CA1216033A - Filter connector - Google Patents
Filter connectorInfo
- Publication number
- CA1216033A CA1216033A CA000450908A CA450908A CA1216033A CA 1216033 A CA1216033 A CA 1216033A CA 000450908 A CA000450908 A CA 000450908A CA 450908 A CA450908 A CA 450908A CA 1216033 A CA1216033 A CA 1216033A
- Authority
- CA
- Canada
- Prior art keywords
- layer
- filter
- substrate
- connector according
- filter element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
- H01R13/7195—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with planar filters with openings for contacts
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Lubrication Details And Ventilation Of Internal Combustion Engines (AREA)
- Cleaning And Drying Hair (AREA)
- Centrifugal Separators (AREA)
- Glass Compositions (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
TITLE FILTER CONNECTOR ABSTRACT A filter connector for attentuating electromagnetic interference up to 1000 MHz having a housing, a filter element enclosed within the housing and electrically conductive pins mounted within the filter element. The filter element contains an alumina substrate with thick film layers of a metallization forming pin and ground electrodes, and a dielectric layer separating the electrodes screen printed over the substrate and a glass encapsulant. The ground electrode substantially covers a horizontal surface of the substrate.
Description
6~33 TITLE
FILTER CONNECTOR
~aclc~round oE the Invention 1. Field of the Invention ~ his invention relates to a filter connector for reducing electroma~netic interference in electrical devices. ~tore particularly, it refers to a filter connector having a series of thick film capacitors ~ith holes within the various elements of the capacitors, each accommodating an electrically conductive pin and attenuating various frequencies applied to the pinO
FILTER CONNECTOR
~aclc~round oE the Invention 1. Field of the Invention ~ his invention relates to a filter connector for reducing electroma~netic interference in electrical devices. ~tore particularly, it refers to a filter connector having a series of thick film capacitors ~ith holes within the various elements of the capacitors, each accommodating an electrically conductive pin and attenuating various frequencies applied to the pinO
2. Background of the Invention Filter connectors for attenuating hi~h ~requency interference from electrical devices are well known Erom several patents; e.g., U.S. Patent
3,538,464, U.S. 4,126,840, U.S. 4,144,509 and U.S. 4,187,481. In each of these paten~s, a capacitor employed ~ith the filter is a series of 2D ceramic layers ~orming a monolithic structure. Thick film capacitors are also we}l known from U.S. Patent
4,274,124. Although monolithic capacitors are currently used in filter connectors, i~ has not been - practical heretofore to substitute thick fil~
capacitors such as shown in U.S. 4,274,1~4 for ~hese monolithic capacitors. ProbleMs have occurred in designing a thick film capacitor for a filter connector which has a low enough inductance to attenuate high frequencies.
In recent years, the common usage of computers and particularly home computers has resulted in the generation of significant additional amounts of high frequency electromagnetic signals in~erfering with other electrical deYices. ~or the EL-4218 35 purpose of reducing the output of such signals, the ~2~6~)3~
United States Federal Communications Commission (~CC) has promulgated regulations requiring attenuation at their source. See 47 CFR 15, Subpart J.
Available monolithic capacitor structures us~ in ~ilters are not cost e~fective f~r use in low-cost electronic equipment such as the ~ersonal computer. Since the cost of producing a filter connectox can be ~reatly diminislled hy usin~ thick film capaci~ors, a filter connector employin~ such a ~0 thick film capacitor with a low inductance is needed~ A useful commercial filter attenuates the electromagnetic signal at least 30 decibels (d~) at a lOOn me~aher~z (Mllz) frequency.
9b~:~
This invention is a cost effective electrical filter connector for filterin~ a ~ide band of frequencies up to 1000 ~z using a particular de~i~n of thick film capacitor in rel~eating scquenc~
to form the filter element. The filter element comprise~ a multiplicity of closely spaced thick film capacitors, each one having a conductive pin mounte~
in a hole through a capacitor, The capacitor has multiple layers of screen printed materials over an alumina substrate having two horizontal surfaces and ~hich is generally rectangular in shape, One layer is a metallization forming a ground electrode. This electrode is grounded to the connector housing. It substantially covers an entire horizontal surface of the alumina substrate and has holes sufficient in si2e to accommodate the conductive pins but without touching any of the pins.
