KR20240104250A - Substrate processing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing device that can prevent contamination of substrates and processing spaces by particles generated during substrate processing. The substrate processing apparatus includes a substrate support unit having a support member for supporting a substrate, a rotation driver for rotating the support member, and a lower fluid supply unit for supplying fluid to the bottom of the substrate supported on the support member, wherein the rotation The driving unit includes a rotation shaft coupled to the support member and a driver that rotates the rotation shaft, and the lower fluid supply unit includes a body positioned to be spaced apart from the support member and the rotation axis inside the substrate support unit. It may include a fluid supply pipe provided inside and supplying the fluid, and a fixing member that fixes the body in a lower area of the body and has a centering function.

Description

Substrate processing apparatus {SUBSTRATE PROCESSING APPARATUS}

The present invention relates to a device for liquid processing a substrate.

To manufacture semiconductor devices, various processes such as photography, deposition, ashing, etching, ion implantation, etc. are performed. Before and after these processes are performed, a cleaning process is performed to clean particles remaining on the substrate.

The cleaning process can be performed by supplying a cleaning solution to both sides of a substrate supported on a rotating support member. The lower surface of the substrate may be cleaned by the processing liquid supplied from the lower fluid supply unit to the space between the support member supporting the substrate and the lower surface of the substrate.

The support member is coupled to the rotary drive unit, and the rotary drive unit includes a support shaft having an internal space and a driver. The actuator rotates the support shaft, and the support shaft rotates the support member.

A lower fluid supply unit is provided in the inner space of the support shaft, and the lower fluid supply unit includes a body and a fluid supply part provided in the inner space of the body. The fluid supply unit supplies fluid to the lower surface of the substrate, and the body is installed at a certain distance from the support member and is fixed even when the support member rotates.

In order to fix the body from the rotating support member, the lower part of the body is fixed by a fixing bracket such as a shaft, and the upper part of the body is fixed by a mechanical member such as a bearing installed in the space spaced apart from the supporting member. In the case of a fixed bracket such as a shaft, since it does not have a centering function to keep the center of the body surrounding the internal pipe constant, the support member and the body rub against the mechanical member as the support member rotates. Accordingly, particles are generated as the mechanical member is broken. Particles may move upward and enter the space between the substrate and the support member, causing process defects. Additionally, if particles remain in the surrounding area of the mechanical member, the remaining particles may cause additional friction with the mechanical member when the support member rotates, shortening the life of the equipment.

The present invention is intended to solve the above-described problems and is intended to provide a substrate processing device that can prevent contamination of the substrate and the inside of the processing space by particles generated by the equipment itself during the substrate processing process.

The problem to be solved by the present invention is not limited to this, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to one embodiment of the present invention, a substrate support unit having a support member for supporting a substrate and a rotation driver for rotating the support member; and a lower fluid supply unit supplying fluid to the bottom of the substrate supported on the support member. The rotation drive unit includes a rotation shaft coupled to the support member; and a driver that rotates the rotation shaft, wherein the lower fluid supply unit includes: a body positioned inside the substrate support unit to be spaced apart from the support member and the rotation shaft; a fluid supply pipe provided inside the body and supplying the fluid; and a fixing member that fixes the body in a lower region of the body and has a centering function.

In one embodiment, the fixing member includes an inner ring accommodating the body; an outer ring into which the inner ring is inserted; And it may include a bolt connecting the inner ring and the outer ring.

In one embodiment, the inner ring and the outer ring include flange portions, each of the flange portions includes the same number of fastening holes formed at positions corresponding to each other, and the bolt passes through the fastening holes of the inner ring. The inner ring and the outer ring may be coupled by being fastened to the fastening hole of the outer ring.

In one embodiment, as the bolt is fastened to the fastening hole of the outer ring through the fastening hole of the inner ring, the inner surface of the inner ring may compress the outer surface of the body.

In one embodiment, the fixing member may be positioned below the driver and spaced apart from the driver.

