KR820001872Y1 - Apparatus for mounting chip type circuit elements on a printed circuit board - Google Patents

Abstract

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Description

Device for mounting chip type electronic parts on printed board

1 is a plan view showing a case in which electronic components are adsorbed as an overall structure of an apparatus for mounting an electronic component of the present invention.

FIG. 2 is a plan view of the case where electronic components are transferred to a printed board in the apparatus shown in FIG.

3 is a plan view showing a magazine guide plate in which magazines containing electronic components are arranged.

4 is a cross-sectional view taken along the line 4-4 of FIG. 1 showing the state before adsorption of electronic components.

5 is a cross-sectional view of the electronic component adsorption.

6 is a cross-sectional view after adsorption of electronic components.

7 is a plan view of a magazine containing electronic components.

8 is a longitudinal cross-sectional view of the magazine shown in FIG.

9 is an overall plan view of an embodiment of a magazine.

10 is a side view of the magazine shown in FIG.

11 is a front view showing an embodiment of an electronic component.

12 is a side cross-sectional view of a push rod driving mechanism showing a state where the push rod is lowered.

FIG. 13 is a side sectional view of the push rod driving mechanism shown in FIG. 12 showing a state where the push rod is raised; FIG.

14 is a longitudinal front view showing a suction plate support head and a drive mechanism for supporting the suction plate;

14A is an explanatory diagram of a cam mechanism for driving the suction plate support head.

14B is an explanatory diagram of a moving state of the suction plate support head.

15 is a sectional view taken along line 15-15 in FIG.

16 is a plan view of the suction surface forming member.

17 is a plan view showing a configuration of an electronic component mounting board position portion.

18 is a cross-sectional view taken along line 18-18 of FIG. 17 showing a state in which electronic components are transferred onto a printed board.

19 is a cross-sectional view at the time of mounting an electronic component.

20 is a cross-sectional view after mounting the electronic component.

21 is a plan view showing another embodiment of the electronic component mounting apparatus of the present invention.

FIG. 22 is a cross-sectional view showing a state in which a pin is lowered as an example of an apparatus for applying an adhesive for bonding an electronic component to a printed board. FIG.

23 is a cross-sectional view showing a state in which the shandong pin is layered.

24 is an enlarged view showing the tip of the Shanghai East pin.

25 and 26 are enlarged views showing another example of the shandong pin.

27 is a sectional view of principal parts of another embodiment of a magazine.

28 is a perspective view showing another example of the tip opening of the magazine.

29 is a side view showing the whole of another embodiment of the electronic component pressing mechanism.

FIG. 30 is an enlarged side view of the push mechanism shown in FIG. 29; FIG.

The present invention relates to a mounting apparatus for mounting a chip type electronic component on a printed board.

In particular, the present invention is a vertically supported, grate-shaped, horizontally located magazine guide plate pushed up each electronic component stored in the magazine inserted through a corresponding through hole stable to the predetermined position of the printed board A device for mounting a chip-shaped component on a printed board as described in the specification of US Pat. No. 4,127,432 for mounting a chip-shaped electronic component is disclosed.

According to the method of US Pat. No. 4,127,432, there is an advantage that a chip type electronic component can be mounted on a printed board at a higher speed by a cheaper and simpler device than the conventional method using an NC device.

However, electronic circuits assembled according to this method have a fatal defect such as deterioration in the accuracy of the mounting position of the chip-type electronic components with respect to the printed board and the occurrence of poor electrical conduction of the circuit due to incorrect mounting, and consequently a significant decrease in production. have.

These defects in the manner according to US Pat. No. 4,127,432 are due to the following structure.

(1) A structure in which a chip-shaped electronic component packed in a hollow cylinder magazine is directly pressed against a printed board coated with an adhesive by a plurality of push bars for mounting the component on the printed board.

(2) A structure in which a printed board is arranged so that a surface on which an electronic component connection land is formed is directed downward to mount a chip-shaped electronic component in the magazine opposite to the hollow common magazine.

In other words, the above-mentioned cause (1) shows that it is extremely difficult to mount chip-shaped electronic components each having a different layer height in a magazine, and to be mounted on a printed board on which an adhesive layer is provided by a plurality of pressure rods with uniform pressure. Moreover, although the compression spring is used to adjust the pressure of the push rod, the fatigue of the compression spring due to the high-speed operation of the device is remarkable, and the bending is likely to occur in the printed board, and therefore, when such a printed board is used It is difficult to maintain a constant gap between the tip of the magazine, that is, the tip of the push rod and the mounting surface of the printed board, and the adhesive applied to the printed board is easily attached to the tip of the push rod, thus causing a very difficult problem. . On the other hand, looking at the cause (2), the adhesive and the like is installed on the lower surface of the printed board and the electronic components temporarily supported by the push rod is maintained at the lower position of the printed board until it reaches the next soldering process In some cases, the occurrence of dislocation or dropout, that is, the printed circuit board in which the electronic component is temporarily supported by the adhesive, is transferred by the belt mechanism, and the electronic component is cured by curing the thermosetting adhesive. In order to fix it, the printed boards are turned upside down, and during the transfer and overturning process of these printed boards, the temporary support of the electronic components is easily displaced or dropped. Accordingly, an object of the present invention is to provide a device for eliminating a conventional basic defect as disclosed in US Pat. No. 4,127,432 and mounting an electronic component on a printed board which is safe, secure and extremely high in mounting accuracy.