Another layer is a metallization forming a pin electrode, but its area is limited to a portion around a given hole in the substrate~ This la~er is in electrical contact with the pin throu~h a solder ~2~ 33 joint, In between the two electrodes is a layer, dielectric in nature, applied directly over one of tlle e~ectrodes. Thi~ layer substantially overlaps a horizontal surface of the ground electrode when it is the first layer l~ut allows the two l~n~est ~ es on each side o~ the ground electrode to remain ex~osed.
This la~er also has holes barely sufficient to allow con~uctive pins to pass throu~h witltout touchiny the dielectric material. The Zielectric material also covers the vertical surface of the ground electrode which is nearest each ~lole.
A fourth and last layer is a nonconAuctive enca~slllant for excludin~ moisture coverin~ all layers except electrical contac~ing or solderin~
areas. This filter connector maintains a substantial attenuation in the ultra high frequency ran~e up to at least 1000 ~Hz.
~he present invention may be best understood by those having ordinary skill in the art by reference to the followin~ detailed description when considered in conjunction with the accompanying drawings in which:
FIG. 1 is an isometric view of an assembly, partially sectioned, of the filter connector;
FIG. 2 is a partial elevational view of the filter connector in section;
FIG. 3 is a transverse sectional view along lines 3-3 of the filter sonnector of FIG. l;
FIG. 4 is a section through a single capacitor unit of a filter element assembled to a pin;
FIG. 5 is an exploded vie~ of a filter elemen~ containing multiple capacitor units shown in FIG. 4;
FIG. 6 is a perspective view sf the filter element member shown in FIG. 5;
1~6~)~3 FIG. 7 is a magnified view in cross section alon~ lines 7-7 of FIG; 6;
l~IG. 8 is a partial sectional view of the ~ilter connector having a ferrite sleeve around each S pin; an(l FIG. 9 is a graph showing an attentuation curve for a rilter connector wllere the ~round electro~e does not cover the substrate colnp~red Witi one shown in FIGS. 1-7.
D=~
Referring first to FIG. lf filter connector comprises a llousing lO havin~ a top shell 12 an~ a bot~oln shell 14. ~lousing lO encloses two rows of pins 18 mounted on a filter member 16. The interior of connector 8 is protected by a top lnsulator 20 an~l a bottom insulator 38. Pins 18 are individually mounted on filter element 16 by solder joints 22.
Threaded insert 28 can be inclu~e~ in the connector optionally to provide a moun~ing fixture to 2n a ca~inet. Ground contacts 32 are made available on the top shell 12 to provide a ground contact for a female plug (not shown) inserted over the pins 18.
The two shells 12 and 14 are crimped together by a tah 40. Pins 18 can ~e either straight or right-angled 34 as shown in FIGS. 1-3. FIGS. 2-4 show the solder joints 22 where the pin 18 is attached to the filter element 16. ~oles 31 in the bottom insulator 38 provide bottom exit for pins 18.
Hole 30 in the filter member 16 provides the means for passage of pins 18 through the filter member and the location of solder joint 22.
The structure of filter element 16 is seen by reference to FI~S. 4 and 5. PIG. 4 shows only one capacitor unit within the filter element 16 for illustration purposes. The filter element comprises ~Z ~603~
s an alumina subs~.rate 42 which has screen printed on one hoeizontal surface a metallization ~4. ~his metalliza~ion forms a ~round electrode that is sui~sequently soldered 36 to the shell 1~. The ground electro(~e covers substantially the ~ntire surface of the alumina substrate 42. It has holes 24, seen in ! FIG~ 5, ~hich are large enou~h to accommodate the pins 18 without touching the pins.
The ground electrode 44 is par~ially covere~
by a screen ~rinted layer of dielectric 46. For ; purposes of this specification, a single layer of dielectric is mentioned although in practice two l~ers of dielectric ~6 and ~ are screen }~rin~ed over the ground electrode to provide more than adequate protection against shorting between electrodes. As seen in FIG. 5, the dielectric laye~
46~48 also has holes 26 which are sli~htly larger than the diameter of the ~ins 13. The dielectric 46/48 covers the horizontal surface of the electrode 4~ except for the edges 43 and 45 whi~h are soldering areas used for the ground to the shell 14. ~he dielectric ~6/48 also is~applied on the vertical edge of the ground electrode 44 t~hich is contiguous with the holes 24 as seen in FIG. 4.