In one embodiment, the outer surface of the inner ring includes an inclined surface whose outer diameter decreases as it moves away from the flange portion, and the upper inner surface of the outer ring corresponds to the outer surface of the inner ring and the flange portion. It may include an inclined surface whose inner diameter decreases as the distance from it increases.

According to one embodiment of the present invention, a rotating body including a support member for supporting a substrate and a rotation axis coupled to a lower surface of the support member to rotate the support member; a body provided inside the rotating body and positioned to be spaced apart from the inner wall of the rotating body; a fixing member for fixing the body in a lower region of the body; and a substrate support unit provided inside the body and including a fluid supply pipe for supplying fluid to the object to be processed. The fixing member may have a centering function to keep the center of the body constant when the rotating body rotates.

In one embodiment, the fixing member includes an inner ring accommodating the body; an outer ring into which the inner ring is inserted; And it may include a bolt connecting the inner ring and the outer ring.

In one embodiment, the inner ring and the outer ring include flange portions, each of the flange portions includes the same number of fastening holes formed at positions corresponding to each other, and the bolt passes through the fastening holes of the inner ring. The inner ring and the outer ring may be coupled by being fastened to the fastening hole of the outer ring.

In one embodiment, as the bolt is fastened to the fastening hole of the outer ring through the fastening hole of the inner ring, the inner surface of the inner ring may compress the outer surface of the body.

According to an embodiment of the present invention, contamination of the substrate and processing space by particles can be minimized by removing the particle source of the substrate processing apparatus.

The effect of the invention is not limited to this, and other effects not mentioned can be clearly understood by those skilled in the art from this specification and the attached drawings.

1 is a plan view showing a substrate processing facility according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing the substrate processing apparatus of FIG. 1.
FIG. 3 is a schematic cross-sectional view illustrating the substrate support unit of FIG. 2.
FIG. 4 is an enlarged cross-sectional view showing the upper part of FIG. 3.
Figure 5 is an enlarged cross-sectional view showing the lower part of Figure 3.
Figure 6 is a perspective view showing a fixing member according to an embodiment of the present invention.
Figure 7 is a cross-sectional view of Figure 6.

Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. For example, changes in manufacturing methods and/or tolerances are fully expected. Accordingly, the embodiments of the present invention are not to be described as limited to the specific shapes of the regions illustrated in the accompanying drawings, but rather include deviations in shape, and the elements depicted in the drawings are entirely schematic and their shapes are It is not intended to describe the exact shape of the elements, nor is it intended to limit the scope of the invention. In the description with reference to the accompanying drawings, identical or corresponding components will be given the same reference numbers regardless of the reference numerals, and duplicate descriptions thereof will be omitted.

In describing embodiments of the present invention, if it is determined that specific descriptions of related known functions or configurations may unnecessarily obscure the gist of the present invention, the detailed descriptions will be omitted, and parts that perform similar functions and actions will be omitted. The same symbols will be used throughout the drawings.

At least some of the terms used in the specification are defined in consideration of the functions in the present invention and may vary depending on the user, operator intention, custom, etc. Therefore, the term should be interpreted based on the content throughout the specification.

Additionally, in this specification, singular forms also include plural forms unless specifically stated in the context. In the specification, when it is said that a certain component is included, this does not mean that other components are excluded, but that other components may be further included, unless specifically stated to the contrary. And, when a part is said to be connected (or combined) with another part, this refers not only to the case where it is connected (or combined) directly, but also to the case where it is indirectly connected (or combined) with another part in between. Includes.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted in an ideal or excessively formal sense unless explicitly defined in the present application. No.

Meanwhile, in drawings, the size, shape, and thickness of lines of components may be somewhat exaggerated for ease of understanding.

