KR20240041855A - An internal electrode, and multilayer ceramic substrate containing the same - Google Patents

Abstract

The present invention relates to an internal electrode containing molybdenum (Mo) and copper (Cu), and provides an internal electrode for a multilayer ceramic substrate containing a metal composite coated with copper particles on at least some of the surfaces of the molybdenum particles.

Description

Internal electrode and multilayer ceramic substrate including same {AN INTERNAL ELECTRODE, AND MULTILAYER CERAMIC SUBSTRATE CONTAINING THE SAME}

The present invention relates to a multilayer ceramic substrate having excellent mechanical strength and chemical resistance and low resistance, including a molybdenum-copper metal composite electrode.

The reliability of the wafer on which a plurality of integrated circuit chips are formed through a wafer fabrication process is verified by electrical die sorting (EDS).

Testing equipment consisting of a tester, probe station, and probe card is usually used to inspect electrical properties. The probe card includes a space converter with multiple probe pins, a printed circuit board, a reinforcement plate, and an interposer. It is composed including.

The tester generates inspection signals and reads inspection result data. The probe station is responsible for loading and unloading the wafer, allowing the tester to perform its function, and the probe card performs the function of electrically connecting the wafer and the tester.

As the degree of integration of semiconductor integrated circuit devices increases, inspection devices that perform inspection processes for semiconductor integrated circuits also require high precision.

For example, in order to meet the inspection process for highly integrated semiconductor integrated circuit chips, fine pitch of probe pins connected to the semiconductor integrated circuit chips must be implemented.

For this purpose, a so-called space transformer (STF) is used, which compensates for the difference between the pitch of the probes and the pitch of the semiconductor integrated circuit.

In particular, the use of space converters made of ceramic is increasing because they have a thermal expansion coefficient similar to that of a silicon wafer and have excellent mechanical strength and chemical resistance.

However, the HTCC method has the disadvantage of having to use electrode materials with high resistance, such as molybdenum and tungsten, because it is fired at a high temperature of over 1,500°C.

On the other hand, a multilayer ceramic substrate manufactured using the LTCC method can use silver or copper electrodes with low resistance. Recently, the need for various circuit designs and heat dissipation designs using low-resistance characteristics has been highlighted.

However, the LTCC method has a problem of insufficient reliability due to lack of mechanical strength and chemical resistance due to the substrate material.

Therefore, there is a need to develop electrode materials that can be applied at higher firing temperatures and have low resistance, but the melting point of copper is only 1084°C, so there is a problem that it cannot be applied to processes at higher temperatures.

For this reason, space converters made of ceramic materials are generally divided into the HTCC method, which is fired at a temperature of 1500 to 1700°C, and the LTCC method, which is fired at a temperature of 800 to 900°C.

As a result of our diligent efforts to develop an electrode material with low resistance and high melting point, the present inventors have derived an electrode material that can be fired at a temperature of 1300 to 1500°C, tentatively named MTCC (Middle Temperature Co., Ltd.), which falls into a completely new category compared to conventional methods. -fired Ceramic) laid the foundation for the construction method.

The present invention is intended to solve the above-described problems, and the purpose of the present invention is to provide an internal electrode containing a molybdenum-copper composite that is applicable to high sintering temperatures and has low resistance.

According to one aspect of the present invention, in the internal electrode containing molybdenum (Mo) and copper (Cu), an internal electrode for a multilayer ceramic substrate containing a metal composite coated with copper particles on at least a portion of the molybdenum particle surface is provided. do.

In one embodiment, the metal composite may include a core-shell structure in which the molybdenum particles are a core and the copper particles are a shell that covers part or all of the core.

In one embodiment, the metal composite may include 50 to 90 parts by weight of the molybdenum particles and 10 to 50 parts by weight of the copper particles.

In one embodiment, the average diameter of the core may be 1.0 to 8.0 μm.

In one embodiment, the average thickness of the shell may be 0.5 to 2.0 μm.

In one embodiment, the internal electrode may have a specific resistance value of 2.5 to 5.0×10 ^-6 Ω·cm.

In one embodiment, the internal electrode may have a specific resistance value of 3.0 to 4.0×10 ^-6 Ω·cm.

In one embodiment, the internal electrode may have a porosity of 12.0 to 25.0%.

