KR20250018531A - 폴리이미드 수지 전구체 - Google Patents

폴리이미드 수지 전구체 Download PDF

Info

Publication number
KR20250018531A
KR20250018531A KR1020247043104A KR20247043104A KR20250018531A KR 20250018531 A KR20250018531 A KR 20250018531A KR 1020247043104 A KR1020247043104 A KR 1020247043104A KR 20247043104 A KR20247043104 A KR 20247043104A KR 20250018531 A KR20250018531 A KR 20250018531A
Authority
KR
South Korea
Prior art keywords
group
polyimide resin
meth
carbon atoms
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247043104A
Other languages
English (en)
Korean (ko)
Inventor
가즈아키 에비사와
마키코 이리에
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20250018531A publication Critical patent/KR20250018531A/ko
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020247043104A 2022-06-02 2023-04-28 폴리이미드 수지 전구체 Pending KR20250018531A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-090501 2022-06-02
JP2022090501 2022-06-02
PCT/JP2023/016823 WO2023233895A1 (ja) 2022-06-02 2023-04-28 ポリイミド樹脂前駆体

Publications (1)

Publication Number Publication Date
KR20250018531A true KR20250018531A (ko) 2025-02-06

Family

ID=89026331

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247043104A Pending KR20250018531A (ko) 2022-06-02 2023-04-28 폴리이미드 수지 전구체

Country Status (4)

Country Link
JP (1) JPWO2023233895A1 (https=)
KR (1) KR20250018531A (https=)
TW (1) TW202406982A (https=)
WO (1) WO2023233895A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019044874A (ja) 2017-09-01 2019-03-22 Ntn株式会社 減速装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06102667A (ja) * 1991-08-13 1994-04-15 Toray Ind Inc 感光性ポリイミド前駆体組成物およびその製造方法
JPH0680776A (ja) * 1992-09-02 1994-03-22 Asahi Chem Ind Co Ltd ポリイミド前駆体及び組成物
JPH07238168A (ja) * 1994-02-28 1995-09-12 Asahi Chem Ind Co Ltd 規則性のあるポリマー及び組成物
JPH07242744A (ja) * 1994-03-02 1995-09-19 Asahi Chem Ind Co Ltd 低応力膜を与える組成物
KR102796438B1 (ko) * 2020-08-28 2025-04-16 후지필름 가부시키가이샤 감광성 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 및, 반도체 디바이스

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019044874A (ja) 2017-09-01 2019-03-22 Ntn株式会社 減速装置

Also Published As

Publication number Publication date
TW202406982A (zh) 2024-02-16
JPWO2023233895A1 (https=) 2023-12-07
WO2023233895A1 (ja) 2023-12-07

Similar Documents

Publication Publication Date Title
JP7671182B2 (ja) 感光性樹脂組成物
KR101392539B1 (ko) 폴리이미드 전구체 및 이 폴리이미드 전구체를 포함하는 감광성 수지 조성물
JP7704516B2 (ja) ワニス組成物、及びポリイミド膜の製造方法
US20220282043A1 (en) Curable composition for insulating film formation, insulating film formation method, and terminally maleimide-modified polyphenylene ether resin
JP2023054767A (ja) ポリアミド樹脂の製造方法
KR20240072266A (ko) 블록 공중합체
KR20220058411A (ko) 폴리이미드 바니시, 폴리이미드막의 제조 방법, 및 패턴화된 폴리이미드막의 제조 방법
KR20240158986A (ko) 폴리이미드 수지 전구체
KR20250018531A (ko) 폴리이미드 수지 전구체
JP7505140B2 (ja) 感光性樹脂組成物
JP7833874B2 (ja) 感光性樹脂組成物
JP2024070706A (ja) 感光性樹脂組成物
JP2024085652A (ja) ポリイミド樹脂前駆体
KR20260035747A (ko) 감광성 수지 조성물 및 패턴화된 폴리이미드 수지막의 제조 방법
JP2025101650A (ja) ネガ型感光性樹脂組成物、パターン化された樹脂膜の製造方法、及びパターン化されたポリイミド樹脂膜の製造方法
JP2025135142A (ja) ネガ型感光性樹脂組成物、樹脂膜の製造方法、パターン化された樹脂膜の製造方法、パターン化されたポリイミド樹脂膜の製造方法、及びポリイミド樹脂前駆体
JP2024004837A (ja) ポリアミド樹脂の製造方法
KR20250099642A (ko) 네거티브형 감광성 수지 조성물, 패턴화된 수지막의 제조 방법, 및 패턴화된 폴리이미드 수지막의 제조 방법
JP2025101649A (ja) ネガ型感光性樹脂組成物、パターン化された樹脂膜の製造方法、及びパターン化されたポリイミド樹脂膜の製造方法、並びにポリイミド樹脂前駆体
JP2025102502A (ja) ポリイミド樹脂前駆体、及び感光性組成物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000