1 is a plan view schematically showing an example of a substrate processing facility to which the present invention can be applied. Referring to FIG. 1, a substrate processing facility 1 to which the present invention is applied has an index module 10 and a process processing module 20. The index module 10 has a load port 120 and an index frame 140. The load port 120, the index frame 140, and the process processing module 20 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the index frame 140, and the process processing module 20 are arranged is referred to as the first direction 12, and when viewed from the top, the direction perpendicular to the first direction 12 The direction is called the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is called the third direction 16.

A carrier 130 containing a substrate W may be seated in the load port 120 . A plurality of load ports 120 are provided, and they may be arranged in a row along the second direction 14. The number of load ports 120 may increase or decrease depending on the process efficiency and footprint conditions of the process module 20. A plurality of slots (not shown) may be formed in the carrier 130 to accommodate the substrates W arranged horizontally with respect to the ground. A Front Opening Unified Pod (FOUP) may be used as the carrier 130.

The processing module 20 may include a buffer unit 220, a transfer chamber 240, and a process unit 260. The transfer chamber 240 may be arranged so that its longitudinal direction is parallel to the first direction 12 . Process units 260 may be disposed on both sides of the transfer chamber 240, respectively. For example, the process units 260 on one side and the other side of the transfer chamber 240 may be provided to be symmetrical with respect to the transfer chamber 240 . A plurality of process units 260 may be provided on one side of the transfer chamber 240. Some of the process units 260 are arranged along the longitudinal direction of the transfer chamber 240. Additionally, some of the process units 260 are arranged to be stacked on top of each other. For example, the process units 260 may be arranged in an A x B arrangement on one side of the transfer chamber 240. Here, A is the number of process units 260 provided in a row along the first direction 12, and B is the number of process units 260 provided in a row along the third direction 16. When four or six process units 260 are provided on one side of the transfer chamber 240, the process units 260 may be arranged in a 2 x 2 or 3 x 2 arrangement. The number of process units 260 may be increased or decreased. Unlike what was described above, the process unit 260 may be provided on only one side of the transfer chamber 240. Additionally, the process unit 260 may be provided as a single layer on one or both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the index frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before it is transferred between the transfer chamber 240 and the index frame 140. A slot (not shown) in which the substrate W is placed may be provided inside the buffer unit 220. A plurality of slots (not shown) may be provided to be spaced apart from each other along the third direction 16. The buffer unit 220 may have an open side facing the index frame 140 and a side facing the transfer chamber 240 .

The index frame 140 may transport the substrate W between the carrier 130 mounted on the load port 120 and the buffer unit 220. The index frame 140 may be provided with an index rail 142 and an index robot 144. The index rail 142 is provided in a longitudinal direction parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and moves linearly along the index rail 142 in the second direction 14. The index robot 144 may have a base 144a, a body 144b, and an index arm 144c. The base 144a may be installed to be movable along the index rail 142. The body 144b is coupled to the base 144a, and the body 144b may be provided to be movable along the third direction 16 on the base 144a. Additionally, the body 144b may be provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and may be provided to move forward and backward with respect to the body 144b. A plurality of index arms 144c may be provided and each may be individually driven. The index arms 144c may be arranged to be stacked and spaced apart from each other along the third direction 16. Some of the index arms 144c are used to transfer the substrate W from the processing module 20 to the carrier 130, and other portions are used to transfer the substrate W from the carrier 130 to the processing module 20. It can be used when returning . This may be to prevent particles generated from the substrate W before processing from attaching to the substrate W after processing during the process of the index robot 144 loading and unloading the substrate W.

The transfer chamber 240 may transfer the substrate W between the buffer unit 220 and the process unit 260 and between the process units 260 . The transfer chamber 240 may be provided with a guide rail 242 and a main robot 244. The guide rail 242 is arranged so that its longitudinal direction is parallel to the first direction 12. The main robot 244 is installed on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242. The main robot 244 may have a base 244a, a body 244b, and a main arm 244c. The base 244a may be installed to be movable along the guide rail 242. The body 244b is coupled to the base 244a, and the body 244b may be provided to be movable along the third direction 16 on the base 244a. Additionally, the body 244b may be provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, and can be provided to move forward and backward with respect to the body 244b. A plurality of main arms 244c may be provided and each may be individually driven. The main arms 244c may be arranged to be stacked and spaced apart from each other along the third direction 16.