According to the present invention, the object is to vertically arrange a plurality of cylindrical magazines in which a plurality of chip-like electronic components are stacked in a predetermined relation position corresponding to the position of an electronic component to be mounted on a printed board, and stacked in the cylindrical magazine. Adsorption plate for pushing each electronic component to the position where the uppermost electronic component is positioned at the upper opening of each cylindrical magazine in each electronic component layer, and having a plurality of adsorption holes at a position corresponding to the corresponding position of the cylindrical magazine. A print having a layered conductor on the top surface, the suction hole being positioned horizontally so as to be in contact with the upper electronic component of the corresponding cylindrical magazine, and at the same time adapted to attract the upper electronic component to each suction hole; The substrate is horizontally supported, and each electronic component is moved from the suction position to the position where the printed substrate is horizontally supported. The suction plate is transferred, and the suction plate is placed on the printed board to mount each electronic component at a corresponding position on the printed board, and the suction force is released to the suction hole to release the suction of the electronic component. The apparatus of the present invention for achieving the method by the method, the printed circuit board support member for horizontally supporting a printed circuit board having a layered conductor of a certain shape on the upper surface, and the electronic components mounted on the printed circuit board Horizontal guided magazine holding a plurality of through holes at a position corresponding to the relative position of the hollow and for holding a plurality of chip-shaped electronic component layer has the upper opening in the same horizontal plane, and the common guided magazine A number of hollow vertical cylindrical mag cups slidably coupled to the ball and the top of each layer of electronic components Electronic component pressing means for gradually pushing up each electronic component layer in the cylindrical magazine so that a magnetic component is located in the upper opening of each cylindrical magazine; and an upper electronic component of each electronic component layer located in the upper opening of the cylindrical magazine. Electronic component adsorption means comprising a plurality of adsorption holes in the position common to the relative position of the cylindrical magazine coupled in the through hole of the magazine guide plate for adsorbing and the adsorption position and the electrons adsorbed on the adsorption plate And a conveying means for moving the electronic component absorbing means between the positions at which the component is mounted on the printed board.

In the present invention, two methods are used to temporarily support an electronic component on a printed board for a predetermined time until the electronic component is moved to the next process.

One method is to install an adhesive such as a thermosetting material at a predetermined position on a printed board as in US Pat. No. 4,127,432. The other method is to apply a hot belt adhesive material to each electronic component in advance. When mounting on a printed board by the said adsorption plate, there exists a method of heating an adhesive so that it may be viscous and temporarily supporting an electronic component on a printed board by this viscosity of an adhesive.

On the other hand, as a heating means for temporarily supporting an electronic component on a printed board or curing a thermosetting material, a method of heating a printed circuit board on which an electronic component is mounted via a thermosetting material to the next step, Or when mounting an electronic component on a printed board from the said adsorption plate, the method of heating while pressing an electronic component on a printed board by the said adsorption plate can be applied.

Hereinafter, an embodiment of an electronic component mounting apparatus of the present invention will be described with reference to the drawings. 1 and 2 show the overall configuration of the electronic component mounting apparatus. On the base 1, the side boards 60 and 60a for induction of the printed board are used to transfer the printed board 2 in the direction of the arrow a. A supported belt conveyor 3 is provided.

A printed circuit magazine 70 is installed at the entrance of the belt conveyor 3, and a vertical layer of the printed circuit board 2 having a layered conductor having a predetermined shape on the upper surface thereof is positioned in the printed circuit magazine 70. The lowermost printed board is located at the surface height of the belt conveyor 3. The printed circuit board conveying apparatus is formed of the swing interval 71 as shown in FIG. 1 and FIG.

The oscillation section 71 is oscillable, and by this oscillation section 71, the printed boards are extracted from the magazine 70 one by one onto the conveyor 3, and the oscillation section 71 is a suction plate support head which will be described later. It works synchronously with the movement of 10.

Of course, when each lowermost printed board reaches the conveying belt 3, the printed board above the lower printed board is lowered to a position where the next lowermost printed board is later transferred to the conveying belt.

Instead of the printing board conveying device in the form of a swinging section 71, a suitable push rod operated by a piston disposed in a cylinder receiving high pressure air may be an automatic device that extracts the printed boards from the magazine 70 one by one. .

That is, a pneumatic printed circuit board conveying apparatus is also devised.

The support frame 4A- (4D) is fixed to the base 1, and the guide frame supporters 5A- (5D) of the magazine are installed on the support frame 4A- (4D), and each is movable. The magazine exchange pressure cylinders 7A to 7D fixed to the support frame via the mounting plate 6 are movable along the support frame.