In one embodiment, the internal electrode may be fired at a temperature of 1,300°C or higher.

According to another aspect of the invention, one or more ceramic layers; A multilayer ceramic substrate is provided, including the internal electrode.

According to the present invention, the internal electrode for a multilayer ceramic substrate can be applied to a high temperature firing process and has low resistance, and by using this, a multilayer ceramic substrate with improved chemical resistance and flexural strength, which are weak points of LTCC materials, can be provided.

Through the internal electrode for the multilayer ceramic substrate, high mechanical strength and electrical performance that conventional space converters could not achieve can be achieved at the same time.

The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

1 and 2 show SEM images of electrodes included in a multilayer ceramic substrate according to an embodiment of the present invention.

The terms used in this specification are general terms that are currently widely used as much as possible while considering the function in the present invention, but this may vary depending on the intention or precedent of a person skilled in the art, the emergence of new technology, etc. In addition, in certain cases, there are terms arbitrarily selected by the applicant, and in this case, the meaning will be described in detail in the description of the relevant invention. Therefore, the terms used in the present invention should be defined based on the meaning of the term and the overall content of the present invention, rather than simply the name of the term.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

The numerical range includes the values defined in the range above. Every maximum numerical limit given throughout this specification includes all lower numerical limits as if the lower numerical limit were explicitly written out. Every minimum numerical limit given throughout this specification includes every higher numerical limit as if such higher numerical limit was clearly written. All numerical limits given throughout this specification will include all better numerical ranges within the broader numerical range, as if the narrower numerical limits were clearly written.

Hereinafter, examples of the present invention will be described in detail, but it is obvious that the present invention is not limited to the following examples.

Internal electrodes for multilayer ceramic substrates

One aspect of the present invention provides an internal electrode containing molybdenum (Mo) and copper (Cu) for a multilayer ceramic substrate containing a metal composite coated with copper particles on at least some of the surfaces of the molybdenum particles.

The multilayer ceramic substrate is a type of three-dimensional circuit board in which one or more ceramic layers are stacked. The multilayer ceramic substrate can be applied to various products such as wireless transmission/reception modules, sensors, photoelectric housings, multi-chip devices, LED mounting substrates, semiconductor packaging substrates, and space converters for probe cards.

The multilayer ceramic substrate may include one or more stacked ceramic layers, and may include internal electrodes such as an electrode layer formed on one surface of the ceramic layer or a via electrode penetrating the ceramic layer.

The electrode material forming the internal electrode can be selected in consideration of the firing temperature of the multilayer ceramic substrate, and the internal electrode of the present invention has a high melting point and low specific resistance, so it can be applied to a high temperature firing process.

The internal electrode may include molybdenum (Mo) and copper (Cu), and may include a metal composite in which copper particles are coated on at least a portion of the surfaces of the molybdenum particles.

The present inventors confirmed that the internal electrode comprising a metal composite in which the copper particles are coated on the surface of the molybdenum can have a low specific resistance without melting at a high temperature of 1300°C or higher due to the specific structure.

According to the phase equilibrium diagram of molybdenum and copper, when the temperature is increased in a simple mixture of molybdenum and copper, copper is converted to a liquid phase at a temperature of 1,084 ℃ or higher, and when a sintering process is performed at a temperature of 1,300 ℃ or higher, the copper is volatilized and forms an internal substance. There is a problem with electrodes being destroyed.

However, the internal electrode of the present invention, through its core-shell structure, can form an electrode with low specific resistance even when fired at a temperature of 1,300°C or higher.

Specifically, the metal composite may include a core-shell structure in which the molybdenum particles are a core and the copper particles are a shell that covers part or all of the core.

The metal composite forms the core-shell structure, and compared to when the copper particles exist in an independent form from the molybdenum particles, the molybdenum particles and the copper particles are tightly combined, so that the copper particles do not volatilize even at high temperatures. The coated state can be maintained on the surface of molybdenum particles.

The average diameter of the core may be 1.0 to 8.0 μm, and the average thickness of the shell may be 0.5 to 2.0 μm.

If the average diameter of the core is less than 1.0 ㎛, copper particles may volatilize at high temperature, and if it is more than 8.0 ㎛, the specific resistance of the electrode may increase and fall short of the required electrical characteristics.

