KR20240018035A - Test apparatus for IC - Google Patents

Abstract

A semiconductor package testing device that can apply uniform pressure when connecting a semiconductor package terminal is disclosed. A semiconductor package testing device according to an embodiment of the present invention includes a base provided with a storage portion in which a semiconductor package is stored; a cover rotatably installed on one side of the base, covering and fixing the upper part of the semiconductor package while the semiconductor package is accommodated in the base, and having a pressing portion that presses the upper surface of the semiconductor package; A lifting bracket that is installed in a pair to enable elevation on the base, elastically supports the cover horizontally with respect to the base, and each has a lifting shaft, so that when the lifting shaft is lowered, the pressing portion of the cover lowers to a horizontal state to pressurize the semiconductor package. ; A pair of operations in which the elevating bracket is installed to be rotatable about a first rotation axis on both sides of the base, and a slot into which the elevating shaft is inserted is formed, so that when the elevating shaft is rotated about the first rotation axis, the elevating bracket raises and lowers according to the direction of rotation. link; and a link pusher installed on the cover to be able to lift and lower, and providing an external force to rotate the pair of operating links about a first rotation axis.

Description

Semiconductor package test device {Test apparatus for IC}

The present invention relates to a device for testing the operation of a semiconductor package, and more specifically, to a semiconductor package test device that can apply uniform pressure when connecting semiconductor package terminals.

Generally, surface-mounted semiconductor packages such as IC devices or IC devices are composed of LGA (Land Grid Array), BGA (Ball Grid Array), and CSP (Chip Sized Package) types, and their reliability is verified before being shipped to customers. will be tested for. For example, the burn-in test is a test that applies higher temperatures and voltages than normal operating conditions to the semiconductor package before it is applied to the relevant electronic device to ensure that the semiconductor package satisfies those conditions. Check whether it is approved or not.

In the case of existing semiconductor package test devices, in order to verify the durability and reliability of the semiconductor package during the test process, the semiconductor package is generally mounted on a test socket, connected to a DUT (Device under Test) board, and then tested. Such a burn-in socket includes a base having a central opening, a cover that is movably coupled to the base with an elastic member in between, a contact complex inserted into the opening of the base and having a plurality of contact pins, and opening and closing according to the vertical movement of the cover. It may include a latch that moves to a support position, and an adapter that is mounted on the base and on which the semiconductor package is placed. For example, in the case of a burn-in test, the test is performed by electrically connecting to a test board at a high temperature of around 120℃.

However, in the semiconductor package test device according to the prior art, the base on which the semiconductor package is seated and the cover that presses it from the top are rotated by a hinge to create pressure and contact, so the same pressing force is not applied during the process of loading the semiconductor package, but is applied unevenly. There was a problem in that damage such as scratches or cracks occurred in the semiconductor package due to pressurization.

KR 2010-0052721 A1

According to the present invention, an object of the present invention is to provide a semiconductor package test device having a structure capable of pressing a semiconductor package with uniform pressure even in a socket-type semiconductor package test device in which the cover rotates using a hinge and is coupled to the base.

A semiconductor package testing device according to one aspect of the present invention includes a base provided with a storage portion in which a semiconductor package is stored; a cover rotatably installed on one side of the base, covering and fixing the upper part of the semiconductor package while the semiconductor package is accommodated in the base, and having a pressing portion that presses the upper surface of the semiconductor package; Elevating brackets installed in a pair to enable elevation on the base to elastically support the cover horizontally with respect to the base, each having an elevating shaft, so that when the elevating shaft is lowered, the pressurizing portion is lowered to a horizontal state to press the semiconductor package; A pair of operations in which the elevating bracket is installed to be rotatable about a first rotation axis on both sides of the base, and a slot into which the elevating shaft is inserted is formed, so that when the elevating shaft is rotated about the first rotation axis, the elevating bracket raises and lowers according to the direction of rotation. link; and a link pusher installed on the cover to be able to lift and lower, and providing an external force to rotate the pair of operating links about a first rotation axis.

At this time, a pressing lever rotatably installed on the cover; and a cam member that is fixed to the pressing lever and rotates together, and lowers the link pusher via a contact surface with the link pusher as the pressing lever rotates.

At this time, an inclined surface may be formed on the operating link and the link pusher at a point where they contact each other.

At this time, when the link pusher descends, sliding may occur so that the contact surface of the operating link rises.