The magazine guide plate 8 is mounted on the magazine guide plate supports 5A to 5D, and the suction plate support head 10 is provided on the base 1 so as to be movable up and down.

Suction plates 11A and 11D are supported on both shafts of the suction plate support head 10 so as to be movable.

The magazine guide plate 8 is a strut 22 which connects the upper plate 20 and the lower plate 21 and the upper and lower plates of the magazine guide plate to each other, as shown in FIGS. 3 to 6. It consists of.

The upper plate 20 of the magazine guide plate is provided with a square insertion hole 24 for inserting the magazine 23 corresponding to the predetermined insertion position of the magazine 23, and the lower plate 21 of the magazine guide plate. ), A square recess 25 corresponding to a predetermined insertion position of the magazine 23 is formed, and a circular hole 27 is formed at the center of the square recess 25 to insert the push rod 26. Here, the insertion hole 24 installed in the upper plate 20 of the magazine guide plate is formed to have a corresponding positional relationship corresponding to the mounting position of the electronic component to be mounted on the printed board in a one-to-one correspondence with the magazine guide plate. The upper plate 20 is provided with a pair of positioning holes 65.

As shown in Figs. 7 to 10, the magazine 23 for storing electronic components is formed in the square cylinder 23a of the outer square mold having the through hole 31 and the through hole 31 thereof. And a lid 32 movably inserted.

Here, the cylindrical cylinder 23a is injection molded as metal or 66 nylon, and the plug 32 is made of synthetic resin or metal such as styrol.

The through-holes 31 are configured to accommodate about 100 electronic components 30 such as chip capacitors in a stacked state, and the cross-sections of the through-holes 31 are substantially the same size as the external size of the electronic component 30. Is formed in a rectangle of. As shown in FIGS. 9 and 10, the plug 32 contacts the inner surface of the through hole 31 and the flat portion 32a for supporting the electronic component 30 in a stacked state, and the plug 32 The engaging portion 32b which prevents the fall of itself is made, and the flat part 32a comes into contact with the tip of the pressure bar 26 to be described later for pushing up the plug 32.

In addition, if the magazine 23 is formed of nylon or the like, it is possible to determine the presence and type (condenser, resistor, jumper, etc.) of the electronic component 30 from the outside. You can print the configuration.

The magazine 23 thus constructed is vertically supported by fitting in the insertion hole 24 and the square recess 25 provided in the magazine guide plate 8, as shown in FIGS. In addition, the upper opening 23b of each magazine 23 is fixed to be substantially on the same plane.

As a result, the relative positions of the upper openings 23b of the magazines 23 have the same relative positions of the electronic components to be mounted on the printed board. As can be seen from FIG. 11, in this embodiment, the chip capacitor as the electronic component 30 housed in the magazine 23 is formed on the main body 30a, which is a substantially rectangular parallelepiped, and on both ends of the main body 30a. It is composed of an electrode 30b, and has a structure that does not have a lead wire like a normal electronic component. Then, one surface of the chip capacitor 30, that is, one surface of the main body 30a, is coated with a known adhesive, for example, a thermally soluble adhesive 30c, having no adhesiveness and viscosity at room temperature.

In this case, the mounting of the chip capacitor 30 on the printed board is performed by the adhesive of the chip capacitor 30 so that the electrode 30b of the chip capacitor 30 contacts the pattern of the conductor formed on the printed board by the automatic operation of retreating. After attaching the coated surface of 30c to a predetermined position on the printed board, the adhesive 30c is heated and melted to give adhesiveness, thereby temporarily supporting the chip capacitor 30 on the printed board and performing soldering in the next step. It is done by doing

Therefore, the chip capacitor 30 is reliably adhered to the printed board by the adhesive force of the adhesive 30c in the state before soldering, and reliably adhered to the printed board by the curing action of the adhesive 30c in the soldering operation. Therefore, the chip capacitor is not displaced before or during the soldering operation.

Although the foregoing has described the chip type capacitor as an example, it is similarly applicable to other electronic components that do not have a lead wire. The adhesive 30c to be used may be any material that meets the purpose of the present embodiment, such as any known adhesive that does not retain adhesiveness at room temperature but is melted once by heating and immediately cured. The push rod 26 is fixed to the lower push guide plate 33 as shown in FIGS. 12 and 13, and is slidably supported by the upper push guide plate 34.

The lower guide plate 33 is attached to the lower guide plate pedestal 35, and the pedestal 35 is fitted to the pedestal guide rail 36 mounted on the base 1 so as to slide upright.

The upper push bar guide plate 34 is supported by an upper guide plate pedestal 37 formed on the base 1.

The pedestal 35 has an engaging portion 38 engaged with the roller 40a at one end of the push rod cam lever 39, and the push rod cam lever 39 is supported by the support shaft 41a, and the cam lever On the other end of 39, the roller 42a is arranged so as to be lifted by contact with the push rod cam 43. In addition, a buffer spring 44 is provided around the lower portion of the push bar 26. As shown in FIG. 14, the adsorption plate support head 10 is fitted to the rod 41 disposed vertically on the sliding plate 40 so as to be movable up and down, and the sliding plate 40 has a base (1). It is supported so that it can slide in a horizontal direction by the support rail 42 provided in ().