If the average thickness of the shell is less than 0.5㎛, the specific resistance of the electrode may relatively increase, and if it is more than 2.0㎛, the structure of the electrode may be deformed or the electrical characteristics may be deteriorated due to volatilization of some of the copper layer.

The metal composite may include 50 to 90 parts by weight of the molybdenum particles and 10 to 50 parts by weight of the copper particles.

If the content of molybdenum is excessive, the resistivity of the internal electrode may increase and the electrical properties may deteriorate, and if the content of copper is excessive, the internal electrode may be damaged or damaged due to high-temperature sintering.

The specific resistance of the internal electrode may vary depending on the ratio of molybdenum and copper or the sintering process, and may have, for example, a specific resistance value (20°C) of 2.5 to 5.0×10 ^-6 Ω·cm, preferably 3.0 to 4.0. It can have a resistivity value of ×10 ^-6 Ω·cm.

The specific resistance values of the internal electrode are 2.5×10 ^-6 Ω·cm, 2.6×10 ^-6 Ω·cm, 2.7×10 ^-6 Ω·cm, 2.8×10 ^-6 Ω·cm, 2.9×10 ^-6 Ω·cm cm, 3.0×10 ^-6 Ω·cm, 3.1×10 ^-6 Ω·cm, 3.2×10 ^-6 Ω·cm, 3.3×10 ^-6 Ω·cm, 3.4×10 ^-6 Ω·cm, 3.5×10 ^-6 Ω·cm, 3.6×10 ^-6 Ω·cm, 3.7×10 ^-6 Ω·cm, 3.8×10 ^-6 Ω·cm, 3.9×10 ^-6 Ω·cm, 4.0×10 ^-6 Ω·cm , 4.1×10 ^-6 Ω·cm, 4.2×10 ^-6 Ω·cm, 4.3× ^{10 -6} Ω·cm, 4.4×10 ^-6 Ω·cm, 4.5×10 ^-6 Ω·cm, 4.6×10 ^- It can be ⁶ Ω·cm, 4.7×10 ^-6 Ω·cm, 4.8×10 ^-6 Ω·cm, 4.9×10 ^-6 Ω·cm, 5.0×10 ^-6 Ω·cm or a range between any two of these values. However, it may vary depending on process conditions.

The internal electrode may have a porosity of 12.0 to 25.0%, and within this range, the internal electrode may have optimal durability and resistivity characteristics.

The internal electrode can be fired at a temperature of 1,300°C or higher. The internal electrode is heated above 1,300°C, for example, 1,300°C, 1,305°C, 1,310°C, 1,315°C, 1,320°C, 1,325°C, 1,330°C, 1,335°C, 1,340°C, 1,345°C, 1,350°C, 1,355°C, 1,360°C, 1, 365 ℃, 1,370℃, 1,375℃, 1,380℃, 1,385℃, 1,390℃, 1,395℃, 1,400℃, 1,405℃, 1,410℃, 1,415℃, 1,420℃, 1,425℃, 1,430℃, 1,435℃, 1,440℃, 1,445℃, Even if it is fired at a temperature of 1,450°C or a range between these two values, the electrode structure is not destroyed and low specific resistance can be maintained.

According to another aspect of the present invention, a conductive paste comprising spherical copper particles and molybdenum particles is provided.

The internal electrode may be formed by baking a conductive paste in which spherical copper particles and molybdenum particles are dispersed in a solvent.

The internal electrode is manufactured by dispersing spherical copper particles and molybdenum particles in a solvent, so that it can be applied to a high temperature sintering process and have low specific resistance.

The spherical copper particles may be manufactured by rapidly cooling molten or evaporated copper using a plasma heat source.

When spherical copper powder prepared by condensing copper powder after gas phase conversion is mixed with molybdenum powder, a molybdenum-copper metal complex with low resistivity can be formed even when fired at a temperature above 1,084°C, which is the melting point of copper.

Gas phase conversion of copper powder can be performed by a plasma heat source. For example, spherical copper powder can be manufactured by rapidly converting the vapor phase using plasma arc vapor discharge, plasma atomization, etc. and then cooling it.

The spherical copper powder prepared by the above method can be converted into a conductive paste form by mixing it with molybdenum powder, a binder, a solvent, etc.

When the spherical copper particles are mixed with molybdenum particles and used, they can be coated on the surface of the molybdenum particles at a high temperature above the melting point of copper to form a core-shell structure without volatilization.

