TW202442728A - 硬化性化合物、硬化性樹脂組成物、硬化物及積層體 - Google Patents

硬化性化合物、硬化性樹脂組成物、硬化物及積層體 Download PDF

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Publication number
TW202442728A
TW202442728A TW113108542A TW113108542A TW202442728A TW 202442728 A TW202442728 A TW 202442728A TW 113108542 A TW113108542 A TW 113108542A TW 113108542 A TW113108542 A TW 113108542A TW 202442728 A TW202442728 A TW 202442728A
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TW
Taiwan
Prior art keywords
compound
curable
group
resin composition
resin
Prior art date
Application number
TW113108542A
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English (en)
Chinese (zh)
Inventor
大津理人
有田和郎
鈴木悅子
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202442728A publication Critical patent/TW202442728A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
TW113108542A 2023-03-23 2024-03-08 硬化性化合物、硬化性樹脂組成物、硬化物及積層體 TW202442728A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-046582 2023-03-23
JP2023046582 2023-03-23

Publications (1)

Publication Number Publication Date
TW202442728A true TW202442728A (zh) 2024-11-01

Family

ID=92841960

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113108542A TW202442728A (zh) 2023-03-23 2024-03-08 硬化性化合物、硬化性樹脂組成物、硬化物及積層體

Country Status (6)

Country Link
EP (1) EP4685171A1 (https=)
JP (1) JP7648022B2 (https=)
KR (1) KR20250160432A (https=)
CN (1) CN120380051A (https=)
TW (1) TW202442728A (https=)
WO (1) WO2024195556A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4087602B2 (ja) * 2001-12-14 2008-05-21 横浜ゴム株式会社 硬化性化合物およびそれを含む硬化性樹脂組成物
US6825315B2 (en) * 2001-12-21 2004-11-30 Sandia Corporation Method of making thermally removable adhesives
JP2013256557A (ja) 2012-06-11 2013-12-26 Hitachi Ltd 接着剤組成物及び接着構造体の解体方法
CN104163817B (zh) * 2014-02-12 2017-02-22 安徽善孚新材料科技股份有限公司 一种含呋喃自修复基团的环氧树脂及其制备方法
CN104193966A (zh) * 2014-08-31 2014-12-10 海安南京大学高新技术研究院 一种含联苯结构的自修复功能型环氧树脂及其制备方法
JP6575220B2 (ja) 2015-08-18 2019-09-18 富士電機株式会社 半導体装置
EP4261037B1 (en) * 2020-12-10 2025-04-16 DIC Corporation Epoxy resin composition, cured product thereof, and laminate
CN112920679A (zh) * 2021-01-29 2021-06-08 南京工业大学 一种防腐涂料及其制备方法与应用

Also Published As

Publication number Publication date
EP4685171A1 (en) 2026-01-28
CN120380051A (zh) 2025-07-25
WO2024195556A1 (ja) 2024-09-26
JP7648022B2 (ja) 2025-03-18
JPWO2024195556A1 (https=) 2024-09-26
KR20250160432A (ko) 2025-11-13

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