Process unit 260 may perform a processing process on a substrate. The process unit 260 may include a substrate processing device 300 for liquid processing the substrate W by supplying a processing liquid to the substrate W. As an embodiment to which the present invention is applied, a substrate processing apparatus that performs a cleaning process by supplying a cleaning liquid to the substrate W will be described as an example. The substrate processing device 300 included in the process unit 260 may have a different structure depending on the type of cleaning process to be performed. In contrast, the substrate processing device 300 included in each process unit 260 may have the same structure. Optionally, the process units 260 are divided into a plurality of groups, so that the substrate processing devices 300 provided to the process units 260 belonging to the same group are the same as each other and are provided to the process units 260 belonging to different groups. The structures of the substrate processing apparatus 300 may be provided differently.

FIG. 2 is a cross-sectional view schematically showing an example of the substrate processing apparatus 300 provided in the process unit 260 of FIG. 1 . The substrate processing apparatus 300 processes the substrate W with a liquid. In this embodiment, the liquid treatment process for the substrate is described as a cleaning process. However, this is not intended to limit the liquid treatment process to which the present invention is applied to a cleaning process, and the present invention is applicable to various liquid treatment processes such as photography, ashing, and etching.

Referring to FIG. 2, the substrate processing apparatus 300 includes a processing vessel 320, a substrate support unit 340, a lifting unit 360, an upper fluid supply unit 380, and a lower fluid supply unit 400. do.

The processing vessel 320 may provide a processing space within which a substrate is processed. The processing vessel 320 may have a cylindrical shape with an open top. The processing container 320 can prevent the processing liquid supplied to the substrate W from scattering around during the process. As an example, the processing container 320 may have an internal recovery container 322 and an external recovery container 326. Each recovery container 322 and 326 can recover different treatment liquids among the treatment liquids used in the process. The internal recovery container 322 may be provided in an annular ring shape surrounding the substrate support unit 340, and the external recovery container 326 may be provided in an annular ring shape surrounding the internal recovery container 326. The inner space 322a of the internal recovery container 322 and the internal recovery container 322 function as a first inlet 322a through which the treatment liquid flows into the internal recovery container 322. The space 326a between the internal recovery container 322 and the external recovery container 326 functions as a second inlet 326a through which the treatment liquid flows into the external recovery container 326. According to one example, each inlet (322a, 326a) may be located at a different height. Recovery lines 322b and 326b may be connected to the bottom of each recovery container 322 and 326. The treatment liquid flowing into each recovery tank 322 and 326 can be reused by being provided to an external treatment liquid recovery system (not shown) through the recovery lines 322b and 326b.

The substrate support unit 340 supports the substrate W in the processing space. The substrate support unit 340 may support and rotate the substrate W during the process. As an example, the substrate support unit 340 may include a spin head. The substrate support unit 340 may have a support member 342 and a rotation driver. The support member 342 is provided in a generally circular plate shape and has an upper surface and a lower surface. The lower surface may have a smaller diameter than the upper surface. The upper and lower surfaces are positioned so that their central axes coincide with each other.

The support member 342 may include a support pin 341 and a chuck pin 343. A plurality of support pins 341 may be provided and spaced apart at predetermined intervals on the upper surface of the support member 342. The support pin 341 may be provided to protrude upward from the support member 342. The support pins 341 may be arranged to have an overall annular ring shape by combining them with each other. The support pin 341 may support the bottom surface of the substrate W so that the substrate W is spaced a certain distance from the top surface of the support member 342 .