Multilayer ceramic substrate

According to another aspect of the invention, one or more ceramic layers; A multilayer ceramic substrate is provided, including the internal electrode.

The ceramic layer may be a thick film formed by molding a ceramic composition into a predetermined plate shape. The ceramic composition may be formed by mixing at least one ceramic powder and an organic material. The ceramic powder can be synthesized to have specific properties by calcining a plurality of raw materials containing each composition component (or element).

Examples of the ceramic powder include cordierite, mullite, zirconia, and alumina. The ceramic composition may further include an additive (or sintering aid) to increase sintering density.

Cordierite is a compound (2MgO-2Al ₂ O ₃ -5SiO ₂ ) with a sintering temperature of 1,200 to 1,300°C. It has a low thermal expansion coefficient of about 0.3 ppm/°C at 200°C and a flexural strength of about 100 MPa. Cordierite melts when fired at a high temperature of 1,300°C or higher and can act as a sintering aid.

Mullite is an alumina-silica-based compound (3Al ₂ O ₃ -2SiO ₂ ) with a sintering temperature of 1,500 to 1,600°C and has a flexural strength of about 250 MPa. Mullite exists as a stable intermediate phase even at high temperatures and has excellent thermal and chemical stability and heat resistance.

Zirconia is a compound (ZrO ₂ ) with a sintering temperature of 1,400 to 1,500°C and has a high flexural strength of about 600 MPa, but is known to be easily deteriorated at high temperatures.

Alumina is an oxide of aluminum (Al ₂ O ₃ ) with a sintering temperature of 1,400 to 1,600°C and has a high thermal conductivity of about 11 W/m·K and excellent flexural strength of about 300 MPa.

Examples of additives include MgO, Y ₂ O ₃ , TiO ₂ , CaO, Cr ₂ O ₃ , V ₂ O ₅ , etc. By including these additives, the sintering temperature of the ceramic composition can be adjusted or the properties of the ceramic substrate can be controlled.

The ceramic composition can be mixed with an organic solvent such as water or ethanol and used in the form of a ceramic slurry. Ceramic slurry can be mixed by conventional methods such as ball milling or basket milling.

The mixed ceramic slurry can be dried to remove the liquid medium by various methods. A ceramic molded body can be formed by adding and mixing organic substances such as PVA (polyvinyl alcohol), PVB (polyvinyl butyral), and MC (methyl cellulose) as binders to the ceramic slurry from which the liquid medium has been removed.

The ceramic molded body may be molded into a plate shape and then sintered at a high temperature of 1,000°C to 2,000°C to be used as a ceramic green sheet that constitutes a multilayer ceramic substrate.

Each ceramic green sheet may have a through hole punched out to form a via for inter-layer electricity conduction and then filled with a conductive material, or an internal electrode may be formed with an electrode circuit pattern.

A multilayer ceramic substrate can be manufactured by stacking a plurality of ceramic green sheets and firing them simultaneously.

Accordingly, the multilayer ceramic substrate includes one or more ceramic layers formed from ceramic green sheets, and at least some of these ceramic layers may include electrodes. These electrodes may be formed through printing on at least a portion of one side or the other side of the ceramic layer, or may be formed by injecting a conductive material into a through hole of the ceramic layer.

The number of ceramic layers is not particularly limited, and 10 to 100 layers may be stacked depending on the degree of integration of the semiconductor circuit pattern implemented on the semiconductor wafer.

Multilayer ceramic substrates can be classified into high temperature co-fired ceramic (HTCC) substrates or low temperature co-fired ceramic (LTCC) substrates depending on the firing temperature.

HTCC substrates are generally sintered at temperatures above 1,500°C, so ceramic powders with high sintering temperatures such as alumina and mullite are used. HTCC substrates have excellent flexural strength, chemical resistance, and high-frequency dielectric loss characteristics, but because sintering is performed at a temperature higher than the melting point of materials with low resistivity such as silver (962℃) and copper (1,084℃), molybdenum (molybdenum) with high resistivity is used. 2,623℃), tungsten (3,422℃), etc. should be used as electrode materials, and the thermal conductivity of the substrate is high.

LTCC substrates are generally fired at temperatures below 1,000°C, so glass and ceramic fillers are used. The dielectric constant of the LTCC substrate is easy to control, and materials with low resistivity such as silver and copper can be used as electrode materials, but its flexural strength and chemical resistance are insufficient compared to HTCC.

