KR830006478A - Electroplating Process of Porous Body - Google Patents

Electroplating Process of Porous Body Download PDF

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Publication number
KR830006478A
KR830006478A KR1019810002696A KR810002696A KR830006478A KR 830006478 A KR830006478 A KR 830006478A KR 1019810002696 A KR1019810002696 A KR 1019810002696A KR 810002696 A KR810002696 A KR 810002696A KR 830006478 A KR830006478 A KR 830006478A
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KR
South Korea
Prior art keywords
porous body
conductive
electroplating
current
solvent
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Application number
KR1019810002696A
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Korean (ko)
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KR840002272B1 (en
Inventor
아더 맥킨타이르 제임스
프로이드 필립스 로버트
도날드 리프브르 죠셉
Original Assignee
리챠드 고던 워터맨
더 다우 케미칼 캄파니
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Priority to KR1019810002696A priority Critical patent/KR840002272B1/en
Publication of KR830006478A publication Critical patent/KR830006478A/en
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Publication of KR840002272B1 publication Critical patent/KR840002272B1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

내용 없음No content

Description

다공체(多孔體)의 전기도금공정Electroplating Process of Porous Body

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명을 실행하기 의한 한 공정을 개략적으로 도시한 유통도.1 is a flow diagram schematically illustrating a process by which the present invention is practiced.

제2도 및 제3도는 본 발명을 증명하는 실험결과 도표.2 and 3 are diagrams of experimental results demonstrating the present invention.

Claims (8)

다수의 공간을 가진 전도성 다공체의 내벽면부분을 피복하기 위한 전기도금 공정에 있어서, 다공체에 전류가 흐를때 다공체의 공간에 전기도금 물질이 함유된 도금액을 채우는 단계와, 다공체를 전도성비도금용매에 담그는 단계 및 상기 다공체에 직류전위를 인가하는데 의하여 상기 전도성용매에 전류를 흐르게 하여 상기 다공체의 내벽면이 피복되도록 하는 단계로 이루어지는 다공체의 전기도금공정.An electroplating process for covering an inner wall portion of a conductive porous body having a plurality of spaces, the method comprising: filling a plating liquid containing an electroplating material in a space of the porous body when current flows in the porous body, and placing the porous body in a conductive non-plating solvent. Electroplating process of the porous body comprising the step of immersing and applying a direct current potential to the porous body to flow a current to the conductive solvent to cover the inner wall surface of the porous body. 제1항의 공정에 있어서, 상기 다공체가 약 10마이크론 이하의 평균구경으로된 내부 기공을 가지는 공정.The process of claim 1, wherein the porous body has internal pores having an average diameter of about 10 microns or less. 제1항 또는 2항의 공정에 있어서, 다공체가 니켈, 철, 내식성철강, 구리, 티타늄 및 이들의 합금등에서 선택된 금속으로 된 공정.The process according to claim 1 or 2, wherein the porous body is made of a metal selected from nickel, iron, corrosion resistant steel, copper, titanium, alloys thereof, and the like. 제1항 2항 또는 3항의 공정에 있어서, 다공체에 온의 전기도금용액을 부분적으로 채우는 단계를 포함하는 공정.The process according to claim 1, 2 or 3, which comprises partially filling the porous body with an electroplating solution. 제1항, 2항 또는 3항의 공정에 있어서, 상기 도금액이 온의 수용액 및 시안화 칼륨이며, 상기 전도성용매는 염소산칼륨의 수용액인 공정.The process according to claim 1, 2 or 3, wherein the plating liquid is an aqueous solution of ions and potassium cyanide, and the conductive solvent is an aqueous solution of potassium chlorate. 선행된 어떤 한 항의 공정에 있어서, 상기 전도성 용매에 약 0.05amp/in2의전류를 흘려도금될 다공체로 부터 수소를 형성 및 방출시키는 단계를 포함하는 공정.The process of any one of the preceding, comprising forming and releasing hydrogen from the porous body to be plated by flowing a current of about 0.05 amp / in 2 into the conductive solvent. 제6항의 공정에 있어서, 상기 전류밀도가 약 0.1amp/in2인 공정.The process of claim 6 wherein said current density is about 0.1 amp / in 2 . 선행된 어떤 한항의 공정에 있어서, 상기 공정이 반복되는 공정.The process of any one of the preceding, wherein the process is repeated. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019810002696A 1981-07-25 1981-07-25 Method of electroplation a porous body KR840002272B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019810002696A KR840002272B1 (en) 1981-07-25 1981-07-25 Method of electroplation a porous body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019810002696A KR840002272B1 (en) 1981-07-25 1981-07-25 Method of electroplation a porous body

Publications (2)

Publication Number Publication Date
KR830006478A true KR830006478A (en) 1983-09-24
KR840002272B1 KR840002272B1 (en) 1984-12-14

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KR1019810002696A KR840002272B1 (en) 1981-07-25 1981-07-25 Method of electroplation a porous body

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KR840002272B1 (en) 1984-12-14

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