As shown in FIG. 14A, the sliding plate 40 is reciprocated in the horizontal direction by the cylindrical cam 96. The sliding plate 98 is attached to the attachment block 97 of the suction plate support head 10. As shown in FIG. The head vertical movable plate 47 is fitted so as to be able to slide in the horizontal direction via the gap. The suction plate support head 10 is lifted up and down by the vertical movable plate 47 driven by the groove cam 99.

Thus, the suction plate support head 10 is supported by the base 1, so as to be movable in the vertical and horizontal directions indicated by arrows J, K, L, M, N and O as shown in FIG. 14B, and the suction plate Suction plate support frames 43A and 43B are fixed to both sides of the support head 10.

As shown in FIG. 15, a rod 45A having an upper end connected to it by the connecting bar 44A is supported on the suction plate support frame 43A so as to be movable up and down, and the suction plate 11A is fixed to the lower end of the rod 45A. do. An extension spring 46 is provided between the connection bar 44A and the lower portion of the suction plate support frame 43A, whereby the suction plate 11A is provided with downward elasticity.

Similarly, the adsorption plate 11B is also mounted to the lower end of the rod 45B which is installed in the adsorption plate support frame 43B so as not to move up and down, and is downward by the extension spring between the connection bar 44B and the lower side of the adsorption plate support frame 43B. Elasticity is given.

11A of the said adsorption plate is comprised from the support member 51 and the adsorption surface formation member 52 which are attached to 45 A of rods. The adsorption surface 53 of this adsorption surface formation member 52 is flat, and each adsorption surface mounted in the adsorption surface 53 perpendicular to the said magazine guide plate 8 as shown in FIG. 15 is shown. The circular suction hole 54 is provided in the relative position corresponding to the upper end opening 23b of 23.

In other words, the relative positions of the circular suction holes 54 correspond to the relative positions of the electronic component 30 to be mounted on the printed board 2. In addition, the suction plate 11A can be connected between the compressed air source H and the vacuum source G through the valve V to adjust the connection between the compressed air source H and the vacuum source G. Mechanism is installed.

As shown in FIG. 16, the PTC 50 is arrange | positioned so that the said adsorption hole 54 may be enclosed around each circular adsorption hole 54 arrange | positioned at the said adsorption surface 53, As mentioned later When the electronic component 30 is adsorbed to the adsorption hole 54 and placed on the printed board 2, a heating mechanism for heating, for example, a heat soluble adhesive applied to the electronic component 30 is formed. . (I) in the figure shows the power supply of the PTC 50. Moreover, the positioning pin 55 is provided in the vicinity of the adsorption surface 53 of the support member 51, and the adsorption plate 11B also has the same structure as the adsorption plate 11A.

In addition, the structure of the electronic component mounting board position part shown by the arrow B of FIG. 1 and FIG. 2 is shown in FIGS. 17-20.

In the figure, an upper surface stopper defining a position in the vertical direction of the printed board 2 on the upper side of the side plates 60 and 60a, which serves as a guide means for supporting the conveyor 3 and being conveyed at the same time. 61) 61a are fixed, and the all-topper 62 which defines the stop position in the advancing direction of the printed circuit board 2 is installed between the side plates 60 and 60a by a well-known means to move up and down freely. When the printed circuit board 2 is stopped and positioned at the corrected position, the printed board 2 is raised, and when the stop is released, the printed board 2 is lowered. Further, below the printed board 2, the substrate support plate 63 corrects the outer curvature of the printed board when the electronic component is mounted on the printed board, and moves up and down by a known means such as an air cylinder for support. Is installed.

In addition, a positioning hole 64 is formed at the corner of the printed board 2 to fit the positioning pin 55, and the same positioning is also performed on the upper end 20 of the electric magazine guide plate 8. The molten hole 65 is formed.

Next, the operation of the above embodiment will be described.

First, the magazine 23 which accommodates the electronic component 30 in a stacked state is mounted perpendicularly to the magazine guide plate 8 so that the upper opening 23b of the magazine 23 is substantially in the same horizontal plane. The magazine guide plate 8 is placed on the magazine guide plate supports 5A to 5D, and as shown in FIG. 12, the lower guide plate pedestal 35 is set to the lowest position, and the push rod ( The cylinders 7A and 7C are operated in the state where 25 is lowered, and the plane positional relationship between the magazine guide plate 8 and the suction plate 11A and 11B is set as shown in FIG. As shown in FIG. 4, the upper surface of the magazine guide plate 8 and the adsorption surface 53 of the suction plate 11A are opposed to the magazine guide plate support 5A.

In this state, as shown in FIG. 13, the push rod cam lever 39 is rotated by the push rod cam 43 to raise the electric lower guide plate support 35, and the magazine 23 as shown in FIG. The upper surface of the uppermost electronic component 30 among the electronic components 30 stacked therein pushes up the plug 32 until the upper opening 23b of the magazine 23 substantially coincides.