In one embodiment, a ceramic composition containing cordierite, zirconia, mullite, and alumina may have a sintering temperature of 1,300 to 1,500° C., and when applying the internal electrode of the present invention, the advantages of HTCC substrates and LTCC substrates are harmonized. It can be implemented.

The present invention will be described in further detail through the following examples, but it is obvious that the present invention is not limited by the following examples.

Example 1

Copper powder was evaporated using an arc plasma combustion device and then rapidly cooled to produce spherical copper powder.

The arc plasma combustion device was adjusted to spray plasma with a temperature of 20,000 K at the center and 11,000 K at the outside to an area of 10 mm in distance and 10 mm in diameter.

The evaporated copper was passed through a water-cooled cooling device to obtain the form of spherical copper powder. The arc plasma combustion device supplied nitrogen to the crucible at a flow rate of 5 to 30 L/min and generated plasma with a power of 50 to 150 V and 150 to 450 A to melt and evaporate copper.

A conductive paste was prepared by uniformly dispersing spherical copper powder and molybdenum powder in a mixed solution of ethylcellulose dissolved in alpha-terpineol.

The conductive paste was used to fill the through hole inside the ceramic layer and then fired at a temperature of 1,450°C to form an internal electrode.

Example 2

A conductive paste was prepared in the same manner as in Example 1, except that spherical copper powder and molybdenum powder were uniformly dispersed in a mixed solution of polystyrene sulfonate dissolved in distilled water.

Example 3

A conductive paste was manufactured in the same manner as in Example 1, except that spherical copper powder was manufactured using plasma atomization, which melts the copper wire with a plasma gun in an arc plasma combustion device.

Comparative Example 1

A conductive paste was prepared in the same manner as Example 1, except that ordinary copper powder was used.

Comparative Example 2

A conductive paste was prepared in the same manner as Example 1, except that copper powder was used alone, except for molybdenum powder.

Comparative Example 3

A conductive paste was prepared in the same manner as in Example 1, except that molybdenum powder was used alone, except for the spherical copper powder.

Comparative Example 4

A conductive paste was prepared by uniformly dispersing conventional copper powder and molybdenum powder in a mixed solution of ethylcellulose dissolved in alpha-terpineol.

The conductive paste was fired at a temperature of 950°C to form internal electrodes.

Experimental Example 1: Electrode structure analysis

The cut surface of the internal electrode of the manufactured ceramic substrate was observed through a scanning electron microscope (SEM) (Table 1).

Scanning Electron Microscope (SEM) photographs of Example 1 are shown in Figures 1 and 2.

division electrode material internal structure Example 1-1 80Mo-20Cu Core-shell structure Example 1-2 70Mo-30Cu Core-shell structure Example 1-3 50Mo-50Cu Core-shell structure Example 2 70Mo-30Cu (old) Core-shell structure Example 3 60Mo-40Cu (old) Core-shell structure Comparative Example 1 80Mo-20Cu Face-centered cubic (FCC) structure Comparative Example 2 Cu - Comparative Example 3 Mo Face-centered cubic (FCC) structure Comparative Example 4 80Mo-20Cu Face-centered cubic (FCC) structure

Referring to FIG. 1, the electrode of Example 1 existed as a core-shell metal composite in which molybdenum particles were introduced into the center of the grain and a copper layer was formed on the surface of the molybdenum particles.

Referring to Figure 2, copper particles surrounded the surface of the molybdenum particles to form various types of core-shell structures.

On the other hand, in Comparative Example 2, an electrode was not formed as the copper powder was melted and volatilized, and in Comparative Example 4 where the sintering temperature was lowered, an electrode was formed but did not exhibit a core-shell particle structure.

Referring to Table 1, the metal composites of the internal electrodes according to the examples all had a core-shell structure, while the electrodes of the comparative example had a typical face-centered cubic lattice structure.

