KR20250004353A - 트렌치 오버행 구조들을 갖는 oled 패널 - Google Patents
트렌치 오버행 구조들을 갖는 oled 패널 Download PDFInfo
- Publication number
- KR20250004353A KR20250004353A KR1020247039823A KR20247039823A KR20250004353A KR 20250004353 A KR20250004353 A KR 20250004353A KR 1020247039823 A KR1020247039823 A KR 1020247039823A KR 20247039823 A KR20247039823 A KR 20247039823A KR 20250004353 A KR20250004353 A KR 20250004353A
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- KR
- South Korea
- Prior art keywords
- pdl
- structures
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- cathode
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000463 material Substances 0.000 claims abstract description 117
- 238000005538 encapsulation Methods 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims description 144
- 239000002184 metal Substances 0.000 claims description 144
- 230000002093 peripheral effect Effects 0.000 claims description 60
- 229910010272 inorganic material Inorganic materials 0.000 claims description 25
- 239000011147 inorganic material Substances 0.000 claims description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 11
- 239000012811 non-conductive material Substances 0.000 claims description 11
- 239000010936 titanium Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 8
- 238000002161 passivation Methods 0.000 claims description 8
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 238000005137 deposition process Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 20
- 230000008020 evaporation Effects 0.000 description 14
- 238000001704 evaporation Methods 0.000 description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 238000001312 dry etching Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000010329 laser etching Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/822—Cathodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80521—Cathodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/661,320 US11552143B1 (en) | 2022-04-29 | 2022-04-29 | OLED panel with trench overhang structures |
| US17/661,320 | 2022-04-29 | ||
| US18/065,124 | 2022-12-13 | ||
| US18/065,124 US11839116B2 (en) | 2022-04-29 | 2022-12-13 | OLED panel with trench overhang structures |
| PCT/US2023/012029 WO2023211524A1 (en) | 2022-04-29 | 2023-01-31 | Oled panel with trench overhang structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250004353A true KR20250004353A (ko) | 2025-01-07 |
Family
ID=84810603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247039823A Pending KR20250004353A (ko) | 2022-04-29 | 2023-01-31 | 트렌치 오버행 구조들을 갖는 oled 패널 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11552143B1 (https=) |
| EP (1) | EP4516081A4 (https=) |
| JP (1) | JP2025515367A (https=) |
| KR (1) | KR20250004353A (https=) |
| CN (1) | CN119302065A (https=) |
| WO (1) | WO2023211524A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102366313B1 (ko) * | 2017-09-08 | 2022-02-23 | 삼성디스플레이 주식회사 | 보호 필름, 표시 모듈, 표시 장치, 표시 모듈 제조 방법 및 표시 장치 제조 방법 |
| US11552143B1 (en) | 2022-04-29 | 2023-01-10 | Applied Materials, Inc. | OLED panel with trench overhang structures |
| EP4566431A1 (en) | 2022-08-01 | 2025-06-11 | Applied Materials, Inc. | Bezel-less camera and sensor hole |
| KR20240053096A (ko) * | 2022-10-14 | 2024-04-24 | 삼성디스플레이 주식회사 | 표시 패널 |
| US20240324280A1 (en) * | 2023-03-24 | 2024-09-26 | Samsung Display Co., Ltd. | Method of manufacturing display apparatus |
