KR20240051658A - Camera module - Google Patents

Abstract

The present invention relates to a camera module. According to one embodiment of the present invention, a camera module may include a lens assembly, a sensor assembly, and a housing. The lens assembly may include at least one lens. The sensor assembly is located below the lens assembly and may include a sensor chip, a filter, and a buffer unit. Additionally, the housing may include an internal space accommodating the lens assembly and the sensor assembly and a light inlet formed on the upper surface. Here, the buffer portion is formed to penetrate from the upper surface to the lower surface and may include a through hole for accommodating a sensor chip and a filter. Additionally, the inner surface of the buffer part may be in contact with the sensor chip and the filter, and the outer surface of the buffer part may be in contact with the inner surface of the housing.

Description

Camera module{CAMERA MODULE}

The present invention relates to a camera module.

Camera modules for optical imaging and sensing are being applied to various devices in various fields such as automobiles, mobile phones, and CCTV.

Typically, a camera module includes a lens, an image sensor that converts light passing through the lens into an electrical signal, and a housing that accommodates the lens and image sensor. The housing is mounted on an external board, and the external board and the image sensor inside the housing can be electrically connected in various ways.

Additionally, the size and structure of the image sensor applied to the camera module may vary depending on changes in technology and performance. Depending on the size and structure of the image sensor, it may not be completely fixed to the housing. In this case, when the camera module moves or receives an external shock, the image sensor may deviate from its designated position, causing problems in the operation and performance of the camera module.

The problem to be solved by the present invention is to provide a camera module having a sensor assembly in which a miniaturized sensor chip can be easily fixed to a housing.

In addition, another problem to be solved by the present invention is to provide a camera module that can prevent the sensor chip from leaving its designated position due to movement of the camera module or external impact.

In addition, another problem to be solved by the present invention is to provide a camera module that can protect the sensor assembly from external shock.

According to one embodiment of the present invention, a camera module including a lens assembly, a sensor assembly, and a housing is provided. The lens assembly may include at least one lens. The sensor assembly is located below the lens assembly and may include a sensor chip, a filter, and a buffer unit. Additionally, the housing may include an internal space accommodating the lens assembly and the sensor assembly and a light inlet formed on the upper surface. Here, the buffer part is formed to penetrate from the upper surface to the lower surface and may include a through hole for accommodating the sensor chip and the filter. Additionally, the inner surface of the buffer unit may be in contact with the sensor chip and the filter, and the outer surface of the buffer unit may be in contact with the inner surface of the housing.

The buffer unit may include a first buffer unit having a first through hole and a second buffer unit located below the first buffer unit and having a second through hole. Here, the first through hole and the second through hole may be connected to each other. At this time, the sensor chip and the filter may be disposed in the second through hole.

The first through hole and the second through hole may have different diameters.

The second through hole may have the same upper and lower diameter.

The maximum diameter of the first through hole may be smaller than the diameter of the second through hole.

The upper edge of the filter may be located at a lower portion of the lower surface of the first buffer portion that protrudes inward than the inner wall of the second buffer portion.

The sensor assembly may further include a mask positioned between the filter and the lower surface of the second buffer.

The first through hole may have a structure whose diameter increases from the bottom to the top.

The camera module may further include a protection part that simultaneously covers the lower surface of the housing and the lower surface of the buffer.

The housing may have an upper and lower inner space with the same diameter.

The housing may have an internal space including a lower portion having a larger diameter than the upper portion. At this time, the sensor assembly may be placed in the lower part of the internal space of the housing.

The lens assembly may include a plurality of lenses.

The lens assembly may further include a light blocking portion disposed between the plurality of lenses.

The sensor assembly may further include a dam disposed between the sensor and the filter.

The filter may be an infrared filter.

The sensor chip can convert the received light signal into an electrical signal.

In the camera module according to an embodiment of the present invention, the sensor assembly including the miniaturized sensor chip can be easily fixed to the housing by the buffer unit.

Additionally, the camera module according to an embodiment of the present invention can prevent the sensor chip from leaving a designated position due to movement of the camera module or external shock by using a buffer unit.

Additionally, the camera module according to an embodiment of the present invention can protect the sensor assembly from external shock by means of a protection unit.