A plurality of chuck pins 343 may be provided and may be arranged to be farther away from the center of the support member 342 than the support pin 341. The chuck pin 343 may be provided to protrude upward from the upper surface of the support member 342. The chuck pin 343 supports the side of the substrate W so that the substrate W does not deviate from its fixed position when the support member 342 is rotated. The chuck pin 343 may be provided to enable linear movement between an outer position and an inner position along the radial direction of the support member 342. Here, the outer position refers to a position farther away from the center of the support member 342 than the inner position. When the substrate W is loaded or unloaded into the substrate support unit 340, the chuck pin 343 may be positioned at an outer position, and when a process is performed on the substrate W, the chuck pin 343 may be positioned at an inner position. there is. At this time, the inner position is a position where the sides of the chuck pin 343 and the substrate W contact each other, and the outer position is a position where the chuck pin 343 and the substrate W are spaced apart from each other.

The rotation drive unit rotates the support member 342. The support member 342 is rotatable about its own central axis by a rotation drive unit. The rotation driver may include a rotation shaft 344 and a driver 346.

The rotation axis 344 has a cylindrical shape with a height along the third direction 16. The rotation axis 344 has an internal space and its upper end may be fixedly coupled to the bottom of the support member 342. As an example, the rotation axis 344 may be fixedly coupled to the center of the bottom of the support member 342.

The driver 346 provides driving force to rotate the rotation shaft 344. Actuator 346 is connected to rotation shaft 344. As an example, the driver 346 may be a motor. The rotation shaft 344 is rotated by the driver 346, and the support member 342 is rotatable together with the rotation shaft 344. The driver 346 may be protected from the outside by a housing 347 provided to surround the driver 346.

Hereinafter, for convenience of explanation, the combination of the support member 342 and the rotation axis 344 will be referred to as the rotating bodies 342 and 344.

The lifting unit 360 moves the processing vessel 320 straight up and down. As the processing vessel 320 moves up and down, the relative height of the processing vessel 320 with respect to the support member 342 may change. The lifting unit 360 has a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly installed on the outer wall of the processing container 320, and a moving shaft 364 that moves in the vertical direction by the driver 366 may be fixedly coupled to the bracket 362.

For example, when the substrate W is placed on the substrate support unit 340 or lifted from the substrate support unit 340, the processing container 320 is configured such that the substrate support unit 340 protrudes toward the top of the processing container 320. ) is lowered, and when the process progresses, the height of the processing vessel 320 can be adjusted so that the processing liquid can flow into the preset recovery containers 322 and 326 depending on the type of processing liquid supplied to the substrate W. . Optionally, the lifting unit 360 may move the substrate support unit 340 in the vertical direction.

The upper fluid supply unit 380 supplies processing liquid to the upper surface of the substrate W. The upper surface of the substrate may be a pattern surface on which a pattern is formed. The upper fluid supply unit 380 may include a moving member 381 and a nozzle 390.

The moving member 381 can move the nozzle 390 to the process position and the standby position. Here, the process position is a position where the nozzle 390 faces the substrate W placed on the substrate support unit 340, and the standby position can be defined as a position where the nozzle 390 is outside the process position.

According to one example, the process location may include a pre-processing location and a post-processing location. The pre-processing position may be a position where the nozzle 390 supplies the processing liquid to the first supply position, and the post-processing position may be provided as a position where the nozzle 390 supplies the processing liquid to the second supply position. The first supply position may be a position closer to the center of the substrate W than the second supply position, and the second supply position may be a position including an end of the substrate. Optionally, the second supply location may be an area adjacent to the edge of the substrate.