Then, the adsorption plate support head 10 is lowered by the head vertical movable plate 47, thereby bringing the upper end opening 23b of the magazine 23 into close contact with the adsorption surface 53, as shown in FIG. In this case, matching the positions of the suction plate 11A and the magazine 23 with the positioning hole 55 and the positioning hole 65 provided in the magazine guide upper plate 20 is performed. It is done by.

In addition, the air in the space 56 between the support member 51 and the suction surface forming member 52 is exhausted as a vacuum pump G, and the space 56 is decompressed in a vacuum state.

As a result, the suction hole 64 sucks the electronic component 30 of the uppermost layer located at the upper end opening 23b from the upper opening 23b of the magazine 23 at the surrogate position.

As the vacuum state is maintained in the space 56, the suction plate support head 10 is raised by the head vertical movable plate 47, and as shown in FIG. 6, the electronic component 30 is moved. 11 A of adsorption plates are lifted up in the state adsorbed by the original adsorption hole 54 of the adsorption surface 53. As shown in FIG.

On the other hand, the printed circuit board 2 on which the electronic component 30 is placed is electrically mounted on the belt conveyor by the lever 71 from the printed circuit board magazine 70 as shown in FIGS. 1 and 2. One by one in synchronization with the movement of the suction plate support head 10.

Thus, in the state where the suction plate 11A is lifted up, the sliding plate 40 is swung by the cylindrical cam 96 to move the suction plate support head 10 as shown in FIG. 2 and is shown in FIG. As described above, the suction plate 11A is positioned above the printed circuit board 2 having the layered conductor 2a on the upper side drawing transferred to the conveyor 3 at the electronic component mounting position.

As a result, as shown in FIG. 18, the suction surface 53 of the suction plate 11A is opposed to the printed board 2, and in this state, the suction plate support head 10 is lowered as the head vertical movable plate 47. At the same time, as shown in FIG. 19, the substrate supporting plate 63 is upper layered, and the electronic component 30 is pressed against the printed board 2 by applying a constant pressure.

In this case, matching the positions of the suction plate 11A and the printed board 2 is performed by fitting the position between the positioning pin 55 and the positioning hole 64 of the printed board 2.

Here, since the heat-melting adhesive 30C is applied to the electronic component 30 in advance, the electronic component 30 and the printed circuit board 2 are brought into close contact with each other and energized from the power source I to the PTC 50. This causes the PTC 50 to self-heat, whereby the adhesive 30C is heated to work effectively, and the electronic component 30 is adhered to the printed circuit board 2 with high precision.

Then, the discharge of the air in the space 56 is stopped by the operation of the valve v, and air is supplied from the compressed air source H in reverse as necessary, so that the suction hole of the electronic component 30 ( 54 to facilitate separation, and the suction plate 11A is raised as shown in FIG. 20, and the suction plate support head 10 sucks the original electronic component 30 from the magazine 23. As shown in FIG. Return to position

On the other hand, the stop operation | movement of the stopper 62 is canceled all, and the printed circuit board 2 is conveyed by the conveyor 3 to the electronic component mounting board position C as shown in FIG.

Also in the electronic component attachment substrate position C, the above-mentioned process is performed between the adsorption plate 11B and the printed circuit board 2.

Then, after pulling out one of the uppermost electronic components 30 from the upper opening 23b of the magazine 23, the next electronic component 30 is magazineed by the push rod 26. It is pushed up until it coincides with the surface of the upper opening 23b of 23), and is then ready for the supply transfer process of the electronic component 30.

When all the electronic components 30 of the magazine 23 in the magazine guide plate 8 on the magazine guide plate supports 5A and 5C are removed when the above steps are repeated, the push rod 26 is shown in FIG. As shown in FIG. 6, the cylinders 7A and 7C are returned to their original positions in the state where the push rod cam 43 is pulled out of the magazine 23 in the magazine guide plate 8, and the cylinder 5B ) 5D is activated, whereby the guided plate support 5B, 5D, which is loaded, is moved to a position opposite to the suction plates 11A, 11B.

Therefore, at this time, an electronic component supply transfer process is performed between the magazine guide plate 8 and the suction plate 11A and 11B on the magazine guide plate support 5B and 5D.

During this period, a new magazine 3 filled with the electronic component 30 is mounted in the empty magazine guide plate 8 on the magazine guide plate supports 5A and 5C. As a result, continuous operation is possible by using two magazine guide plate supports as it is in this embodiment.

As apparent from the above description, according to the above embodiment, the magazine 23 is arranged in the magazine guide plate 8 at a position corresponding to the electronic component mounting position on the printed board 2, and the suction plate 11A ( 11B) absorbs electronic components coated with, for example, a heat-melt adhesive, in advance, and transfers them onto a printed circuit board 2 having a predetermined pattern of the axial conductor directed upward, by heating. Since the electronic component 30 can be mounted on the printed board 2 by uniform pressure, it can be mounted with high precision.