At this time, a hinge axis for rotating the cover may be installed on one of the lifting brackets.

At this time, the pair of operating links may rotate in opposite directions about the first rotation axis when the link pusher descends.

At this time, when the cover is closed and the pressing lever is standing vertically, the link pusher can be positioned at its maximum height.

At this time, when the pressing lever is rotated from the vertical state to the horizontal state, the link pusher may be positioned at the lowest height, and the pressing portion of the cover may press the semiconductor package to the maximum.

At this time, the link pushers may be installed in pairs, and the cam members may also be installed in pairs corresponding to the link pushers, respectively.

At this time, the cover may be locked by installing one of the pair of lifting brackets to be rotatable about the hinge axis and latching the lower end of the other lifting bracket.

According to the above configuration, the semiconductor package test device according to the present invention is a socket type in which the base and the cover are coupled by rotating a hinge, and the pressurizing portion uniformly presses the semiconductor package to prevent damage such as scratches or breaks in the semiconductor package. It can be prevented.

1 is a perspective view of a semiconductor package test device in an open state according to an embodiment of the present invention.
Figure 2 is a plan view of the semiconductor package test device in an open state according to an embodiment of the present invention.
Figure 3 is a front view of the semiconductor package test device in an open state according to an embodiment of the present invention.
Figure 4 is a perspective view of a closed state of a semiconductor package test device according to an embodiment of the present invention.
Figure 5 is a plan view of the semiconductor package test device in a closed state according to an embodiment of the present invention.
Figure 6 is a front view of the semiconductor package test device in a closed state according to an embodiment of the present invention.
Figure 7 is a partial cross-sectional view of a lifting bracket portion, which is a component of a semiconductor package testing device according to an embodiment of the present invention.
Figure 8 is a partial cross-sectional view of the semiconductor package test device in a closed state and before pressurization according to an embodiment of the present invention.
Figure 9 is a partial cross-sectional view of the semiconductor package test device during pressurization in a closed state according to an embodiment of the present invention.
Figure 10 is a partial cross-sectional view of the semiconductor package test device in a closed state after pressurization according to an embodiment of the present invention.

The words and terms used in this specification and claims are not to be construed as limited in their usual or dictionary meanings, but according to the principle that the inventor can define terms and concepts in order to explain his or her invention in the best way. It must be interpreted with meaning and concepts consistent with technical ideas.

Therefore, the embodiments described in this specification and the configuration shown in the drawings correspond to a preferred embodiment of the present invention, and do not represent the entire technical idea of the present invention, so the configuration may be replaced by various alternatives at the time of filing of the present invention. There may be equivalents and variations.

In this specification, terms such as “comprise” or “have” are intended to describe the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to describe the presence of one or more other features. It should be understood that it does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

A component being “in front,” “rear,” “above,” or “below” another component means that it is in direct contact with the other component, unless there are special circumstances. This includes not only those placed at the “bottom” but also cases where another component is placed in the middle. In addition, the fact that a component is "connected" to another component includes not only being directly connected to each other, but also indirectly connected to each other, unless there are special circumstances.

Hereinafter, the semiconductor package test device 1 according to the present invention will be described with reference to the drawings.

Referring to FIGS. 1 to 10, the semiconductor package test device 1 according to an embodiment of the present invention includes a base 20, a cover 10, lifting brackets 24 and 25, an operating link 23, It may include a link pusher 16, a pressing lever 14, and a cam member 15.

Referring to FIGS. 1 to 10, the base 20 may be provided with a storage portion 20a in which a semiconductor package is stored.

At this time, the base 20 is arranged to be supported horizontally on a horizontal surface, and a receiving portion 20a is formed inside the upper center so that the semiconductor package can be seated. Additionally, the receiving portion 20a is provided with a contact assembly 20b so that when the semiconductor package is seated and pressed, it is physically and electrically connected and a test can be performed.

At this time, a pair of guide grooves into which the lifting brackets 24 and 25 are inserted and seated are formed in the body 21 of the base 20 so that the lifting brackets 24 and 25 can be raised and lowered. The lifting brackets 24 and 25 are capable of being lifted up and down in the vertical direction while seated in the guide groove, and springs 25 and 29 are installed in the lower part of the guide groove to elastically support the lifting brackets 24 and 25. . Therefore, even when the cover 10 is closed, the pressing unit 13 does not immediately press the semiconductor package.