The moving member 381 may include a support shaft 386, an arm 382, and an actuator 388. Support shaft 386 may be located on one side of processing vessel 320. The support shaft 386 may have a rod shape with its longitudinal direction facing a third direction. The support shaft 386 may be provided to be rotatable by a driver 388. Additionally, the support shaft 386 may be provided to enable lifting and lowering movement. Arm 382 is coupled to the top of support axis 386 and arm 382 may extend perpendicularly from support axis 386. A nozzle 390 may be fixedly coupled to the end of the arm 382. As the support shaft 386 rotates, the nozzle 390 can swing along with the arm 382. The nozzle 390 can be swing moved to the process position and the standby position. Optionally, the arm 382 may be provided to enable forward and backward movement along its longitudinal direction. When viewed from the top, the path along which the nozzle 390 moves may coincide with the central axis of the substrate W at the process location. As an example, the treatment liquid may be one of chemicals, rinse liquid, and organic solvent. Alternatively, the treatment liquid may be a mixture of two or more treatment liquids. Chemicals can be liquids with acid or base properties. Chemicals may include sulfuric acid (H2SO4), phosphoric acid (P2O5), hydrofluoric acid (HF) and ammonium hydroxide (NH4OH). The rinse liquid may be pure water (H20). The organic solvent may be isopropyl alcohol (IPA) liquid. Meanwhile, unlike shown in FIG. 2, a plurality of upper fluid supply units 380 may be provided, and each may supply different types of treatment liquids.

The lower fluid supply unit 400 can clean and dry the bottom of the substrate W. The lower fluid supply unit 400 supplies processing liquid to the bottom of the substrate W. The bottom of the substrate W may be a non-patterned surface opposite to the surface on which the pattern is formed. The lower fluid supply unit 400 may supply treatment liquid simultaneously with the upper fluid supply unit 380. The lower fluid supply unit 400 may be fixed to the internal space of the substrate support unit 340 without rotation.

3-5 illustrate a substrate support unit 340 according to one embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing the substrate support unit 340, FIG. 4 is an enlarged cross-sectional view showing the upper part of FIG. 3, and FIG. 5 is an enlarged cross-sectional view showing the lower part of FIG. 3.

3 to 5, the lower fluid supply unit 400 is located inside the substrate support unit 340.

The lower fluid supply unit 400 may include a body 410, a fluid supply pipe, and a fixing member 500.

The body 410 has an internal space and is located inside the substrate support unit 340. When viewed from the top, body 410 may be positioned to coincide with the center of rotation axis 344. The body 410 is positioned spaced apart from the rotating bodies 342 and 344 so as not to be affected by the rotation of the rotating bodies 342 and 344. As an example, the body 410 may be inserted into the rotating bodies 342 and 344 to be positioned at a certain distance away from the inner surfaces of the rotating bodies 342 and 344 in the central region of the rotating bodies 342 and 344. Accordingly, a separation space 412 is formed between the body 410 and the rotating bodies 342 and 344.

The upper end of the body 410 is located between the support member 342 and the substrate W supported thereon. The upper end of the body 410 may be provided in a circular plate shape having an upper surface 411 and a lower surface. The upper surface 411 of the body 410 may be inclined downward as it moves away from the center. The upper surface 411 of the body 410 may be positioned to protrude upward from the support member 342.

The fluid supply pipe supplies processing fluid to the bottom of the substrate (W). The fluid discharged from the fluid supply pipe cleans the bottom surface of the substrate W. The fluid supply pipe has a liquid discharge end facing upward. For example, the liquid discharge end may be provided to face vertically upward. A fluid supply pipe is provided inside the body 410. The fluid supply pipe may be located in the central area of the body 410. The processing fluid may be supplied to the bottom of the substrate W through a fluid supply pipe.

A plurality of fluid supply pipes are provided, and each of them can discharge different types of fluid. When a plurality of fluid supply pipes are provided, the fluid supply pipes are positioned at a certain distance from the center of the body 410. The fluid supply pipes may be arranged to surround the center of the body 410. As an example, each fluid supply pipe may be combined with each other and arranged to have an annular ring shape.

As an example, the fluid supply pipe may include a liquid discharge pipe 432 that discharges a processing liquid to the bottom of the substrate (W) and a gas discharge pipe 434 that discharges dry gas to the bottom of the substrate (W). The processing fluid discharged from the liquid discharge pipe 432 may be a cleaning liquid. As an example, the cleaning liquid may include chemicals, rinse liquid, etc. Chemicals can be liquids with acid or base properties. Chemicals may include sulfuric acid (H ₂ SO ₄ ), phosphoric acid (P ₂ O ₅ ), hydrofluoric acid (HF) and ammonium hydroxide (NH ₄ OH). The rinse liquid may be pure water (H20). The dry gas discharged from the gas discharge pipe 434 may be an inert gas or CDA gas. As an example, the inert gas may be nitrogen.