A second metallization la~er 50-is scre~n printed intermitt~n~ly in a regular pattern usually - arrowhead shaped over the dielectric layer. This forms a series of pin electrodes 50, each of ~hich is in electrical con~act with a pin 1~ through solder ~oint 22. This electrode is screen printed in such a manner as to form a series of discrete spaced apart arrowhead-shaped layers distributed over the surface o dielectric 46/48 as seen in FIGS. 5 and 6. There is one electrode 50 contiguous with each hole 26 and 3S also annularly surrounding ~he holes 41. ~he last ~2~L6~33 layer, glass encapsulant: 52/54, covers both the electrodes 50 and dielectric 46/48. Altllou~h only one layer is shown i~ FIG. 5, in practice two layers of encapsulant are usually screen print~d over the electro~]e 50 for added safety. For }~url~oses of this speciEication, when talking about a layer of encapsulant, one or more layers OL encapsulant is Ineant. The arrowhea(3 desi~n of the elec~rocle 50 provides a means for closely spacing ~he car~acitors used in the filtex connector and, hence~ increasin~
tlle area 5~ the capacitor and there~ore i~s capacitance value. of course, other designs cou~d be used which sa~is~y the ~urpose of producing capacitors of the type employed in this invention.
It is preferred that the metallizations used in layers one and three be a noble metal or an alloy of a noble metal. However, copper metallization compositions could be employed. Particularly preferred is a palladium/silver alloy metallization.
Each layer is applied using conventional screen printing methods. The dielectric employed can be any type commonly used in capacitors. However, barium titanate is preferred.
The glass encapsulant can be any one of the types used in capacitors having a coerficient of expansion compatible with the other components employed.
A ferrite sleeve 19 also can be attached to the pin 18, as seen in FIG. 8. Such sleeves are well kno~m as seen in U.5. Patent 4,1~4,509. The use of the particular filter member of this invention will increase the filtering action of filter connectors employing ~errites, Metallizations used in this,invention are made Erom compositions containins a finely divided )33 metal powder of either a noble metal or copper, a binder for ~he metal and a vehicle to disperse the powders evenly. The com~osition is applied ~y screen printing methods and the vehicle is removed from the applie~ composition ~y ~irin~ the screen~ on layer by convent ional techniques .
Although the drawings FIGS. ~-5 depict the ~roun-3 electrode 44 as l~eing applied as ~he Eirst metalli2ation layer and the pin electrode 50 as the third layerl this can he reversed. Therefore, pin electrode 50 can be screen printed directly to the alumina 42 around each hole 41. The layers 46 and 4 are then applied to overlap the layer 50 exce~t ~or the solder area 22. The ~round electrode 44 would then ~e screen printed over the layers 46 and 48 and all exposed hcrizontal surfaces of ~he alumina substrate 42. The encapsulant 52/54 is applied in the same manner as in ~IC. 4. The enca~sulallt covers all exposed surfaces except for edges 43 and 45 whicl are soldex areasr The low inductance at hi~h ~requencies achieved by this invention is a direct result of the geometry of the ground electrode as related to the pin electrode. If the ground electrode and dielectric are placed only to one side of the pin, the attenuation curve ~a) of PIG. 9 results. This curve shows a reduced attenuation and hence reduced filtering action in tne ultra high frequency range, par~icularly above 200 ~1Hz and more particularly above 700 ~z. The reason for this reduced attenuation is that the capacitor has a series resonance around 200 M~z ~shown by the sharp peak in curve (a)) caused ~y the inductance of the electrodes of the capacitor.
6()33 When ~he ground electrode extends substantially over the entire suhstrate and the dielectric surrounds the hole, the current flow fro~
the pin can divide into ti~o components, each flo~in~
to~ar(~ a ~roun(l connection on each 5ide 0~ t~le filter element 16. This results in a decreased effective electrode inductance by providing two parallel current paths. The decreased inductance results in an increased series resonant frequency and an increased attenuation such as is shown in curve ~b) of FIG. 9.
capacitors such as shown in U.S. 4,274,1~4 for ~hese monolithic capacitors. ProbleMs have occurred in designing a thick film capacitor for a filter connector which has a low enough inductance to attenuate high frequencies.