1 is an exemplary diagram showing a camera module according to a first embodiment of the present invention.
Figure 2 is an exemplary diagram showing a camera module according to a second embodiment of the present invention.
Figure 3 is an exemplary diagram showing a camera module according to a third embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. The embodiments introduced below are provided as examples to ensure that the idea of the present invention can be sufficiently conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. Also, in the drawings , the width, length, thickness, etc. of components may be exaggerated for convenience. Throughout the specification, like reference numbers indicate like elements and like reference numbers indicate corresponding similar elements.

1 is an exemplary diagram showing a camera module according to a first embodiment of the present invention. More specifically, Figure 1 is a cross-sectional view of a camera module according to a first embodiment of the present invention.

The camera module 100 according to the first embodiment of the present invention may include a housing 110, a lens assembly 120, and a sensor assembly 130.

According to this embodiment, the housing 110 has a structure where the outer diameter is the same from the top to the bottom.

Additionally, the housing 110 has an internal space that accommodates the lens assembly 120 and the sensor assembly 130. At this time, the internal space of the housing 110 may be formed so that the upper and lower portions have the same diameter. In this embodiment, the housing 110 has the same diameter from the top to the bottom, but the present invention is not limited to this structure. The housing 110 may be formed in various structures in which the upper and lower portions have different diameters.

Additionally, the housing 110 has a structure in which the lower surface is open and a portion of the upper surface is open. Here, external light may flow into the internal space of the housing 110 through the light inlet 111, which is an opening formed on the upper surface of the housing 110. Additionally, the sensor assembly 130 may be assembled to the housing 110 through an opening formed on the lower surface of the housing 110. At this time, when the sensor assembly 130 is assembled to the housing 110, the open portion of the lower surface of the housing 110 is shielded by the sensor assembly 130.

Accordingly, the housing 110 and the sensor assembly 130 can block light from flowing into the internal space of the housing 110 in areas other than the light inlet 111 formed on the upper surface of the housing 110.

According to this embodiment, the housing 110 may be formed of a material that does not transmit light. For example, housing 110 may be formed of plastic or metal.

The lens assembly 120 may include a lens 121, a light blocking portion 125, and a lens fixing portion 126. According to this embodiment, the lens assembly 120 may include a plurality of lenses 121 and light blocking portions 125.

A plurality of lenses 121 may be stacked inside the housing 110.

Each lens 121 may include a lens unit 122 and a support unit 123. The lens unit 122 is a part formed for the purpose of concentrating or diverging light incident on the lens 121. The lens unit 122 may be formed in various structures, such as a spherical surface or an aspherical surface, depending on the purpose. The support portion 123 may be formed to extend from the lens portion 122 and support the lens portion 122. That is, the support part 123 has a structure extending in the side direction of the lens unit 122 and may be formed to surround the side of the lens unit 122. Additionally, the support portion 123 may be formed in various structures so that the lens portion 122 is disposed at a position corresponding to the light inlet 111 in the internal space of the housing 110.

Referring to FIG. 1, each lens 121 is formed so that the lens unit 122 has various structures, and the support unit 123 has the structure of the connected lens unit 122 or another lens 121 located at the top or bottom. It can be formed in various ways depending on.

In this embodiment, the lens assembly 120 includes three lenses 121, but the present invention is not limited thereto. In the present invention, the number of lenses 121 included in the lens assembly 120 may vary.

A light blocking portion 125 may be disposed between the stacked lenses 121. The light blocking part 125 may be located on the upper part of the support part 123 of each lens 121. More specifically, the light blocking portion 125 may be formed to expose the lens portion 122 of the lens 121 and cover the upper surface of the support portion 123. Accordingly, light introduced into the housing 110 by the light blocking unit 125 can be prevented from entering the interior of the lens unit 122 through the support unit 123 of the lens 121. That is, light can enter the inside of the lens 121 through the lens unit 122 due to the light blocking unit 125.

In this embodiment, the lens 121 located at the top has the lens unit 122 located below the light inlet 111 of the housing 110, and the support unit 123 is in close contact with the inner wall of the upper surface of the housing 110. It is placed. Accordingly, light does not enter the support portion 123 of the lens 121 located at the top due to the upper surface of the housing 110. Therefore, the light blocking portion 125 may be omitted on the top of the lens 121 located at the top. However, when the lens 121 located at the top is separated from the upper surface of the housing 110, a light blocking portion 125 may be additionally disposed to prevent light from entering the support portion 123 of the lens 121.