The fixing member 500 fixes the body 410. The fixing member 500 according to an embodiment of the present invention may be a powerlock with a centering function. The fixing member 500 is provided in the lower area of the body 410. The fixing member 500 is positioned below the driver 346 and spaced apart from the driver 346 . In more detail, the fixing member 500 may be positioned at a certain distance downward from the housing 347 that protects the driver 346.

Figures 6 and 7 show a fixing member 500 according to the present invention. FIG. 6 is a perspective view of the fixing member 500, and FIG. 7 is a cross-sectional view of the fixing member 500. FIG. 7(a) is an separated cross-sectional view of the fixing member 500, and FIG. 7(b) is a combined cross-sectional view of the fixing member 500.

Referring to FIGS. 6 and 7 , the fixing member 500 may include an inner ring 510, an outer ring 520, and a bolt 530. The fixing member 500 may be inserted into the housing 501.

Housing 501 is located inside the lower region of substrate support unit 340. The housing 501 has an internal space and can accommodate the out ring 520. The inner space of the housing 501 may be formed in the same shape as the out ring 520.

The inner ring 510 includes a first flange portion 512 and a receiving portion 514. The first flange portion 512 includes a plurality of first fastening holes 513 penetrating the first flange portion 512 . The receiving portion 514 accommodates the lower region of the body 410. The receiving portion 514 has a tubular shape and has an inner diameter slightly larger than the outer diameter of the body 410 to accommodate the body 410. The outer surface of the receiving portion 514 may include an inclined surface whose outer diameter decreases as the distance from the first flange portion 512 increases. Although not shown in detail, the receiving portion 514 may include a cutout.

The out ring 520 includes a second flange portion 522 and a hollow portion 524. The second flange portion 522 includes a plurality of second fastening holes 523 penetrating the second flange portion 522 . The second flange portion 522 includes the same number of second fastening holes 523 as the first fastening holes 513 formed in the first flange portion 512 . The second fastening hole 523 is formed at a position corresponding to the first fastening hole 513.

A portion of the inner ring 510 is accommodated in the hollow portion 524. Specifically, the receiving portion 514 of the inner ring 510 is inserted into the hollow portion 524. The hollow portion 524 has a tubular shape, and its upper inner surface may include an inclined surface whose inner diameter decreases as it moves away from the second flange portion 522 to correspond to the exterior of the receiving portion 514.

The out ring 520 may be inserted into the housing 501 with the hollow portion 524 facing upward.

The bolt 530 couples the inner ring 510 and the outer ring 520. The bolt 530 is fastened to the second fastening hole 523 through the first fastening hole 513 to couple the inner ring 510 and the outer ring 520. As the bolt 530 is fastened to the second fastening hole 523 through the first fastening hole 513, the inner surface of the inner ring 510 presses the body 410, and the outer surface of the outer ring 520 The inner surface of the housing 501 can be compressed. Accordingly, the body 410 may be fixedly coupled to the inside of the substrate support unit 340. The degree to which the inner surface of the inner ring 510 compresses the outer surface of the body 410 and the degree to which the outer surface of the outer ring 520 compresses the inner surface of the housing 501 are determined by the bolt 530 being the first fastener. When fastened to the second fastening hole 523 through the hole 513, it can be adjusted according to the degree of insertion into the second fastening hole 525.

The fixing member 500 according to the present invention has a centering function that can always maintain the upright state of the body 410. Accordingly, the center of the body 410 can be prevented from being misaligned without any additional components. That is, the fixing member 500 can fix the position of the body 410 and keep the center of the body 410 constant even when the rotating bodies 342 and 344 rotate. As the position and center of the body 410 are fixed, the position and center of the fluid supply pipe inside the body 410 may also be fixed.