In recent years, the common usage of computers and particularly home computers has resulted in the generation of significant additional amounts of high frequency electromagnetic signals in~erfering with other electrical deYices. ~or the EL-4218 35 purpose of reducing the output of such signals, the ~2~6~)3~
United States Federal Communications Commission (~CC) has promulgated regulations requiring attenuation at their source. See 47 CFR 15, Subpart J.
Available monolithic capacitor structures us~ in ~ilters are not cost e~fective f~r use in low-cost electronic equipment such as the ~ersonal computer. Since the cost of producing a filter connectox can be ~reatly diminislled hy usin~ thick film capaci~ors, a filter connector employin~ such a ~0 thick film capacitor with a low inductance is needed~ A useful commercial filter attenuates the electromagnetic signal at least 30 decibels (d~) at a lOOn me~aher~z (Mllz) frequency.
9b~:~
This invention is a cost effective electrical filter connector for filterin~ a ~ide band of frequencies up to 1000 ~z using a particular de~i~n of thick film capacitor in rel~eating scquenc~
to form the filter element. The filter element comprise~ a multiplicity of closely spaced thick film capacitors, each one having a conductive pin mounte~
in a hole through a capacitor, The capacitor has multiple layers of screen printed materials over an alumina substrate having two horizontal surfaces and ~hich is generally rectangular in shape, One layer is a metallization forming a ground electrode. This electrode is grounded to the connector housing. It substantially covers an entire horizontal surface of the alumina substrate and has holes sufficient in si2e to accommodate the conductive pins but without touching any of the pins.
Another layer is a metallization forming a pin electrode, but its area is limited to a portion around a given hole in the substrate~ This la~er is in electrical contact with the pin throu~h a solder ~2~ 33 joint, In between the two electrodes is a layer, dielectric in nature, applied directly over one of tlle e~ectrodes. Thi~ layer substantially overlaps a horizontal surface of the ground electrode when it is the first layer l~ut allows the two l~n~est ~ es on each side o~ the ground electrode to remain ex~osed.
This la~er also has holes barely sufficient to allow con~uctive pins to pass throu~h witltout touchiny the dielectric material. The Zielectric material also covers the vertical surface of the ground electrode which is nearest each ~lole.
A fourth and last layer is a nonconAuctive enca~slllant for excludin~ moisture coverin~ all layers except electrical contac~ing or solderin~
areas. This filter connector maintains a substantial attenuation in the ultra high frequency ran~e up to at least 1000 ~Hz.
~he present invention may be best understood by those having ordinary skill in the art by reference to the followin~ detailed description when considered in conjunction with the accompanying drawings in which:
FIG. 1 is an isometric view of an assembly, partially sectioned, of the filter connector;
FIG. 2 is a partial elevational view of the filter connector in section;
FIG. 3 is a transverse sectional view along lines 3-3 of the filter sonnector of FIG. l;
FIG. 4 is a section through a single capacitor unit of a filter element assembled to a pin;
FIG. 5 is an exploded vie~ of a filter elemen~ containing multiple capacitor units shown in FIG. 4;
FIG. 6 is a perspective view sf the filter element member shown in FIG. 5;
1~6~)~3 FIG. 7 is a magnified view in cross section alon~ lines 7-7 of FIG; 6;
l~IG. 8 is a partial sectional view of the ~ilter connector having a ferrite sleeve around each S pin; an(l FIG. 9 is a graph showing an attentuation curve for a rilter connector wllere the ~round electro~e does not cover the substrate colnp~red Witi one shown in FIGS. 1-7.
D=~
Referring first to FIG. lf filter connector comprises a llousing lO havin~ a top shell 12 an~ a bot~oln shell 14. ~lousing lO encloses two rows of pins 18 mounted on a filter member 16. The interior of connector 8 is protected by a top lnsulator 20 an~l a bottom insulator 38. Pins 18 are individually mounted on filter element 16 by solder joints 22.