Additionally, the light blocking portion 125 functions to block light and can also adjust the distance between each lens 121. According to this embodiment, the separation distance between each lens 121 can be adjusted by adjusting the thickness of the light blocking portion 125.

The lens 121 and the light blocking part 125 may be located on the upper part of the lens fixing part 126. Accordingly, the position of the lens assembly 120 can be determined by the lens fixing unit 126. That is, the space between the lens fixing part 126 and the light inlet 111 becomes a space where the lens 121 and the light blocking part 125 are accommodated. The lens fixing unit 126 may be fixed to the inner wall of the housing 110. For example, the lens fixing part 126 may have adhesive 151 applied to its lower surface. Referring to FIG. 1, part of the adhesive 151 may be adhered to the lens fixing part 126, and the other part may be adhered to the inner surface of the housing 110. Alternatively, the adhesive 151 may be interposed between the outer wall of the lens fixing unit 126 and the inner surface of the housing 110 to fix the lens fixing unit 126 to the housing 110. Alternatively, in various ways without adhesive 151, such as by fixing the lens fixing part 126 to the inner surface of the housing 110 or by forming the lens fixing part 126 of a material that adheres to the inner surface of the housing 110. The lens fixing unit 126 may be fixed to the housing 110.

According to this embodiment, the position of the lens fixing unit 126 may be determined by considering the focal distance between the lens 121 and the sensor chip 131.

The sensor assembly 130 may receive light passing through the lens assembly 120 and convert it into an electrical signal. According to this embodiment, the sensor assembly 130 may be arranged in the internal space of the housing 110 and at the same time be arranged to shield the opening formed in the lower surface of the housing 110.

The sensor assembly 130 may include a sensor chip 131, a connection member 133, a filter 132, a buffer 136, a mask 135, and a dam 134.

The sensor chip 131 is an element that receives light and converts the received light into an electrical signal. That is, the sensor chip 131 may be an image sensor chip 131. For example, the sensor chip 131 may be a CCD sensor or a CMOS sensor.

At the bottom of the sensor chip 131, a connection member 133 for adhesion to a circuit board (not shown) on which the camera module 100 is mounted may electrically connect the sensor chip 131 and the circuit board (not shown). there is. The connection member 133 may be formed of a conductive material with adhesive force. For example, the connection member 133 may be formed of solder paste, solder balls, or silver epoxy (Ag-epoxy) resin.

A filter 132 may be placed on the sensor chip 131. For example, the filter 132 may be an infrared filter 132. Light in the infrared region may be removed by the filter 132 before the light is input to the sensor chip 131. Accordingly, the sensor chip 131 can generate accurate information about the image by receiving light in the visible light region excluding the infrared region through the filter 132.

The buffer portion 136 is formed to surround the sensor chip 131 and the filter 132. According to an embodiment of the present invention, the buffer unit 136 may include a first buffer unit 137 and a second buffer unit 138. A first through hole 1371 is formed in the first buffer part 137, and a second through hole 1381 is formed in the second buffer part 138. The first buffer part 137 is an upper part of the buffer part 136, and the second buffer part 138 is a lower part of the buffer part 136. That is, the first through hole 1371 is formed to penetrate the upper surface of the buffer part 136, and the second through hole 1381 is formed to penetrate the lower surface of the buffer part 136. According to this embodiment, the first through hole 1371 and the second through hole 1381 may be connected to each other.

Additionally, the first through hole 1371 and the second through hole 1381 may be formed to have different diameters. For example, the second through hole 1381 may be formed so that its upper and lower portions have the same diameter. Additionally, the minimum diameter of the first through hole 1371 may be smaller than that of the second through hole 1381. Referring to FIG. 1, the diameter of the first through hole 1371 may increase from the bottom to the top. That is, the inner wall of the first buffer 137 may be an inclined surface formed so that the diameter of the first through hole 1371 increases as it moves toward the lens assembly 120. In this way, the first buffer 137 having an inclined surface can reduce the light incident on the filter 132 by being diffusely reflected from the inner wall forming the first through hole 1371.

The first through hole 1371 formed in the first buffer 137 may serve as a passage for light passing through the lens 121 to the filter 132.