Also, whenever the electronic component 30 is adsorbed from the magazine 23, the next electronic component 30 is pushed to the upper surface of the magazine 23 by the push rod 26. By this means, electronic components can be fixed to the printed circuit board 2 automatically.

In addition, since the outer surface of the magazine 23 has a square shape, the mounting direction of the electronic component 30 can be changed by changing the insertion direction of the magazine 23 in the magazine guide plate 8 by 90 degrees. It is possible.

In addition, in the above embodiment, the adsorption plate is installed in two places, and the mounting of the electronic parts on the printed board can be performed in two places. However, this can be carried out at the same time when the mounting interval of the electronic parts is smaller than the arrangement interval of the magazines. Therefore, the electronic parts can be mounted in two parts, so that one can be omitted as necessary.

In the above embodiment, one circular suction hole is formed for one electronic component on the suction surface of the suction plate, but a plurality of suction holes may be formed for one electronic component.

In addition, although the movement of the suction plate is performed by a linear motion, it may be a rotational motion or the like by a design change.

In addition, for example, instead of applying a heat-melt adhesive to an electronic component in advance as in the present embodiment, a thermosetting material may be applied during the transfer of the electronic component, and also installed on the printed circuit board shaft as described in US Patent 4127432. You may do so.

In addition, an embodiment in the case where the adhesive material is installed in advance as in US Pat. No. 4,127,432 at a predetermined position at which the electronic component of the printed circuit board shaft is placed will be described below.

21 shows the overall configuration of another embodiment.

This embodiment differs from the first embodiment described above in that an adhesive is applied to apply an adhesive to the printed board 2 while the printed board 2 is transported from the printing machine sales magazine 70 to the electronic component mounting position B. FIG. The electronic device is temporarily placed on the printed circuit board 2 while the coating device 80 is installed, and the printed circuit board 2 is transferred to the next step, such as soldering, after mounting on the printed board of the electronic component. In order to harden the adhesive to fix, a well-known drying furnace 95 is provided.

The rest of the configuration is the same as in the above-described first embodiment, and the description thereof is omitted.

Hereinafter, an embodiment of the apparatus 8 for applying an adhesive to the printed board 2 will be described with reference to FIGS. 21 to 23.

22 and 23, the support member 81 is fixedly supported on the shaft plate 60a of the Velk conveyor 3, and the adhesive member container 82 is fixedly supported on the support member 81. The adhesive replenishment 83 is detachably attached to the upper surface of the adhesive storage container 82.

The printed circuit board 2 arranged above the belt conveyor 3 is disposed in parallel with the lower surface 82a of the adhesive storage container under the adhesive storage container 82, and the electronic component mounting position on the printed circuit board 2 is coincident. A plurality of through holes 84 and 84a are formed in the upper surface 82b and the lower surface 82d of the adhesive storage container 82, respectively.

A plurality of shandong copper pins 85 penetrating through the through holes 84 and 84a of the adhesive container 82 are respectively parallel to the upper surface 82b of the container 82 on the adhesive container 82. Thus, it is fixed to the movable plate 87 that moves up and down by a known air cylinder 86.

In the figure 88, the stopper for determining the stop position of the printed board 2 moves up and down by a known air cylinder, and ascends when the printed board 2 is stopped, and lowers when the stop is released.

As shown in FIG. 22, in the state where the movable plate 87 descends and the Shanghai copper pin 85 is blocking the through-holes 84 and 84a, the adhesive container 82 is sealed. In addition, when the adhesive supply 83 is opened, the adhesive 89 can be supplied.

As shown in FIG. 24, the electric shank pin 85 is made of stainless steel pipe, and its inner diameter is 0.4mm and the outer diameter is about 0.9mm.

In the above configuration, in the state where the upper and lower pins 85 are lowered as shown in FIG. 22 to seal the adhesive storage container 82, the shank east pin 85 is raised once as shown in FIG. When the moving pin 85 is lowered, the adhesive 89 applied near the lower portion of the shanghai copper pin 85 is attached to the bottom surface of the shanghai copper pin 85 and becomes the reservoir 90 of the adhesive as shown in FIG.

Further, when the shank copper pin 85 is lowered and brought into contact with the printed circuit board 2 as shown in FIG. 22, the adhesive 89 is applied to the predetermined electronic component mounting position on the printed circuit board 2 in the required amount.

In this case, the amount of adhesive 89 applied varies depending on the time at which the through hole 84a is obtained, the viscosity of the adhesive, and other conditions, but as a result of the experiment, the diameter of the through hole 84a (= diameter of the upper and lower movable pins) When the viscosity of the epoxy adhesive 89 is 1000 poise and the opening time of the through hole 84a is about 0.1 to 0.5 seconds, the adhesive is formed on each electronic component on the printed circuit board 2. A coating amount of about 0.2 to 0.5 mg is obtained with respect to the mounting position, and an amount suitable for bonding electronic components such as a collecting capacitor can be set. In addition to the pipe shape shown in FIG. 24, the shandong pin 85 has a concave portion 31 on the upper and lower surfaces, such as the shandong pin 85 of FIG. 25, and the shandong pin 85 of FIG. The lower surface may be one having a concave surface 92.