At this time, a locking protrusion 22 is formed on one side of the base 20, and the latch 12 of the cover 10 is caught by the locking protrusion 22 so that the cover 10 is closed. Here, the cover 10 is installed to be rotatable about the hinge axis 30, and the hinge axis 30 can be rotatably installed on one of the lifting brackets 24 and 25. Here, the lower end of the second lifting bracket 25 installed on the base 20 acts as the locking protrusion 22. That is, the hook of the latch 12 is caught on the lower end of the second lifting bracket 25 so that the cover 10 is closed to the base 20. Accordingly, even when the first and second lifting brackets 24 and 25 move up and down, the latch 12 can maintain the locked state.

At this time, a pair of operating links 23 may be installed on both sides of the base 20, respectively. A pair of operating links 23 are installed on one side, but may be installed symmetrically to each other.

Referring to FIGS. 1 to 10, the cover 10 is rotatably installed on one side of the base 20 and covers and secures the upper part of the semiconductor package when the semiconductor package is stored in the base 20. , a pressing portion 13 that pressurizes the upper surface of the semiconductor package may be provided.

At this time, the cover 10 is installed to be rotatable with respect to the base 20 via the hinge axis 30, and the hinge axis 30 is not installed on the base 20 but on the lifting bracket 24. there is. Therefore, the cover 10 is rotatably installed with respect to the base 20 via the lifting bracket 24. A torsion spring 31 is installed on the hinge axis 30 to provide a rotational elastic force that allows the cover 10 to be opened from the base 20.

At this time, since the hinge axis 30 of the cover 10 is installed on the lifting bracket 24, when the lifting bracket 24 is raised and lowered, the cover 10 can also be raised and lowered. The cover 10 is in a state in which the cover body 21 is in close contact with the lifting bracket 25 on the opposite side of the lifting bracket 24 on which the hinge axis 30 is installed. That is, when the latch 12 of the cover 10 is locked to the locking protrusion 22, the lifting bracket 25 is in close contact with the inner surface of the cover 10.

At this time, a pressing part 13 capable of pressing the semiconductor package is installed inside the center of the cover 10. When the cover 10 is lowered in the closed state toward the base 20, the pressing portion 13 comes into close contact with the semiconductor package and presses it.

At this time, a pair of link pushers 16 are installed on both sides of the cover 10 to be disposed at the upper position of the operating link 23. The link pusher 16 descends in the closed state of the cover 10 and rotates the operating link 23 in the opening direction.

At this time, a pressure lever 14 is installed at the center of the cover 10, and the pressure lever 14 is connected by a handle 14a so that it can be rotated on both sides simultaneously. The rotation axis of the pressing lever 14 is installed to be rotatable through the cover body 11. Referring to FIGS. 8 to 10, a cam member 15 is fixed to the rotation axis of the pressing lever 14. It is designed to rotate together with the pressurizing lever (14). The cam member 15 can also be lowered by applying pressure to the link pusher 16 by rotating while the cam outer surface is in contact with the contact surface 16a of the link pusher 16.

At this time, a latch 12 is installed at the end of the cover 10 to be rotatable around a hinge pin 12a, and a ring is formed at the end of the latch 12, and the ring is connected to the locking jaw of the base 20. The cover 10 can be in a closed state by being caught by (22). The latch 12 is also configured to receive elastic rotational force in the direction in which it is opened by a torsion spring. When the worker rotates the cover 10, the hook of the latch 12 passes over the base body 21 and reaches the locking ledge 22, and is rotated by the elastic rotational force of the torsion spring, so that the hook is caught on the locking ledge 22. The cover 10 is in a closed state. Conversely, when the latch 12 is rotated in the closed state of the cover 10 to release the ring from the locking jaw 22, the cover 10 may be in an open state as shown in FIG. 1 by the elastic rotational force of the torsion spring.

Referring to FIGS. 1 to 10, the lifting brackets 24 and 25 are installed in a pair to enable elevation on the base 20 and elastically support the cover 10 horizontally with respect to the base 20. , each of which is provided with lifting shafts 26 and 27, so that when the lifting shafts 26 and 27 are lowered, the pressurizing part 13 is lowered to a horizontal state to pressurize the semiconductor package.