A sensor chip 131 and a filter 132 are disposed in the second through hole 1381 of the second buffer 138. Accordingly, the filter 132 disposed on the sensor chip 131 may face the lens assembly 120 through the first through hole 1371.

Additionally, because the diameter of the first through hole 1371 is smaller than that of the second through hole 1381, the upper edge of the filter 132 may be covered by the buffer portion 136. Here, the portion of the buffer unit 136 that covers the upper edge of the filter 132 is the lower surface of the first buffer unit 137 that protrudes inward from the inner wall of the second buffer unit 138.

Additionally, the buffer 136 may be formed to fill the space between the sensor chip 131 and the filter 132 and the inner surface of the housing 110. That is, the inner surface of the buffer part 136 is in contact with the sensor chip 131 and the filter 132, and the outer surface of the buffer part 136 is in contact with the inner surface of the housing 110. Accordingly, the buffer 136 can secure the sensor assembly 130 to the housing 110 and prevent it from being separated from the housing 110.

According to this embodiment, the buffer portion 136 may be formed of the same material as the housing 110. For example, the buffer 136 may be made of plastic or metal. Alternatively, the buffer portion 136 may be formed of rubber or a thermoplastic elastomer that is a mixture or combination of rubber and plastic.

Additionally, according to this embodiment, the buffer portion 136 may be formed by injection molding or extrusion molding.

A dam 134 may be formed between the sensor chip 131 and the filter 132. The dam 134 may be located between the upper surface of the sensor chip 131 and the lower surface of the filter 132. The sensor chip 131 and the filter 132 can be bonded and fixed to each other by the dam 134 formed in this way.

The dam 134 may be formed of a material that can withstand the mounting temperature when the sensor assembly 130 is mounted on a circuit board (not shown) using the adhesive member 133. Additionally, the dam 134 may be formed of a material that absorbs light. For example, the dam 134 may be formed of black ink. Furthermore, the dam 134 may be formed of photosensitive black ink. Black ink blocks light by absorbing it and has a low light reflectance. Accordingly, light reflected from the dam 134 and incident on the sensor chip 131 can be minimized. If the light reflected from the filter 132 or the sensor chip 131 is reflected from the dam 134 and enters the sensor chip 131 again, it may cause problems such as flare, resulting in image defects. However, since the dam 134 of this embodiment is formed using black ink, flare can be prevented by blocking reflection of light that may occur in the dam 134. Additionally, plasma treatment may be performed on the surface of the dam 134 to lower the reflectivity of the dam 134 formed using black ink. Additionally, since black ink is easy to form into a thin thickness, the overall thickness of the sensor assembly 130 can be reduced.

Additionally, a mask 135 may be formed between the filter 132 and the buffer 136. At this time, the mask 135 has a structure in which a through hole is formed and covers the upper edge of the filter 132, and the remaining portion of the filter 132 can be exposed. The mask 135 with the through hole may be formed between the upper surface of the filter 132 and the lower surface protruding inward of the first buffer part 137. By the mask 135 formed in this way, the adhesive force between the buffer part 136 and the filter 132 is improved so that they can be fixed to each other. Additionally, the mask 135 formed along the upper edge of the filter 132 may define an area where light is incident on the sensor chip 131.

The mask 135 may include a light absorbing material. For example, the mask 135 may be formed including Cr.

Although not described in the embodiment of the present invention, the adhesive 151 is interposed between the buffer portion 136 and the inner wall of the housing 110, so that the adhesive force between the sensor assembly 130 and the housing 110 can be improved. Additionally, the adhesive 151 may be interposed between the inner wall of the buffer unit 136 and the side surface of the sensor chip 131 and between the inner wall of the buffer unit 136 and the side surface of the filter 132. At this time, the buffer portion 136 may be formed in a structure having a groove 139 into which the adhesive 151 is applied, as shown in FIG. 1 . Alternatively, a groove 119 into which the adhesive 151 is applied may be formed in a portion of the housing 110. The groove 119 of the housing 110 may be formed in a portion that contacts the buffer portion 130.

According to this embodiment, when the camera module 100 is externally shocked by the buffer unit 136, the components of the sensor assembly 130 can be prevented from being damaged or separated from the housing 110. Accordingly, the reliability of the camera module 100 according to this embodiment can be improved.