As described above, according to this embodiment, a sufficient amount of adhesive for mounting the electronic component to the printed board can be automatically applied to each electronic component mounting position on the printed board in advance.

Next, a novel and good quality thermosetting material used in the embodiment shown in FIG. 21 will be described.

The adhesive composition is characterized in that the epoxy resin and 50-80 parts by weight of acrylic ester resin are contained in a compatible state with respect to 100 parts by weight of the "epoxy" resin. And a bisphenol-based glycidyl epoxide such as a condensation product of bisphenol A and erythrolohydrin is preferable, and the molecular weight is preferably 350-1200.

As the acrylic acid ester resin, a copolymer of alkyl acrylate ester such as 2-ethylhexyl acrylate, acrylic ring or acrylic acid secondary or tertiary copolymer is preferable.

In preparing this adhesive composition, it is preferable to stir-mix an epoxy-based resin, a hardening | curing agent, and an acrylic acid ester resin with a suitable solution like toluene.

Stirring is preferably performed at room temperature using a normal stirrer such as a grinding mixer at room temperature.

The adhesive composition of the appropriate viscosity thus obtained can be applied as desired to the small area on the printed board by the apparatus shown in Figs. 22 to 26, which is then heat-cured after placing the electronic component on the printed board. In this case, the electronic components can be effectively and accurately adhered and fixed on the printed circuit board without any flow or leading edge.

By way of example below, this novel adhesive is described in detail by the following examples.

To 5 parts by volume of epoxy resin (Eppong 828, manufactured by Cell Chemical Co., Ltd.), 5 parts by weight of imidazole 2E 4MZ, a hardening agent, was added and stirred and mixed at room temperature.

Next, 37% by volume of the mixture, 22 parts by weight of terpolymer of 2-ethylhexyl acrylate and ethyl acrylate, and 43% by volume of toluene were mixed with a pulverized mixer at room temperature for about 1 hour.

The property of the obtained composition was arc-like.

This composition was neither fluid nor natural in heat curing. Thus, in the embodiment of FIG. 2 shown in FIG. 21, the adhesive composition described above is placed on the printed board 2 at a predetermined position as shown in FIGS. As shown in FIG. 1 and FIG. 2, the electronic component 30 is mounted on the printed board 2 at a predetermined position by the adsorption plates 11A and 11B by the same action as in the first embodiment. .

The adhesive composition is cured by heat.

As the heating mechanism, a method of embedding PTC in the suction plates 11A and 11B as in the example of FIG. 1 described above is adopted, as well as a belt conveyor (as shown in FIG. 21 alone or in combination with this configuration). You may provide the drying furnace 95 by well-known heat transfer in the desired position on the side plate 60 (60a) of 3).

Thereby, the printed circuit board to which the electronic component is bonded is passed through the center of this drying furnace 95 in the middle of being conveyed by the belt conveyor 3, and it is also possible to heat-harden its adhesive composition.

In FIG. 21, E denotes a power source for the drying furnace 95. As shown in FIG.

Instead of embedding the electric PTC in the adsorption plates 11A and 11B, instead of embedding the nichrome wire in the adsorption plates 11A and 11B and energizing it, it is also possible to maintain the adsorption plate itself at a high temperature at all times or hot air in the adsorption plates. The adhesive may be heat-cured by hot air from the nozzle when the nozzle for ejection is provided and the electronic component is bonded to the printed board.

Next, another embodiment of the magazine applicable to the present invention will be described. On both sides of the magazine 123 accommodating the electronic component 130 in the through hole 131 in FIG.用 孔) 140 is formed. In addition, the support member 141 is fixed to the upper plate 120 of the magazine guide plate according to the magazine 123, and the steel ball 143 is formed of the compression spring 144 on the recess 142 of the support member 141. Ball Creek mechanism is installed.

As a result, in the state in which the magazine 123 is inserted into the magazine guide plate, the steel ball 143 is decompressed to the hanging hole 140, thereby making it possible to reliably prevent the fluctuation and vibration of the magazine 123.

In addition, in the configuration of FIG. 27, the hanging hole 140 may be made in at least one place on either side, even if both sides are not.

Moreover, you may form a recessed part instead of a hole.

Another embodiment of the upper opening portion of the magazine is described with reference to FIG. 28. In FIG. 28, the press-elastic pins 210 are formed in the upper end portion 223b of the magazine 223 in the notch grooves 211a and 211b. ), And the inner surface is integrally formed to bend slightly on the inner surface such that the inner surface becomes one surface such as four surfaces of the through hole 281.

The structure other than the upper end of the magazine 223 is the same as that of FIG. 8 or 27 and the electronic component 230 is held in a stacked state by a lid inserted into the through hole 231.