At this time, a hinge axis 30 for rotating the cover 10 may be installed on the first lifting bracket 24, which is one of the lifting brackets 24 and 25. Referring to FIG. 1, of the two lifting brackets 24 and 25, the hinge shaft 30 is rotatably installed on the first lifting bracket 24. Accordingly, the cover 10 can be lifted and lowered together with the first lifting bracket 24 on which the hinge axis 30 is installed. Here, since the torsion spring 31 is installed on the hinge axis 30, the cover 10 is provided with a rotational elastic force to rotate in the open direction about the hinge axis 30.

At this time, referring to FIG. 7, the first lifting bracket 24 is installed to be able to be lifted up and down in the guide groove of the base 20, and a spring 28 is installed at the lower part to raise the first lifting bracket 24. It provides elastic support by providing elastic force. A hinge shaft 30 is rotatably installed on the upper part of the first lifting bracket 24 so that the cover 10 can rotate around it. An insertion groove through which the lifting shaft 26 passes is formed in the center of the first lifting bracket 24, and the lifting shaft 26 moves up and down along the guide of the insertion groove. Here, when the lifting shaft 26 descends, the first lifting bracket 24 is also pressed against the lifting shaft 26 and falls while overcoming the elastic force of the spring 28. The second lifting bracket 25 is also the same as the first lifting bracket 24 in that the spring 29 elastically supports it at the bottom, an insertion groove is formed, and the lifting shaft 27 is installed. However, when the hinge axis is not installed and the cover 10 is closed, the body 11 of the cover 10 will be in close contact with the upper end of the second lifting shaft 25. In this state, when the pressing lever 14 rotates, the cover 10 and the first and second lifting brackets 24 and 25 descend together, and eventually the pressing unit 13 presses the semiconductor package evenly. . At this time, since the lower part of the second lifting shaft 25 acts as a locking protrusion 22, the hook of the latch 12 is caught on the locking protrusion 22, which is the lower part of the second lifting shaft 25, so that the cover 10 is It becomes closed. Accordingly, even when the first and second lifting shafts 24 and 25 are lifted and lowered, the latch 12 of the cover 10 remains restrained to the locking protrusion 22, so that the cover 10 is also lifted and lowered in the closed state. can do.

Referring to FIGS. 1 to 10, the operating link 23 is rotatably installed on both sides of the base 20 about a first rotation axis 23a, and the lifting shafts 26 and 27 are inserted. When the slot 23b is formed and rotated about the first rotation axis 23a, the lifting brackets 24 and 25 can be raised and lowered according to the rotation direction. To enable this operation, the operating links 23 are installed in pairs, and may be installed in pairs on both sides of the base 20.

At this time, the operating link 23 operates by receiving operating force from the link pusher 16.

At this time, inclined surfaces 16a and 23c may be formed on the operating link 23 and the link pusher 16 at areas where they contact each other.

At this time, when the link pusher 16 descends, sliding may occur so that the contact surface of the operating link 23 rises.

At this time, the pair of operating links 23 may rotate in opposite directions about the first rotation axis 23a when the link pusher 16 descends.

At this time, when the operating link 23 rotates around the first rotation axis 23a, the lifting shafts 26 and 27 are lifted and lowered along the insertion grooves of the lifting brackets 24 and 25, and at the same time, they are moved along the slot 23b. You can be guided.

At this time, referring to FIGS. 8 to 10, when the link pusher 16 is lowered, the inclined surface 23c formed at one end of the operating link 23 begins to contact the inclined surface 16a of the link pusher 16. , As the link pusher 16 descends, the end where the inclined surface 23c of the operating link 23 is formed must be spread along the inclined surface 16a of the link pusher 16, so the operating link 23 is connected to the first rotation axis ( 23a) must be rotated in the direction opposite to the downward direction of the link pusher (16). Accordingly, the position of the slot 23b rotates around the first rotation axis 23a, and eventually the lifting shafts 26 and 27 inserted into the slot 23b move along the insertion grooves of the lifting brackets 24 and 25. It goes down. Of course, at this time, the lifting shafts 26 and 27 move along the slot 23b.

Referring to FIGS. 1 to 10, the link pusher 16 is installed on the cover 10 to be able to lift and lower, and rotates the pair of operating links 23 about the first rotation axis 23c. External force can be provided.

At this time, the link pushers 16 may be installed as a pair and placed on both sides of the base 20.

At this time, a pair of cam members 15 that transmit the operating force of the link pusher 16 may be installed corresponding to each link pusher 16.

