KR20250160432A - 경화성 화합물, 경화성 수지 조성물, 경화물 및 적층체 - Google Patents
경화성 화합물, 경화성 수지 조성물, 경화물 및 적층체Info
- Publication number
- KR20250160432A KR20250160432A KR1020257028794A KR20257028794A KR20250160432A KR 20250160432 A KR20250160432 A KR 20250160432A KR 1020257028794 A KR1020257028794 A KR 1020257028794A KR 20257028794 A KR20257028794 A KR 20257028794A KR 20250160432 A KR20250160432 A KR 20250160432A
- Authority
- KR
- South Korea
- Prior art keywords
- curable
- compound
- group
- resin composition
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2023-046582 | 2023-03-23 | ||
| JP2023046582 | 2023-03-23 | ||
| PCT/JP2024/008650 WO2024195556A1 (ja) | 2023-03-23 | 2024-03-07 | 硬化性化合物、硬化性樹脂組成物、硬化物及び積層体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250160432A true KR20250160432A (ko) | 2025-11-13 |
Family
ID=92841960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257028794A Pending KR20250160432A (ko) | 2023-03-23 | 2024-03-07 | 경화성 화합물, 경화성 수지 조성물, 경화물 및 적층체 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4685171A1 (https=) |
| JP (1) | JP7648022B2 (https=) |
| KR (1) | KR20250160432A (https=) |
| CN (1) | CN120380051A (https=) |
| TW (1) | TW202442728A (https=) |
| WO (1) | WO2024195556A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013256557A (ja) | 2012-06-11 | 2013-12-26 | Hitachi Ltd | 接着剤組成物及び接着構造体の解体方法 |
| JP2017041496A (ja) | 2015-08-18 | 2017-02-23 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4087602B2 (ja) * | 2001-12-14 | 2008-05-21 | 横浜ゴム株式会社 | 硬化性化合物およびそれを含む硬化性樹脂組成物 |
| US6825315B2 (en) * | 2001-12-21 | 2004-11-30 | Sandia Corporation | Method of making thermally removable adhesives |
| CN104163817B (zh) * | 2014-02-12 | 2017-02-22 | 安徽善孚新材料科技股份有限公司 | 一种含呋喃自修复基团的环氧树脂及其制备方法 |
| CN104193966A (zh) * | 2014-08-31 | 2014-12-10 | 海安南京大学高新技术研究院 | 一种含联苯结构的自修复功能型环氧树脂及其制备方法 |
| EP4261037B1 (en) * | 2020-12-10 | 2025-04-16 | DIC Corporation | Epoxy resin composition, cured product thereof, and laminate |
| CN112920679A (zh) * | 2021-01-29 | 2021-06-08 | 南京工业大学 | 一种防腐涂料及其制备方法与应用 |
-
2024
- 2024-03-07 KR KR1020257028794A patent/KR20250160432A/ko active Pending
- 2024-03-07 JP JP2025501632A patent/JP7648022B2/ja active Active
- 2024-03-07 CN CN202480005596.6A patent/CN120380051A/zh active Pending
- 2024-03-07 EP EP24774695.1A patent/EP4685171A1/en active Pending
- 2024-03-07 WO PCT/JP2024/008650 patent/WO2024195556A1/ja not_active Ceased
- 2024-03-08 TW TW113108542A patent/TW202442728A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013256557A (ja) | 2012-06-11 | 2013-12-26 | Hitachi Ltd | 接着剤組成物及び接着構造体の解体方法 |
| JP2017041496A (ja) | 2015-08-18 | 2017-02-23 | 富士電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202442728A (zh) | 2024-11-01 |
| EP4685171A1 (en) | 2026-01-28 |
| CN120380051A (zh) | 2025-07-25 |
| WO2024195556A1 (ja) | 2024-09-26 |
| JP7648022B2 (ja) | 2025-03-18 |
| JPWO2024195556A1 (https=) | 2024-09-26 |
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Legal Events
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| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| E13 | Pre-grant limitation requested |
Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
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St.27 status event code: A-2-3-E10-E13-lim-X000 |
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| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| P11-X000 | Amendment of application requested |
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| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| Q12 | Application published |
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