Additionally, according to this embodiment, even if the sensor chip 131 and the filter 132 are miniaturized, the sensor chip 131 and the filter 132 can be fixed inside the housing 110 by the buffer 136. Therefore, even if the sensor chip 131 and the filter 132 are miniaturized, they can be applied to the camera module 100 regardless of size.

Additionally, according to this embodiment, the sensor chip 131 is fixed to the buffer unit 136 in close contact with the inner wall of the buffer unit 136, and the buffer unit 136 is also fixed in close contact with the inner wall of the housing. Therefore, the camera module 100 according to this embodiment can prevent the sensor chip 131 from deviating from its designated position when the camera module 100 is shaken or subjected to impact by miniaturizing the sensor chip 131. . Accordingly, the camera module according to this embodiment can prevent problems in the operation and performance of the camera module from occurring when the sensor chip 131 deviates from its designated position.

Figure 2 is an exemplary diagram showing a camera module according to a second embodiment of the present invention. In more detail, Figure 2 is a cross-sectional view of a camera module according to a second embodiment of the present invention.

The camera module 200 according to the second embodiment includes a housing 210, a lens assembly 120, and a sensor assembly 130. The housing 210 of the camera module 200 according to the second embodiment has a structural difference from the housing 110 of the camera module (100 in FIG. 1) according to the first embodiment.

The housing 210 of the camera module 200 according to the second embodiment has a stepped structure. Referring to FIG. 2, the housing 210 has a stepped structure in which the inner and outer diameters are larger at the bottom than at the top.

The housing 210 of the second embodiment has structural differences from the housing (110 in FIG. 1) of the first embodiment, but features other than structure such as purpose and material are the same as the housing (110 in FIG. 1) of the first embodiment. You can.

The lens assembly 120 is disposed in the upper portion of the small diameter internal space of the housing 210. The lens assembly 120 of this embodiment may be the same as the lens assembly 120 of the camera module (100 in FIG. 1) of the first embodiment.

Additionally, the sensor assembly 130 may be disposed in the lower portion of the internal space having a large diameter of the housing 210. The sensor assembly 130 of this embodiment may be the same as the sensor assembly 130 (100 in FIG. 1) of the camera module of the first embodiment.

Figure 3 is an exemplary diagram showing a camera module according to a third embodiment of the present invention. In more detail, Figure 2 is a cross-sectional view of a camera module according to a second embodiment of the present invention.

The camera module 300 according to the third embodiment includes a housing 210, a lens assembly 120, and a sensor assembly 130. Here, the camera module 300 according to the third embodiment further includes a protection unit 360 to the camera module (200 in FIG. 2) according to the second embodiment.

The protection part 360 has a structure including a through hole and may be formed to cover a portion of the lower surface of the housing 210 and the lower surface of the sensor assembly 130. In more detail, the protection part 360 covers the lower surface of the housing 210 and the lower surface of the buffer part 136 of the sensor assembly 130, and is formed to expose the lower surface of the sensor chip 131 and the connection member 133. It can be. At this time, the lower end of the connection member 133 may be located on the same line as the lower surface of the protective part 360 or may be exposed to the outside more than the lower end of the protective part 360. That is, the protection part 360 may be formed to have a thickness such that the lower surface is positioned at the same level or higher than the lower end of the connection member 133. Accordingly, the protection portion 360 can prevent the connection member 133 from being spaced apart from an external circuit board (not shown) and not making contact.

Although not shown in FIG. 3, adhesive is applied to the upper surface of the protection unit 360 so that the protection unit 360 can be fixed to the housing 210 and the sensor assembly 130. Alternatively, the protection portion 360 itself may have adhesive force.

Since the protection part 360 covers a portion of the sensor assembly 130, it can prevent external shock from being applied directly to the sensor assembly 130. In addition, the protection portion 360 covers the housing 210 and the sensor assembly 130 at the same time, preventing the sensor assembly 130 from being separated from the housing 210 when an impact is applied to the camera module 300. can do. In this way, the protection unit 360 according to this embodiment can improve the reliability of the camera module 300 by protecting the camera module 300 from external shock.

Heat may be applied to the connection member 133 to electrically connect the sensor chip 131 of the sensor assembly 130 to a circuit board (not shown) disposed outside the housing 210. At this time, when heat is transferred to the buffer unit 136, the buffer unit 136 may be deformed. Since the protection portion 360 covers the buffer portion 136, heat applied to the connection member 133 can be prevented from being transferred to the buffer portion 136. Accordingly, the protection unit 360 can prevent the buffer unit 136 from being deformed by heat.

