않는 특정한 도형으로 피복되는 방법.The method of claim 1, wherein the varnish is covered with a particular figure that does not cover the entire surface of the substrate. 제1항에 있어서, 상기 기질이 종이, 마분지, 나무, 가죽 및 플라스틱으로 구성되는 군으로부터 선택되는 방법.The method of claim 1, wherein the substrate is selected from the group consisting of paper, cardboard, wood, leather, and plastic. 제1항에 있어서, 상기 전자비임 경화단계에서 바니쉬를 중합시키는 방법.The method of claim 1, wherein the varnish is polymerized in the electron beam curing step. 제1항의 방법에 의해 형성된 제품.An article formed by the method of claim 1. 금속입자의 얇은 필름을 전사제상에 침착시키고, 이와 같이 금속화된 전사제와 기질중의 적어도 하나의 적어도 예정된 부분을 전자비임에 의한 경화가 가능한 바니쉬로 피복시키고, 이 바니쉬가 경화되기 전에 상기 기질과 금속화된 전사체를 적층시킴으로써 적층물을 형성시키고, 이 적층물을 전자비임 조사에 노출시킴으로써 상기 바니쉬를 실질적으로 순간적으로 경화시키고, 이와 같은 노출단계가 수행된 실질적으로 직후에 기질로부터 전사제를 적층해제시키고, 기질상의 상기 적어도 예정된 부분의 금속피복에 실질적으로 겹쳐서 인쇄를 실시하는 단계들로 구성되는, 기질의 적어도 예정된 부분상에 광택이 있는 금속피복을 생성시키는 방법.A thin film of metal particles is deposited on the transfer agent, and at least one predetermined portion of the metallized transfer agent and the substrate is coated with a varnish capable of curing with an electron beam, and the substrate is cured before the varnish is cured. A laminate is formed by laminating a metallized transfer material and the laminate is exposed to electron beam irradiation to substantially instantaneously cure the varnish, and a transfer agent from the substrate substantially immediately after such an exposure step is performed. And unlaminating, and performing printing overlying the metal coating of the at least predetermined portion on the substrate. 제8항에 있어서, 상기 피복단계 및 상기 인쇄단계가 그라비아 프레스(gravure press)의 사용에 의해 수행되는 방법.9. The method of claim 8, wherein said coating step and said printing step are performed by use of a gravure press. 제8항에 있어서, 상기 금속입자의 얇은 필름의 두께가 실질적으로 100Å이하인 정도의 크기를 갖는 방법.The method of claim 8, wherein the thickness of the thin film of the metal particles is substantially 100 mm 3 or less. 제8항에 있어서, 상기 전사제가 폴리프로필렌, 폴리에틸렌, 폴리염화비닐, 폴리아미드, 재생셀룰로우즈로 구성되는 군으로부터 선택된 수지인 방법.The method of claim 8, wherein the transfer agent is a resin selected from the group consisting of polypropylene, polyethylene, polyvinyl chloride, polyamide, regenerated cellulose. 제11항에 있어서, 상기 전시제는 구조화된 표면을 가지고 있으며, 따라서 상기 금속피복은 이 전사제의 구조화된 표면의 복제형태(replica)로 형성되도록 되어 있는 방법.The method of claim 11, wherein the display agent has a structured surface, such that the metallization is adapted to form a replica of the structured surface of the transfer agent. 제8항에 있어서, 상기 노출단계의 전에, 전사제쪽이 전자비임 조사원(源)에 먼저 노출되도록 적층물을 배향시키는 방법.The method of claim 8, wherein, prior to the exposing step, the stack is oriented such that the transfer agent side is first exposed to an electron beam source. 제8항에 있어서, 상기 피복단계의 전에 상기 바나쉬를 용매로 희석시키고, 상기 적층단계의 전에 이 용매의 적어도 일부를 증발시킴으로써 바니쉬의 점도를 증가시키는 단계들이 더욱 포함되는 방법.The method of claim 8 further comprising increasing the viscosity of the varnish by diluting the varnish with a solvent prior to the coating step and evaporating at least a portion of the solvent prior to the lamination step. 제14항에 있어서, 상기 증발단계가 바니쉬를 오븐내에서 고온으로 건조시키는 것으로 구성되는 방법.15. The method of claim 14, wherein said evaporating comprises drying the varnish to a high temperature in an oven. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019840000047A 1984-01-07 1984-01-07 How to Metallize a Substrate KR850005337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019840000047A KR850005337A (en) 1984-01-07 1984-01-07 How to Metallize a Substrate

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Application Number Priority Date Filing Date Title
KR1019840000047A KR850005337A (en) 1984-01-07 1984-01-07 How to Metallize a Substrate

Publications (1)

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KR850005337A true KR850005337A (en) 1985-08-24

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KR1019840000047A KR850005337A (en) 1984-01-07 1984-01-07 How to Metallize a Substrate

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