According to the present invention, the lower fluid is supplied without a separate mechanical member such as a bearing in the space 412 between the upper part of the body 410 and the rotating bodies 342 and 344 by the fixing member 500 with a centering function. The position and center of the unit 400 may be fixed. Accordingly, installation of mechanical members such as bearings that generate friction and particles in the space 412 as the rotating body rotates can be omitted. As the installation of the mechanical member between the rotating bodies 342, 344 and the body 410, which served as a particle source, is omitted, the generation of the equipment's own particles is prevented, so during the process of processing the substrate (W), the substrate (W) caused by the equipment's own particles is prevented. W) and contamination inside the processing space can be minimized. Additionally, shortening the lifespan of equipment can be minimized.

The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications and variations will be possible to those skilled in the art without departing from the essential characteristics of the present invention. Accordingly, the embodiments described in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

342: support member
344: rotation axis
346: actuator
400: Lower fluid supply unit
410: body
432, 434: fluid supply pipe
500: fixing member
510: Inner ring
520: Out ring
530: bolt

Claims (10)

a substrate support unit having a support member for supporting a substrate and a rotation drive unit for rotating the support member; and
It includes a lower fluid supply unit that supplies fluid to the bottom of the substrate supported on the support member,
The rotation drive unit,
a rotation axis coupled to the support member; and
Including a driver that rotates the rotation shaft,
The lower fluid supply unit,
a body positioned inside the substrate support unit to be spaced apart from the support member and the rotation axis;
a fluid supply pipe provided inside the body and supplying the fluid; and
A substrate processing apparatus including a fixing member that fixes the body in a lower region of the body and keeps the center of the body constant.
According to paragraph 1,
The fixing member is,
an inner ring accommodating the body;
an outer ring into which the inner ring is inserted; and
A substrate processing device including a bolt connecting the inner ring and the outer ring.
According to paragraph 2,
The inner ring and the outer ring include a flange portion,
Each of the flange parts includes the same number of fastening holes formed at positions corresponding to each other,
A substrate processing device in which the inner ring and the outer ring are coupled by fastening the bolt to a fastening hole of the outer ring through a fastening hole of the inner ring.
According to paragraph 3,
A substrate processing device in which the inner surface of the inner ring presses the outer surface of the body as the bolt is fastened to the fastening hole of the outer ring through the fastening hole of the inner ring.
According to clause 4,
The fixing member is positioned below the driver and spaced apart from the driver.
According to paragraph 3,
The outer surface of the inner ring includes an inclined surface whose outer diameter decreases as it moves away from the flange portion,
The upper inner surface of the outer ring includes an inclined surface whose inner diameter decreases as the distance from the flange portion increases, corresponding to the outer surface of the inner ring.
a rotating body including a support member for supporting a substrate and a rotation axis coupled to a lower surface of the support member to rotate the support member;
a body provided inside the rotating body and positioned to be spaced apart from the inner wall of the rotating body;
a fluid supply pipe provided inside the body to supply fluid to the bottom of the substrate; and
A substrate support unit comprising a fixing member that fixes the body in a lower region of the body and keeps the center of the body constant when the rotating body rotates.
In clause 7,
The fixing member is,
an inner ring accommodating the body;
an outer ring into which the inner ring is inserted; and
A substrate support unit including a bolt connecting the inner ring and the outer ring.
According to clause 8,
The inner ring and the outer ring include a flange portion,
Each of the flange parts includes the same number of fastening holes formed at positions corresponding to each other,
A substrate support unit in which the inner ring and the outer ring are coupled by fastening the bolt to a fastening hole of the outer ring through a fastening hole of the inner ring.
In clause 7,
A substrate support unit in which the inner surface of the inner ring presses the outer surface of the body as the bolt is fastened to the fastening hole of the outer ring through the fastening hole of the inner ring.

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