KR840000602A - Thermosetting resin composition - Google Patents

Thermosetting resin composition Download PDF

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Publication number
KR840000602A
KR840000602A KR1019820002739A KR820002739A KR840000602A KR 840000602 A KR840000602 A KR 840000602A KR 1019820002739 A KR1019820002739 A KR 1019820002739A KR 820002739 A KR820002739 A KR 820002739A KR 840000602 A KR840000602 A KR 840000602A
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KR
South Korea
Prior art keywords
resin composition
thermosetting resin
composition according
polymerizable monomer
isopropenylphenol
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KR1019820002739A
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Korean (ko)
Inventor
슈헤이 이까도 (외 2)
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요시오까 시로
미쓰이 도오아쓰 가가꾸고오교 가부시끼가이샤
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Application filed by 요시오까 시로, 미쓰이 도오아쓰 가가꾸고오교 가부시끼가이샤 filed Critical 요시오까 시로
Publication of KR840000602A publication Critical patent/KR840000602A/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Abstract

내용 없음No content

Description

열경화성 수지 조성물Thermosetting resin composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (19)

이소프로페닐페놀과 1종 이상의 중합 가능 모노머의 공중합체 및 에폭시 수지로 이루어진 열 경화성 수지 조성물.A thermosetting resin composition comprising a copolymer of isopropenylphenol and at least one polymerizable monomer and an epoxy resin. 제 1 항에 있어서, 중합 가능 모노머가 1종 이상의 염기성 기를 포함함을 특징으로 하는 열 경화성 수지조성물.The thermosetting resin composition according to claim 1, wherein the polymerizable monomer comprises at least one basic group. 제 1 항에 있어서, 중합 가능 모노머가 스티렌류, 아크릴산 에스테르, 메타크릴산 에스택르, 아크릴로니트릴, 메타크릴로니트릴, 푸마로니트릴, 아크릴산, 메타크릴산, 말레산무수물, 아크릴산 아미드, 이소프렌, 부타디엔 및 디시클로펜타디엔으로 이루어진 군으로부터 선택됨이 특징인 열 경화성 수지 조성물.The polymerizable monomer according to claim 1, wherein the polymerizable monomer is styrene, acrylic acid ester, methacrylic acid stack, acrylonitrile, methacrylonitrile, fumaronitrile, acrylic acid, methacrylic acid, maleic anhydride, acrylic acid amide, isoprene, A thermosetting resin composition characterized by being selected from the group consisting of butadiene and dicyclopentadiene. 제 1 항에 있어서, 중합 가능 모노머가 아크릴로니트릴임이 특징인 열 경화성 수지 조성물.The thermosetting resin composition according to claim 1, wherein the polymerizable monomer is acrylonitrile. 제 1항에 있어서, 산성 물질을 더 포함하는 열 경화성 수지 조성물.The thermosetting resin composition according to claim 1, further comprising an acidic substance. 제 1 항에 있어서, 이소프로페닐페놀이 파라-이소프로페닐페놀임이 특징인 열 경화성 수지 조성물.The thermosetting resin composition according to claim 1, wherein the isopropenylphenol is para-isopropenylphenol. 제 2 항에 있어서, 중합 가능 모노미를 포함하는 염기성 N-기가 알킬아미노알킬 아크릴레이트 및 N-알킬아미노알킬 메타크릴레이트로 이루어진 군으로부터 선택됨이 특징인 열 경화성 수지 조성물.3. The thermosetting resin composition according to claim 2, wherein the basic N-group comprising the polymerizable monomi is selected from the group consisting of alkylaminoalkyl acrylates and N-alkylaminoalkyl methacrylates. 제 2 항에 있어서, 염기성 라디칼을 포함하는 중합 가능 모노머가 이소프로페닐 라디칼-포함 아민류, N-비닐알킬아민류, N-비닐라우릴아민류, N-비닐 복소환 화합물, N-알킬아미노알킬 아크릴아미드류 및 N-알킬아미노알킬 메타크릴아미드류로 이루어진 군으로부터 선택됨이 특징인 열 경화성 수지 조성물.The polymerizable monomer comprising a basic radical is isopropenyl radical-containing amines, N-vinylalkylamines, N-vinyllaurylamines, N-vinyl heterocyclic compounds, N-alkylaminoalkyl acrylamides. A thermosetting resin composition characterized in that it is selected from the group consisting of Drew and N-alkylaminoalkyl methacrylamides. 제 1 항에 있어서, 공중합체가 0.01~20중량%의 중합 가능 모노머 및 5~90중량%의 이소프로페닐페놀을 포함함을 특징으로 하는 열 경화성 수지 조성물.The thermosetting resin composition according to claim 1, wherein the copolymer comprises 0.01 to 20 wt% of a polymerizable monomer and 5 to 90 wt% of isopropenylphenol. 제 1 항에 있어서, 공중합체가 0.1~10중량%의 중합 가능 모노머 및 10~80중량%의 이소프로페닐페놀을 포함함을 특징으로 하는 열 경화성 수지 조성물.The thermosetting resin composition according to claim 1, wherein the copolymer comprises 0.1 to 10 wt% of a polymerizable monomer and 10 to 80 wt% of isopropenylphenol. 제 3 항에 있어서, 공중합체가 10~95중량%의 중합 가능 모노머 및 5~90중량%의 이소프로페닐페놀을 포함함을 특징으로 하는 열 경화성 수지 조성물.4. The thermosetting resin composition according to claim 3, wherein the copolymer comprises 10 to 95% by weight of a polymerizable monomer and 5 to 90% by weight of isopropenylphenol. 제 4 항에 있어서, 공중합체가 20~40중량%의 아크릴로니트릴 및 20~80중량%의 이소프로페닐페놀을 포함함을 특징으로 하는 열 경화성 수지 조성물The thermosetting resin composition according to claim 4, wherein the copolymer comprises 20 to 40% by weight of acrylonitrile and 20 to 80% by weight of isopropenylphenol. 제 1 항에 있어서, 공중합체의 분자량이 300~200000 범위 이내임을 특징으로 하는 열 경화성 수지 조성물.The thermosetting resin composition according to claim 1, wherein the copolymer has a molecular weight in the range of 300 to 200,000. 제 12 항에 있어서, 공중합체의 분자량이 500~500000 범위 이내임을 특징으로 하는 열 경화성 수지 조성물.13. The thermosetting resin composition according to claim 12, wherein the copolymer has a molecular weight in the range of 500 to 500000. 제 1 항에 있어서, 에폭시 수지 중 에폭시기에 대한 공중합체 중 페닐성 수산기의 수의 비가 0.5~2 범위 이내임이 특징인 열 경화성 수지 조성물.The thermosetting resin composition according to claim 1, wherein the ratio of the number of phenyl hydroxyl groups in the copolymer to the epoxy group in the epoxy resin is within the range of 0.5 to 2. 제 5 항에 있어서, 산성 물질이 루이스산 또는 브뢴스테드산임을 특징으로 하는 열 경화성 수지 조성물.6. The thermosetting resin composition according to claim 5, wherein the acidic substance is Lewis acid or Bronsted acid. 제 5 항에 있어서, 산성 물질이 에폭시 수지 및 공중합체의 혼합물 100중량부당 0.01~10중량부의 양으로 포함됨을 특징으로 하는 열 경화성 수지 조성물.6. The thermosetting resin composition according to claim 5, wherein the acidic substance is contained in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the mixture of the epoxy resin and the copolymer. 제 12 항에 있어서, 조성물을 기준으로 0.01~10중량%의 양으로 BF3, 아민 착화합물이 더 포함됨을 특징으로 하는 열 경화성 수지 조성물.13. The thermosetting resin composition according to claim 12, further comprising BF 3 , an amine complex in an amount of 0.01 to 10% by weight based on the composition. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019820002739A 1981-06-19 1982-06-19 Thermosetting resin composition KR840000602A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93795 1981-06-19
JP56093795A JPS57209923A (en) 1981-06-19 1981-06-19 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
KR840000602A true KR840000602A (en) 1984-02-25