Threaded insert 28 can be inclu~e~ in the connector optionally to provide a moun~ing fixture to 2n a ca~inet. Ground contacts 32 are made available on the top shell 12 to provide a ground contact for a female plug (not shown) inserted over the pins 18.
The two shells 12 and 14 are crimped together by a tah 40. Pins 18 can ~e either straight or right-angled 34 as shown in FIGS. 1-3. FIGS. 2-4 show the solder joints 22 where the pin 18 is attached to the filter element 16. ~oles 31 in the bottom insulator 38 provide bottom exit for pins 18.
Hole 30 in the filter member 16 provides the means for passage of pins 18 through the filter member and the location of solder joint 22.
The structure of filter element 16 is seen by reference to FI~S. 4 and 5. PIG. 4 shows only one capacitor unit within the filter element 16 for illustration purposes. The filter element comprises ~Z ~603~
s an alumina subs~.rate 42 which has screen printed on one hoeizontal surface a metallization ~4. ~his metalliza~ion forms a ~round electrode that is sui~sequently soldered 36 to the shell 1~. The ground electro(~e covers substantially the ~ntire surface of the alumina substrate 42. It has holes 24, seen in ! FIG~ 5, ~hich are large enou~h to accommodate the pins 18 without touching the pins.
The ground electrode 44 is par~ially covere~
by a screen ~rinted layer of dielectric 46. For ; purposes of this specification, a single layer of dielectric is mentioned although in practice two l~ers of dielectric ~6 and ~ are screen }~rin~ed over the ground electrode to provide more than adequate protection against shorting between electrodes. As seen in FIG. 5, the dielectric laye~
46~48 also has holes 26 which are sli~htly larger than the diameter of the ~ins 13. The dielectric 46/48 covers the horizontal surface of the electrode 4~ except for the edges 43 and 45 whi~h are soldering areas used for the ground to the shell 14. ~he dielectric ~6/48 also is~applied on the vertical edge of the ground electrode 44 t~hich is contiguous with the holes 24 as seen in FIG. 4.
A second metallization la~er 50-is scre~n printed intermitt~n~ly in a regular pattern usually - arrowhead shaped over the dielectric layer. This forms a series of pin electrodes 50, each of ~hich is in electrical con~act with a pin 1~ through solder ~oint 22. This electrode is screen printed in such a manner as to form a series of discrete spaced apart arrowhead-shaped layers distributed over the surface o dielectric 46/48 as seen in FIGS. 5 and 6. There is one electrode 50 contiguous with each hole 26 and 3S also annularly surrounding ~he holes 41. ~he last ~2~L6~33 layer, glass encapsulant: 52/54, covers both the electrodes 50 and dielectric 46/48. Altllou~h only one layer is shown i~ FIG. 5, in practice two layers of encapsulant are usually screen print~d over the electro~]e 50 for added safety. For }~url~oses of this speciEication, when talking about a layer of encapsulant, one or more layers OL encapsulant is Ineant. The arrowhea(3 desi~n of the elec~rocle 50 provides a means for closely spacing ~he car~acitors used in the filtex connector and, hence~ increasin~
tlle area 5~ the capacitor and there~ore i~s capacitance value. of course, other designs cou~d be used which sa~is~y the ~urpose of producing capacitors of the type employed in this invention.
It is preferred that the metallizations used in layers one and three be a noble metal or an alloy of a noble metal. However, copper metallization compositions could be employed. Particularly preferred is a palladium/silver alloy metallization.
Each layer is applied using conventional screen printing methods. The dielectric employed can be any type commonly used in capacitors. However, barium titanate is preferred.
The glass encapsulant can be any one of the types used in capacitors having a coerficient of expansion compatible with the other components employed.
A ferrite sleeve 19 also can be attached to the pin 18, as seen in FIG. 8. Such sleeves are well kno~m as seen in U.5. Patent 4,1~4,509. The use of the particular filter member of this invention will increase the filtering action of filter connectors employing ~errites, Metallizations used in this,invention are made Erom compositions containins a finely divided )33 metal powder of either a noble metal or copper, a binder for ~he metal and a vehicle to disperse the powders evenly. The com~osition is applied ~y screen printing methods and the vehicle is removed from the applie~ composition ~y ~irin~ the screen~ on layer by convent ional techniques .