At this time, the link pusher 16 is installed on the cover 10 so that it can be vertically lifted up and down in a closed state, and an inclined surface 16a is formed from the lower end to a certain height. The inclined surface 23c of the operating link 23 comes into contact with this inclined surface 16a, and as the link pusher 16 descends, the operating link 23 spreads along the inclined surface 16a of the link pusher 16. It rotates.

Referring to FIGS. 1 to 10, the pressing lever 14 may be rotatably installed on the cover 10.

At this time, the cam member 15 is fixed to the pressing lever 14 and rotates together, and as the pressing lever 15 rotates, the link pusher 16 moves through a contact surface with the link pusher 16. can be lowered.

At this time, when the cover 10 is closed and the pressing lever 14 is standing vertically, the link pusher 16 can be positioned at its maximum height, and when the pressing lever 14 is in a vertical state, the link pusher 16 can be positioned at its maximum height. When rotated to a horizontal state, the link pusher 16 may be positioned at the lowest height, and the pressing portion 13 of the cover 10 may be in a state of maximally pressing the semiconductor package.

1 to 3, a perspective view, a top view, and a front view of the semiconductor package test device 1 according to an embodiment of the present invention in an open state are shown, respectively. The cover 10 is open with respect to the base 20. The cover 10 is maintained in an open state because the hinge axis 30 is elastically supported by the rotational elastic force of the torsion spring 31. At this time, the semiconductor package is placed in the receiving part 20a of the base 20, and the cover 10 is rotated so that the latch 12 is caught on the locking protrusion 22, so that the cover 10 is closed. When the pressing lever 14 is turned using the handle 14a, the pressing unit 13 presses the semiconductor package and enters a state in which testing can be performed. At this time, all of the lifting brackets 24 and 25 are raised by elastic force, and all of the pressing levers 14 are also not rotated.

Referring to FIGS. 4 to 6 , a perspective view, a top view, and a front view of the semiconductor package test device 1 according to an embodiment of the present invention in a closed state are shown, respectively. The cover 10 is rotated around the hinge axis 30 to be in a closed state, and the latch 12 is caught by the locking jaw 22 to maintain the closed state. At this time, the latch 12 is assembled to the cover 10 so as to be rotatable about the hinge pin 12a, and is provided with a rotational elastic force that allows it to be caught on the locking jaw 22 by a torsion spring. Therefore, unless a separate external force acts, the latch 12 will try to remain in the locking position 22. The pressing lever 14 is rotated and positioned in a direction parallel to the cover 10, and the internal pressing part 13 presses the semiconductor package seated in the receiving part 20a of the base 20. The link pusher 16 is lowered as much as possible because the pressing lever 14 is rotated to the operating position, and the operating links 24 and 25 are opened and rotated outward due to the lowering of the link pusher 16. am. Accordingly, all of the lifting shafts 26 and 27 are in a lowered state, and the lowering of the lifting shafts 26 and 27 causes all of the lifting brackets 24 and 25 to be pressed, causing the entire cover 10 to descend to its maximum and pressurizing portion 13. ) is pressurizing the semiconductor package.

Referring to FIG. 7, a partial cross-sectional view of the lifting brackets 24 and 25, which are some components of the semiconductor package test device 1 according to an embodiment of the present invention, is shown. The cover 10 is lowered and the semiconductor package is being pressed. An insertion groove is formed inside the lifting brackets (24, 25), and lifting shafts (26, 27) are installed in the insertion grooves, respectively. The lifting shafts (26, 27) are inserted into each slot (23c) to operate the operating link (23). ) is raised and lowered by the guidance of the insertion groove according to the rotation. Here it is in the lowest state. The lifting shafts 26 and 27 are both provided with elastic force in the upward direction by the elastic force of the springs 28 and 29. A hinge axis 30 is installed on the first lifting bracket 24 and the cover 10 is rotatably installed, and the inner surface of the cover 10 simply contacts the second lifting bracket 25 and the lower end has a locking protrusion. (22) so that the hook of the latch (12) is caught. Therefore, as the lifting brackets 24 and 25 are raised and lowered, the cover 10 can be raised and lowered together in the closed state.

Referring to FIG. 8, a partial cross-sectional view of the semiconductor package test device 1 according to an embodiment of the present invention is shown in a closed state before pressurization. The cover 10 is closed, but the pressing lever 14 is not operated. Therefore, the semiconductor package is not pressurized.