In this embodiment, the protection unit 360 is described as an individual component separated from the buffer unit 136, but the present embodiment is not limited thereto. The protection portion 360 and the buffer portion 136 may be formed as one piece through injection molding using a mold. Additionally, the protection portion 360 and the buffer portion 136 may be processed in a variety of ways, including injection molding, to form a separate or integrated type.

In this way, the camera module described through various embodiments of the present invention can be fixed to the housing with the sensor chip and filter mounted on the shock absorber. The buffer portion is formed of a structure that fills the inner wall of the sensor chip, filter, and housing. Therefore, even if the size of the sensor chip and filter is reduced, the sensor chip and filter can be fixed to the inside of the housing by the buffer. Additionally, the buffer unit can prevent the sensor chip and filter from deviating from their designated positions even if the camera module moves or receives an impact. Therefore, the camera module according to this embodiment can prevent problems in the operation and performance of the camera module from occurring when the sensor chip deviates from a designated position. Additionally, the camera module of one embodiment of the present invention may include a protection unit to protect the sensor assembly from external impact and prevent the sensor assembly from being separated from the housing due to external impact. In this way, the camera module according to an embodiment of the present invention can improve technical reliability and physical reliability related to operation and performance.

As described above, the detailed description of the present invention has been made by way of examples with reference to the accompanying drawings, but since the above-described embodiments are only explained by referring to preferred examples of the present invention, the present invention is limited to the above examples. It should not be understood, and the scope of rights of the present invention should be understood in terms of the claims and equivalent concepts described later.

100, 200, 300: Camera module
110, 210: housing
111: Light inlet
119: Groove of housing
120: Lens assembly
121: lens
122: Lens part
123: support part
125: light blocking part
126: Lens fixing part
130: sensor assembly
131: sensor chip
132: filter
133: Connection member
134: Dam
135: mask
136: Buffer part
137: first buffer section
138: second buffer part
139: Groove of buffer part
151: adhesive
360: protection part
1371: 1st through hole
1381: Second through hole

Claims (16)

A lens assembly including at least one lens;
a sensor assembly located below the lens assembly and including a sensor chip, a filter, and a buffer unit; and
It includes a housing including an internal space for accommodating the lens assembly and the sensor assembly and a light inlet formed on the upper surface,
The buffer portion is formed to penetrate from the upper surface to the lower surface and includes a through hole for accommodating the sensor chip and the filter,
A camera module wherein the inner surface of the buffer part is in contact with the sensor chip and the filter, and the outer surface of the buffer part is in contact with the inner surface of the housing.
In claim 1,
The buffer part,
a first buffer having a first through hole; and
A second buffer unit located below the first buffer unit and having a second through hole,
The first through hole and the second through hole are connected to each other,
A camera module wherein the sensor chip and the filter are disposed in the second through hole.
In claim 2,
The first through hole and the second through hole have different diameters.
In claim 3,
The second through hole is a camera module whose upper and lower diameters are the same.
In claim 3,
A camera module in which the maximum diameter of the first through hole is smaller than the diameter of the second through hole.
In claim 5,
A camera module in which the upper edge of the filter is located below the lower surface of the first buffer portion that protrudes inward than the inner wall of the second buffer portion.
In claim 6,
The sensor assembly further includes a mask positioned between the filter and the lower surface of the second buffer.
In claim 5,
The first through hole is a camera module whose diameter increases from the bottom to the top.
In claim 1,
A camera module further comprising a protection portion that simultaneously covers a lower surface of the housing and a lower surface of the buffer.
In claim 1,
The housing is a camera module in which the upper and lower parts have an internal space of the same diameter.
In claim 1,
The housing has an internal space including a lower portion having a larger diameter than the upper portion,
A camera module in which the sensor assembly is disposed in a lower portion of the internal space of the housing.
In claim 1,
The lens assembly is a camera module including a plurality of lenses.
In claim 12,
The lens assembly further includes a light blocking portion disposed between the plurality of lenses.
In claim 1,
The sensor assembly further includes a dam disposed between the sensor and the filter.
In claim 1,
The filter is a camera module that is an infrared filter.
In claim 1,
The sensor chip is a camera module that converts received light signals into electrical signals.