KR840008227A - Filtration splicer - Google Patents

Abstract

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Description

Filtration splicer

Since this is an open matter, no full text was included.

1 is a partial cross-sectional perspective view showing the assembly of the filter connector according to the present invention.

2 is a vertical sectional view showing a part of the assembly shown in FIG.

3 is a cross-sectional view taken along line 3-3 of the filter connector shown in FIG.

Claims (25)

A housing, a filtration element enclosed within the housing, and an electroconductive pin mounted within the filtration element, wherein the filtration element has two horizontal planes comprising holes in the electrical filtration connector for damping electromagnetic interference. And a plurality of thick film capacitors located in close contact with each other formed by screen-printing a plurality of layers on an alumina substrate having an alumina substrate, and electrically conductive pins mounted thereon, wherein one layer forms a ground electrode in electrical contact with the housing. Filtration characterized by thick metallization coating substantially covering one horizontal plane of the substrate and having holes in the layer forming the ground electrode having a diameter sufficient to pass through the conductive pins without touching the ground electrode. Splicer. 2. The layer of claim 1, wherein the layer forming the ground electrode is a first layer applied to the substrate, and the second layer is a layer of insulating dielectric material that surrounds at least each hole in the substrate except the electrical contact area. The third layer is applied on the ground electrode, and the third layer is a thick metallized film forming an intermittent pin electrode. The third layer is applied on the second layer to the portion surrounding each hole in the substrate, and is in electrical contact with the pin. And the filter connector which is to be insulated. 3. The filter connector of claim 2, wherein the fourth layer is a layer of nonconductive encapsulant that covers all exposed layers except for the electrical contact areas and has a coefficient of expansion that is compatible with other layers. The filter connector according to claim 3, wherein the first layer of the filtration element is a metallization layer of noble metal. 4. A filter splicer according to claim 3, wherein the first layer of filtration elements is a metallization layer of palladium / negative alloy. The filter connector according to claim 3, wherein the third layer of the filtration element is a metallization layer of a noble metal. The filter connector according to claim 3, wherein the third layer of the filtration element is a metallization layer of palladium / silver alloy. The filter connector according to claim 3, wherein the first layer of the light filtering element is a metallization layer of copper. The filter connector according to claim 3, wherein the third layer of the filtering element is a metallization layer of copper. The filter splicer according to claim 2, wherein the third metallization layer is in the form of an arrowhead. The filtration connector of claim 1 wherein an iron sleeve is arranged to surround each of the electrically conductive pins. A housing, a filtration element enclosed within the housing, and an electrically conductive pin mounted within the filtration element, wherein the filtration element is designed to attenuate electromagnetic interference. Consisting of a film capacitor, each film capacitor containing a pin in a hole in an alumina substrate having at least two flat horizontal planes and having a plurality of screen printed layers thereon, the first layer being a metallization layer of a precious metal An electrode grounded to the housing and substantially covering one horizontal plane of the substrate, the first layer having holes having a diameter sufficient to pass the conductive pins without touching the layer, the second layer being an insulating dielectric Layer of material that The outer layer substantially covers the first layer and at the same time overlaps annularly with the first layer around each hole, and the third layer is a metallization layer that forms an intermittent pin electrode and surrounds each hole in the substrate. The fourth layer is a layer of nonconductive encapsulant, which has a coefficient of expansion that is compatible with the substrate and other layers and covers all exposed layers except the electrical contact area. Filtration adapter made. 13. The filter connector of claim 12, wherein a metallization layer forming the pin electrode extends into and adheres to respective pores in the substrate. 2. The metal of claim 1 wherein the ground electrode is a second layer and a third layer applied over substantially all horizontal planes of the substrate, the first layer being a metal applied to the substrate around each hole in the substrate to form an intermittent pin electrode. And a second layer is a layer of dielectric material applied on each pin electrode. 15. The filter connector of claim 14, wherein the fourth layer is a layer of nonconductive encapsulant and has a coefficient of expansion that is compatible with the substrate and other layers and is adapted to cover all exposed layers except for the electrical contact area. The filtration splicer according to claim 15 wherein the first layer of filtration elements is a metallization layer of precious metal. The filter splicer according to claim 15, wherein the first layer of the filtration element is a metallization layer of palladium / silver alloy. The filtration splicer according to claim 15 wherein the third layer of filtration elements is a metallization layer of precious metal. 16. The filter splicer of claim 15 wherein the third layer of filtration elements is a metallization layer of a palladium / silver alloy. The filtration splicer according to claim 15 wherein the first layer of filtration elements is a metallization layer of copper. The filtration splicer according to claim 15 wherein the third layer of filtration elements is a metallization layer of copper. 15. The filter splicer according to claim 14 in the form of an arrowhead which is the first metallization layer. A housing, a filtration element enclosed within the housing, and an electrically conductive pin mounted within the filtration element, wherein the filtration element is a plurality of thickly positioned ones which are closely located together. Consisting of film capacitors, each film capacitor containing pins in holes in an alumina substrate having at least two flat horizontal planes and having a plurality of layers of screen printed thereon, the first layer forming intermittent pin electrodes A metallization layer of noble metal applied to the substrate around and within each hole, the first layer being in electrical contact with the electrically conductive pins passing through the hole in the substrate, the second layer excluding the electrical contact area. Layer of insulating dielectric material superimposed on the first layer, The first layer is a metallization layer of the noble metal forming the ground electrode, which overlaps substantially the entirety of the second layer and one horizontal plane of the substrate, and the fourth layer is a layer of non-conductive encapsulant that is compatible with the substrate and other layers Filter connectors characterized in that they have a coefficient and cover all exposed layers except for the electrical contact areas. 24. The filter connector of claim 23, wherein a metallization layer forming the pin electrode extends into and adheres to respective pores in the substrate. The filtration connector according to claim 1, wherein an electrical connection is made between the electrically conductive housing on one horizontal surface of the substrate and the ground electrode. ※ Note: The disclosure is based on the initial application.