Referring to FIG. 9, a partial cross-sectional view of the semiconductor package test device 1 according to an embodiment of the present invention during pressurization in a closed state is shown. The cover 10 remains closed and the pressure lever 14 is rotated at a certain angle and begins to operate. As the pressing lever 14 rotates, the cam member 15 rotates and begins to lower the link pusher 16. At this time, as the link pusher 16 is lowered, both operating links 23 begin to rotate outward about the first rotation axis 23a. Accordingly, each of the lifting shafts 26 and 27 also begins to descend while moving along the slot 23b and eventually begins to lower the lifting brackets 24 and 25.

Referring to FIG. 10, a partial cross-sectional view of the semiconductor package test device 1 according to an embodiment of the present invention is shown after being pressed in a closed state. The pressing lever 14 is rotated as much as possible to be horizontal with the cover 10, and the cam member 15 is also rotated as much as possible to lower the link pusher 16 to the maximum. Accordingly, the operating link 23 is also rotated as far outward as possible about the first rotation axis 23a. Ultimately, as each of the lifting shafts 26 and 27 descends to its maximum, the lifting brackets 24 and 25 also descend to its maximum and the semiconductor package is pressurized.

Conversely, when the pressing lever 14 is rotated and returned to its original position, the lifting brackets 24 and 25 are all raised by the elastic force of the springs 28 and 29, thereby causing the cover 10 and the pressing portion 13 to rise, The pressing force on the semiconductor package is released.

In this way, even if the cover 10 is closed by the latch 12 on the base 20, the semiconductor package is not pressed, so product damage that may occur at this time can be prevented in advance. Of course, when pressing the semiconductor package, the pressurizing unit 13 does not rotate but presses down in a vertically parallel state, so uniform pressurization is achieved and damage to the semiconductor package is also prevented.

Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention can add or change components within the scope of the same spirit. , deletion, addition, etc., other embodiments can be easily proposed, but this will also be said to fall within the scope of the present invention.

1: Semiconductor package test device
10: Cover 11: Body of the cover
12: Latch 13: Pressure block
14: Block holder 15: Link pusher
16: Spring 20: Base
21: body of base 22: locking jaw
23: guide tunnel 24: slot pin
25: Slide operating link 26: Handle
27: elastic support member 30: hinge axis

Claims (10)

A base provided with a storage portion in which a semiconductor package is stored;
a cover rotatably installed on one side of the base, covering and fixing the upper part of the semiconductor package while the semiconductor package is accommodated in the base, and having a pressing portion that presses the upper surface of the semiconductor package;
A lifting bracket that is installed in a pair to enable elevation on the base, elastically supports the cover horizontally with respect to the base, and each has a lifting shaft, so that when the lifting shaft is lowered, the pressing portion of the cover lowers to a horizontal state to pressurize the semiconductor package. ;
A pair of operations in which the elevating bracket is installed to be rotatable about a first rotation axis on both sides of the base, and a slot into which the elevating shaft is inserted is formed, so that when the elevating shaft is rotated about the first rotation axis, the elevating bracket raises and lowers according to the direction of rotation. link;
A link pusher is installed on the cover to be able to lift and lower, and provides an external force to rotate the pair of operating links about a first rotation axis. According to claim 1,
A pressurizing lever rotatably installed on the cover; and
A cam member fixed to the pressing lever and rotating together with the pressing lever, lowers the link pusher via a contact surface with the link pusher as the pressing lever rotates. According to claim 1,
A semiconductor package test device wherein the operating link and the link pusher have inclined surfaces formed at contact areas with each other. According to clause 3,
A semiconductor package test device in which sliding occurs so that the contact surface of the operating link rises when the link pusher descends. According to claim 1,
A semiconductor package test device in which a hinge axis for rotating the cover is installed on one of the lifting brackets. According to claim 1,
The pair of operating links are rotated in opposite directions about a first rotation axis when the link pusher is lowered. According to clause 2,
When the cover is closed and the pressing lever is standing vertically, the link pusher is positioned at its maximum height. According to clause 7,
When the pressing lever is rotated from the vertical state to the horizontal state, the link pusher is positioned at the lowest height, and the pressing portion of the cover presses the semiconductor package to the maximum. According to clause 2,
The link pushers are installed in pairs, and the cam members are also installed in pairs corresponding to the link pushers, respectively. According to claim 1,
The cover is rotatably installed on one of the pair of lifting brackets about a hinge axis, and is locked by being latched at the lower end of the other lifting bracket.

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