In the above configuration, when the rectangular dimension inscribed to the inner surface of the pressing elastic pin 210 and the other inner surface of the magazine 223 is set slightly smaller than the dimension of the electronic component 230, it is positioned in the opening of the magazine 223. The electronic component 230 is subjected to the force in the direction of the arrow Y by the pressing elastic pin 210, and as a result, the electronic component 230 is maintained in contact with the inner surface that is the reference surface of the through hole 231.

Therefore, according to the above embodiment, when the electronic component 230 is mounted on the printed board using the magazine 223, the fluctuation between the through hole 231 and the electronic component 230 can be eliminated. Since the 230 is always maintained in contact with the inner surface of the through hole 231, accurate positioning is possible, and the mounting position does not occur and can be attached with high precision. The pressing elastic pins may be formed at both ends of the square cylindrical body, and the inner surface of the pressing elastic pins may be a flat surface or a curved surface.

Next, another embodiment of the push rod mechanism applicable to the present invention will be described.

In this embodiment, it is intended to provide a pressing mechanism that is easy to disassemble and replace the pressing rod.

In FIG. 29 and FIG. 30, the base plate 310 of the apparatus main body is fixed to the fixed guide plate mounting base 311, and the movable guide plate mounting base 312 is provided to raise and lower the base 310. As shown in FIG.

A movable guide plate 313 for fixing the push rod 306 is fixedly supported by the movable guide plate mounting table 312.

The disassembly screw plate 315 is screw-mounted in the screw hole 314 in which the screw hole 314 is formed in the push bar attachment position of the movable guide plate 313. As shown in FIG. A through hole 316 is formed at the center of the dismantling screw pin 315 and a driver groove 317 is formed at the bottom surface of the disassembly screw pin 315. All.

On the other hand, in the middle of the push rod 306, the outer diameter stop wheel 318 which is smaller than the disassembly screw pin 315 is stuck, and the push rod 306 is provided in the state which installed the compression spring 319 in contact with this stop wheel 318. Is inserted into the through hole 316 of the dismantling screw pin 315, and is attached to the stop ring 320 in a downward manner with respect to the disassembling screw pin 315.

And the push rod 306 is guided in a vertical state from the fixed guide plate 321 fixed to the fixed guide plate mounting plate 311 is moved in response to the lifting of the movable guide plate mounting plate 312.

The tip of the push rod 306 is in contact with the plug in the magazine 303 supported by the magazine guide plate 331 when the magazine guide plate 331 is placed on the magazine guide plate support 330. .

In the above configuration, the movable guide plate mounting table 312 is normally raised by one operation only in thickness of the electronic component, and thus the tip of the push rod 306 is also raised to push up the plug in the magazine 303.

In this case, the pressure ball 306 is not directly fixed to the movable guide plate 313, but is pushed upward by the compression spring 319. When the pressure ball 306 is pushed up, it is applied to the push rod 306, the plug, and the electronic component. It can absorb losing shock.

In addition, when the pressure bar 306 is bent due to some kind of load, it is not necessary to replace the pressure bar 306. In this case, the stop wheel 320 is released, and the release screw pin 315 is inserted into the driver groove. After disassembling with a driver or the like using 317, the push bar 306 can be easily disassembled by pulling it out downward.

In addition, in the above embodiment, the screw pin 315 for disassembly is provided with a driver groove 317, but it may be dismantled from a tool jig other than a screwdriver by forming a cross recess, a square recess, and the like.

As described above, according to the pressurizing mechanism of the present embodiment, the stopper is attached to the disassembly threaded pin having a larger outer diameter by inserting the pusher into the stopper to facilitate disassembly and replacement of the pusher.

According to the present invention, it is possible to mount a plurality of electronic components adsorbed on the adsorption plate on the surface by mounting the pins having the shape of the layered conductor of the printed circuit board on the upper surface, thereby ensuring safety, reliability and high accuracy. With this, electronic components can be mounted on a printed board.

Claims (1)

A plurality of penetrations at a position corresponding to the relationship position of the printed circuit board support member for horizontally supporting the printed circuit board 2 having the layered conductor 2a of a certain shape on the upper surface, and the electronic component 30 to be mounted on the printed circuit board. A through hole of the magazine guide plate 8 having a horizontally installed magazine guide plate 8 having a ball and an upper recess 23b in the same horizontal plane as the hollow interior to hold a plurality of chip-like electronic component layers. A plurality of hollow vertical cylindrical magazines 23 slidably fitted into the cylindrical magazine 23 and the uppermost electronic components of each electronic component layer are positioned in the upper opening 23b of each cylindrical magazine 23. Electronic component pressing means for gradually pushing up each electronic component layer and penetrating through the magazine guide plate 8 so as to adsorb the upper electronic product of each electronic component located at the upper opening 23b of the cylindrical magazine 23. Of the decompressed tubular magazine The electronic component adsorption means including the adsorption plates 11A and 11B having a plurality of adsorption holes 54 at positions corresponding to the large positions, and the electronic components adsorbed on the adsorption positions and the adsorption plates 11A and 11B are printed. An apparatus for mounting a chip-type electronic component on a printed board, characterized in that it comprises a transfer means for moving the electronic component adsorption means between positions fixed to the substrate.