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JP (1) JPS57209923A (en)
KR (1) KR840000602A (en)
DE (1) DE3222077C2 (en)
FR (1) FR2508049A1 (en)
GB (1) GB2103621A (en)
IT (1) IT1151798B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3621477A1 (en) * 1985-06-26 1987-01-08 Canon Kk Resin mixture which can be cured by radiation of effective energy
GB8622998D0 (en) * 1986-09-24 1986-10-29 Ciba Geigy Ag Curable compositions
DE102010046930B4 (en) * 2010-02-23 2014-07-17 San-Ei Kagaku Co. Ltd. Surface mounting method
DE102013214419A1 (en) * 2013-07-24 2015-01-29 Sgl Carbon Se Tooling prepreg with high storage stability and process for its preparation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5536212A (en) * 1978-09-06 1980-03-13 Mitsui Toatsu Chem Inc Thermosetting resin composition

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Publication number Publication date
GB2103621B (en)
JPS57209923A (en) 1982-12-23
FR2508049B1 (en) 1985-04-26
GB2103621A (en) 1983-02-23
FR2508049A1 (en) 1982-12-24
DE3222077A1 (en) 1983-01-05
IT1151798B (en) 1986-12-24
DE3222077C2 (en) 1985-10-10
IT8221923A0 (en) 1982-06-17

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