Although the drawings FIGS. ~-5 depict the ~roun-3 electrode 44 as l~eing applied as ~he Eirst metalli2ation layer and the pin electrode 50 as the third layerl this can he reversed. Therefore, pin electrode 50 can be screen printed directly to the alumina 42 around each hole 41. The layers 46 and 4 are then applied to overlap the layer 50 exce~t ~or the solder area 22. The ~round electrode 44 would then ~e screen printed over the layers 46 and 48 and all exposed hcrizontal surfaces of ~he alumina substrate 42. The encapsulant 52/54 is applied in the same manner as in ~IC. 4. The enca~sulallt covers all exposed surfaces except for edges 43 and 45 whicl are soldex areasr The low inductance at hi~h ~requencies achieved by this invention is a direct result of the geometry of the ground electrode as related to the pin electrode. If the ground electrode and dielectric are placed only to one side of the pin, the attenuation curve ~a) of PIG. 9 results. This curve shows a reduced attenuation and hence reduced filtering action in tne ultra high frequency range, par~icularly above 200 ~1Hz and more particularly above 700 ~z. The reason for this reduced attenuation is that the capacitor has a series resonance around 200 M~z ~shown by the sharp peak in curve (a)) caused ~y the inductance of the electrodes of the capacitor.
6()33 When ~he ground electrode extends substantially over the entire suhstrate and the dielectric surrounds the hole, the current flow fro~
the pin can divide into ti~o components, each flo~in~
to~ar(~ a ~roun(l connection on each 5ide 0~ t~le filter element 16. This results in a decreased effective electrode inductance by providing two parallel current paths. The decreased inductance results in an increased series resonant frequency and an increased attenuation such as is shown in curve ~b) of FIG. 9.
Claims (25)
1. In an electrical filter connector for attenuating electromagnetic interference having a housing, a filter element enclosed within the housing and electrically conductive pins mounted within the filter element, the improvement whereby the filter element comprises a multiplicity of closely spaced thick film capacitors formed by screen printing multiple layers over an alumina substrate having two flat horizontal surfaces containing holes and electrically conductive pins mounted thereon, one layer being a thick film metallization forming a ground electrode in electrical contact with the connector housing and substantially covering one horizontal surface of the substrate and having holes within the ground electrode sufficient in diameter to allow the conductive pins to pass without touching the electrode.
2. A filter connector according to claim 1 wherein the ground electrode layer is the first layer applied to the substrate, a second layer being an insulating dielectric material applied over the ground electrode at least in the area surrounding each substrate hole but exclusive of an electrical contacting area and a third layer being a thick film metallization forming a discrete pin electrode applied over the second layer in the area surrounding each substrate hole thereby being in electrical contact with a pin and insulated from the ground electrode.
3. A filter connector according to claim 2 wherein a fourth layer is a nonconducting encapsulant having a compatible coefficient of expansion covering all exposed layers exclusive of electrical contacting areas.
4. A filter connector according to claim 3 wherein the first layer of the filter element is a noble metal metallization.
5. A filter connector according to claim 3 wherein the first layer of the filter element is a palladium/silver alloy metallization.
6. A filter connector according to claim 3 wherein the third layer of the filter element is a noble metal metallization.
7. A filter connector according to claim 3 wherein the third layer of the filter element is a palladium/silver alloy metallization.
8. A filter connector according to claim 3 herein the first layer of the filter element is a copper metallization.
9. A filter connector according to claim 3 wherein the third layer of the filter element is a copper metallization.
10. A filter connector according to claim 2 wherein the third layer metallization is in the shape of an arrowhead.
11. A filter connector according to claim 1 wherein a ferrite sleeve encloses each conductive pin.
12. In an electrical filter connector for attenuating electromagnetic interference having a housing, a filter element enclosed within the housing and electrically conductive pins mounted within the filter element, the improvement whereby the filter element comprises a multiplicity of closely spaced thick film capacitors, each one accommodating a pin within holes in an alumina substrate having two flat horizontal surfaces and having multiple layers screen printed over the substrate, a first layer being a noble metal metallization forming an electrode grounded to the connector housing and substantially covering one horizontal surface of the substrate, the first layer having holes therein sufficient in diameter to allow the conductive pins to pass without touching the first layer, a second layer being a dielectric insulating material, the second layer substantially covering the first layer except for exterior electrical contacting areas and annularly overlapping the first layer around each hole, a third layer being a metallization forming a discrete pin electrode surrounding each substrate hole and applied to annularly overlap the second layer, and a fourth layer being a nonconducting encapsulant having a coefficient of expansion compatible with the other layers together with substrate and covering all exposed layers exclusive of electrical contacting areas.