Experimental Example 2: Resistivity evaluation

The 20°C resistivity of the internal electrodes manufactured according to Examples and Comparative Examples was evaluated. Resistivity evaluation was measured using a four-point probe system (Advanced Instrument Technology, CMT-SR2000N).

division electrode material Specific resistance (20℃) Example 1-1 80Mo-20Cu 3.4×10 ^-6 Ω·cm Example 1-2 70Mo-30Cu 3.3×10 ^-6 Ω·cm Example 1-3 50Mo-50Cu 2.9×10 ^-6 Ω·cm Example 2 70Mo-30Cu 3.4×10 ^-6 Ω·cm Example 3 60Mo-40Cu 3.1×10 ^-6 Ω·cm Comparative Example 1 80Mo-20Cu 6.9×10 ^-6 Ω·cm Comparative Example 2 Cu - Comparative Example 3 Mo 7.0×10 ^-6 Ω·cm Comparative Example 4 80Mo-20Cu 4.2×10 ^-6 Ω·cm

Referring to Table 2, the electrodes of Examples 1 to 3 forming a core-shell structure showed lower specific resistance compared to the molybdenum electrode, and did not disappear even at high temperatures and formed an internal electrode stably inside the laminated ceramic layer.

The above results suggest that the molybdenum-copper metal composite of the core-shell structure can be applied as an electrode material with low specific resistance at a high temperature of 1,300°C or higher.

Experimental Example 3: Melting point evaluation

The melting point of the internal electrode manufactured according to the example was analyzed. Heat was applied to the metals of Examples and Comparative Examples, and the temperature at which melting began was measured (Table 3).

division electrode material Melting point (℃) Example 1-1 80Mo-20Cu 1,514 Example 1-2 70Mo-30Cu 1,456 Example 1-3 50Mo-50Cu 1,447 Example 2 70Mo-30Cu 1,463 Example 3 60Mo-40Cu 1,438 Comparative Example 1 80Mo-20Cu 1,063 Comparative Example 2 Cu 1,082 Comparative Example 3 Mo 2,623 Comparative Example 4 80Mo-20Cu 1,076

Referring to Table 3, the internal electrode of the example was maintained stably without melting even at a high temperature of 1300°C or higher.

On the other hand, the molybdenum-copper electrode of Comparative Example 4, which does not form a core-shell structure, has a relatively low melting point, so when it is fired at high temperature, the electrode melts and fails to form an electrode structure.

The above results suggest that the melting point of the internal electrode of the present invention can be raised because the internal copper particles do not melt despite the relatively high temperature due to the core-shell structure.

Therefore, although the internal electrode of the present invention contains copper particles, it has a high melting point and can be fired at a temperature of 1300 to 1500°C. However, the specific resistance is significantly lower than that of the electrode applied to the HTCC method, so it has high mechanical strength and excellent electrical properties. It can be used in the manufacture of ceramic substrates with excellent properties.

The description of the present invention described above is for illustrative purposes, and those skilled in the art will understand that the present invention can be easily modified into other specific forms without changing the technical idea or essential features of the present invention. will be. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. For example, each component described as single may be implemented in a distributed manner, and similarly, components described as distributed may also be implemented in a combined form.

The scope of the present invention is indicated by the patent claims described below, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

Claims (8)

In the conductive paste composition for manufacturing internal electrodes that are fired at a temperature of 1,300°C or higher to form a core-shell structure,
A conductive paste composition comprising spherical copper particles and molybdenum particles. According to paragraph 1,
A conductive paste composition in which the spherical copper particles are obtained by condensing copper particles after gas phase conversion. According to paragraph 2,
A conductive paste composition in which the spherical copper particles are manufactured by rapidly cooling molten or evaporated copper using a plasma heat source. According to paragraph 1,
A conductive paste composition comprising 10 to 50 parts by weight of the spherical copper particles and 50 to 90 parts by weight of the molybdenum particles. Printing the conductive paste composition of any one of claims 1 to 4 on a ceramic green sheet; and
A method of manufacturing a multilayer ceramic substrate, comprising the step of laminating and firing one or more ceramic green sheets. According to clause 5,
A method of manufacturing a multilayer ceramic substrate, wherein the firing is performed at a temperature of 1,300°C or higher. According to clause 6,
The conductive paste composition is a multilayer ceramic substrate that forms an internal electrode of a core-shell structure in which molybdenum particles are a core and copper particles are a shell that covers part or all of the core by firing. Manufacturing method. In clause 7,
A method of manufacturing a multilayer ceramic substrate, wherein the internal electrode has a specific resistance value of 2.5 to 5.0×10 ^-6 Ω·cm.