| US12193280B1 (en) * | 2023-12-08 | 2025-01-07 | Applied Materials, Inc. | High resolution advanced OLED sub-pixel circuit and patterning method |
| US12402489B1 (en) * | 2024-07-24 | 2025-08-26 | Applied Materials, Inc. | High resolution advanced OLED sub-pixel circuit |
| US12453252B1 (en) | 2024-09-06 | 2025-10-21 | Applied Materials, Inc. | OLED sub-pixel circuit architecture and related methods |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6069443A (en) * | 1997-06-23 | 2000-05-30 | Fed Corporation | Passive matrix OLED display |
| JP3078257B2 (ja) * | 1998-04-15 | 2000-08-21 | ティーディーケイ株式会社 | 有機el表示装置及びその製造方法 |
| KR100744634B1 (ko) | 2005-11-30 | 2007-08-01 | (재)대구경북과학기술연구원 | 유기전계발광 표시장치 및 면광원 장치 |
| US8232940B2 (en) * | 2006-04-26 | 2012-07-31 | Sharp Kabushiki Kaisha | Organic electroluminescent display device and production method thereof |
| KR102010429B1 (ko) * | 2011-02-25 | 2019-08-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 사용한 전자 기기 |
| KR102370035B1 (ko) | 2015-02-05 | 2022-03-07 | 삼성디스플레이 주식회사 | 투명 표시 기판, 투명 표시 장치 및 투명 표시 장치의 제조 방법 |
| CN109216407B (zh) * | 2017-06-30 | 2022-08-26 | 昆山国显光电有限公司 | Oled显示面板及其制备方法 |
| KR20200049115A (ko) | 2018-10-31 | 2020-05-08 | 엘지디스플레이 주식회사 | 투명 유기 발광 표시 장치 및 이의 제조방법 |
| KR102814723B1 (ko) * | 2019-06-21 | 2025-05-30 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102912633B1 (ko) * | 2019-09-04 | 2026-01-14 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR102929067B1 (ko) * | 2019-12-31 | 2026-02-23 | 엘지디스플레이 주식회사 | 터치 센서를 포함하는 유기 발광 다이오드 표시 장치 및 그 제조 방법 |
| CN111312923B (zh) * | 2020-02-25 | 2022-12-27 | 京东方科技集团股份有限公司 | Oled显示基板及其制作方法、显示装置 |
| US20230301139A1 (en) * | 2020-09-04 | 2023-09-21 | Applied Materials, Inc. | Inorganic silicon-containing overhang structures of oled subpixels |
| KR102817673B1 (ko) * | 2020-09-04 | 2025-06-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 무기 픽셀 봉입 배리어를 갖는 oled 패널을 제작하는 방법들 |
| CN112164763B (zh) * | 2020-09-29 | 2023-05-26 | 京东方科技集团股份有限公司 | 有机发光显示面板、制备有机发光显示面板的方法及显示装置 |
| KR102843630B1 (ko) | 2020-10-16 | 2025-08-08 | 삼성디스플레이 주식회사 | 표시 장치 |
| US12581825B2 (en) * | 2021-04-23 | 2026-03-17 | Applied Materials, Inc. | Conductive oxide overhang structures for OLED devices |
| US12289945B2 (en) * | 2021-12-03 | 2025-04-29 | Applied Materials, Inc. | Quasi global cathode contact method for advanced patterning |
| US11552143B1 (en) | 2022-04-29 | 2023-01-10 | Applied Materials, Inc. | OLED panel with trench overhang structures |
-
2022
- 2022-04-29 US US17/661,320 patent/US11552143B1/en active Active
- 2022-12-13 US US18/065,124 patent/US11839116B2/en active Active
-
2023
- 2023-01-31 EP EP23796974.6A patent/EP4516081A4/en active Pending
- 2023-01-31 JP JP2024563850A patent/JP2025515367A/ja active Pending
- 2023-01-31 CN CN202380044255.5A patent/CN119302065A/zh active Pending
- 2023-01-31 KR KR1020247039823A patent/KR20250004353A/ko active Pending
- 2023-01-31 WO PCT/US2023/012029 patent/WO2023211524A1/en not_active Ceased
- 2023-10-31 US US18/498,140 patent/US12029077B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20230354649A1 (en) | 2023-11-02 |
| WO2023211524A1 (en) | 2023-11-02 |
| JP2025515367A (ja) | 2025-05-14 |
| EP4516081A4 (en) | 2026-04-15 |
| US11839116B2 (en) | 2023-12-05 |
| US11552143B1 (en) | 2023-01-10 |
| EP4516081A1 (en) | 2025-03-05 |
| US20240065043A1 (en) | 2024-02-22 |
| CN119302065A (zh) | 2025-01-10 |
| US12029077B2 (en) | 2024-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20241129 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application |