13. A filter connector according to claim 12 wherein the pin electrode metallization extends within and adheres to each substrate hole.
14. A filter connector according to claim 1 wherein the ground electrode is a third layer applied over a second layer and substantially all the horizontal surface of the substrate, a first layer being a metallization forming a discrete pin electrode applied over the substrate to surround each substrate hole and the second layer being a dielectric material applied over each pin electrode.
15. A filter connector according to claim 14 wherein a fourth layer is a nonconducting encapsulant having a coefficient of expansion compatible with the other layers together with substrate and covering all exposed layers exclusive of electrical contacting areas.
16. A filter connector according to claim 15 wherein the first layer of the filter element is a noble metal metallization.
17. A filter connector according to claim 15 wherein the first layer of the filter element is a palladium/silver alloy metallization.
18. A filter connector according to claim 15 wherein the third layer of the filter element is a noble metal metallization.
19. A filter connector according to claim 15 wherein the third layer of the filter element is palladium/silver alloy metallization.
20. A filter connector according to claim 15 wherein the first layer of the filter element is a copper metallization.
21. A filter connector according to claim 15 wherein the third layer of the filter element is a copper metallization.
22. A filter connector according to claim 14 wherein the first layer metallization is in the shape of an arrowhead.
23. In an electrical filter connector for attenuating electromagnetic interference having a housing, a filter element enclosed within the housing and electrically conductive pins mounted within the filter element, the improvement whereby the filter element comprises a multiplicity of closely spaced thick film capacitors, each capacitor accommodating a pin within holes in an alumina substrate having two flat horizontal surfaces and having multiple layers screen printed over the substrate, a first layer being a noble metal metallization forming a discrete pin electrode applied over the substrate around and within each hole, the first layer being in electrical contact with a conductive pin passing through the substrate hole, a second layer being a dielectric insulating material overlapping the first layer except for electrical contacting areas, a third layer being a noble metal metallization forming a ground electrode and overlapping the second layer and substantially all of one horizontal surface of the substrate, and a fourth layer being a nonconducting encapsulant having a coefficient of expansion compatible with the other layers together with substrate and covering all exposed layers exclusive of electrical contacting areas.
24. A filter connector according to claim 23 wherein the pin electrode metallization extends within and adheres to each substrate hole.
25. A filter connector according to claim 1 wherein an electrical connection is made between the ground electrode and the conductive housing on one horizontal surface of the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US48059383A | 1983-03-30 | 1983-03-30 | |
| US480,593 | 1983-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1216033A true CA1216033A (en) | 1986-12-30 |
Family
ID=23908554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000450908A Expired CA1216033A (en) | 1983-03-30 | 1984-03-29 | Filter connector |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0123457B1 (en) |
| JP (1) | JPH0695464B2 (en) |
| KR (1) | KR890004204B1 (en) |
| AT (1) | ATE31372T1 (en) |
| AU (1) | AU565595B2 (en) |
| BR (1) | BR8401386A (en) |
| CA (1) | CA1216033A (en) |
| DE (1) | DE3468079D1 (en) |
| MX (1) | MX159641A (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0169053B1 (en) * | 1984-07-16 | 1990-10-10 | Nippondenso Co., Ltd. | High frequency filter for electric instruments |
| US4657323A (en) * | 1986-01-27 | 1987-04-14 | Itt Corporation | D-subminature filter connector |
| FR2594603B1 (en) * | 1986-02-14 | 1988-10-14 | Radiotechnique Compelec | CONNECTOR FOR COMPUTER BUS |
| US4867706A (en) * | 1987-04-13 | 1989-09-19 | G & H Technology, Inc. | Filtered electrical connector |
| NL8701661A (en) * | 1987-07-14 | 1989-02-01 | Du Pont Nederland | FILTER UNIT FOR CONNECTORS. |
| EP0331959B1 (en) * | 1988-02-29 | 1994-12-28 | Pacesetter AB | Bipolar filtered feedthrough terminal |
| US4992061A (en) * | 1989-07-28 | 1991-02-12 | Thomas & Betts Corporation | Electrical filter connector |
| US4930200A (en) * | 1989-07-28 | 1990-06-05 | Thomas & Betts Corporation | Method of making an electrical filter connector |
| DE59004707D1 (en) * | 1989-10-12 | 1994-03-31 | Siemens Ag | FILTER CONNECTOR. |
| DE9107385U1 (en) * | 1991-06-14 | 1992-07-16 | Filtec Filtertechnologie für die Elektronikindustrie GmbH, 59557 Lippstadt | Multi-pin connector for electronic signal lines |
| DE4215632A1 (en) * | 1992-05-12 | 1993-11-18 | Telefonbau & Normalzeit Gmbh | Capacitor for a layer circuit |
| US5415569A (en) * | 1992-10-19 | 1995-05-16 | Molex Incorporated | Filtered electrical connector assembly |
| WO1995011968A1 (en) * | 1993-10-27 | 1995-05-04 | Athena Neurosciences, Inc. | Transgenic animals harboring app allele having swedish mutation |
| JPH0878101A (en) * | 1994-09-07 | 1996-03-22 | Nippon Carbide Ind Co Inc | Electric filter adapter |
| US6033263A (en) * | 1996-10-15 | 2000-03-07 | The Whitaker Corporation | Electrically connector with capacitive coupling |
| US9411956B2 (en) | 2008-07-02 | 2016-08-09 | Ricoh Company, Ltd. | Locked print with intruder detection and management |
| WO2013045383A1 (en) | 2011-09-26 | 2013-04-04 | Dsm Ip Assets B.V. | Novel compositions |
| US9283161B2 (en) | 2011-09-26 | 2016-03-15 | Dsm Ip Assets B.V. | Aqueous cosmetic compositions containing resveratrol solubilized in a liquid phosphate ester surfactant |
| DE102022004598A1 (en) * | 2022-12-08 | 2024-06-13 | Kostal Automobil Elektrik Gmbh & Co. Kg | Electric device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR7508698A (en) * | 1975-01-08 | 1976-08-24 | Bunker Ramo | CONNECTOR FILTER SET |
| JPS54111741U (en) * | 1978-01-26 | 1979-08-06 | ||
| JPS6028447B2 (en) * | 1978-06-22 | 1985-07-04 | 太陽誘電株式会社 | Composite LC filter and its manufacturing method |
| DE3016315C2 (en) * | 1980-04-28 | 1982-04-29 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | Connector with connecting pins |
-
1984
- 1984-03-26 BR BR8401386A patent/BR8401386A/en not_active IP Right Cessation
- 1984-03-29 AT AT84302143T patent/ATE31372T1/en not_active IP Right Cessation
- 1984-03-29 KR KR1019840001644A patent/KR890004204B1/en not_active IP Right Cessation
- 1984-03-29 MX MX200834A patent/MX159641A/en unknown
- 1984-03-29 CA CA000450908A patent/CA1216033A/en not_active Expired
- 1984-03-29 EP EP84302143A patent/EP0123457B1/en not_active Expired
- 1984-03-29 JP JP59059673A patent/JPH0695464B2/en not_active Expired - Lifetime
- 1984-03-29 DE DE8484302143T patent/DE3468079D1/en not_active Expired
- 1984-03-30 AU AU26284/84A patent/AU565595B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59184479A (en) | 1984-10-19 |
| ATE31372T1 (en) | 1987-12-15 |
| KR840008227A (en) | 1984-12-13 |
| KR890004204B1 (en) | 1989-10-27 |
| AU2628484A (en) | 1984-10-04 |
| EP0123457B1 (en) | 1987-12-09 |
| JPH0695464B2 (en) | 1994-11-24 |
| EP0123457A1 (en) | 1984-10-31 |
| BR8401386A (en) | 1984-11-06 |
| DE3468079D1 (en) | 1988-01-21 |
| AU565595B2 (en) | 1987-09-24 |
| MX159641A (en) | 1989-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry | ||
| MKEX | Expiry |
Effective date: 20040329 |