KR20240013097A - 브리지를 통해 결합된 통합 디바이스들을 포함한 패키지 - Google Patents

브리지를 통해 결합된 통합 디바이스들을 포함한 패키지 Download PDF

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Publication number
KR20240013097A
KR20240013097A KR1020237036533A KR20237036533A KR20240013097A KR 20240013097 A KR20240013097 A KR 20240013097A KR 1020237036533 A KR1020237036533 A KR 1020237036533A KR 20237036533 A KR20237036533 A KR 20237036533A KR 20240013097 A KR20240013097 A KR 20240013097A
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South Korea
Prior art keywords
integrated device
interconnections
bridge
metallization
under bump
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Pending
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KR1020237036533A
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English (en)
Korean (ko)
Inventor
홍 복 위
애니켓 파틸
지지에 왕
마커스 수
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퀄컴 인코포레이티드
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Publication of KR20240013097A publication Critical patent/KR20240013097A/ko
Pending legal-status Critical Current

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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H01L23/3185—
    • H01L23/5385—
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    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
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    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
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    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
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    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
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    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
KR1020237036533A 2021-05-24 2022-04-25 브리지를 통해 결합된 통합 디바이스들을 포함한 패키지 Pending KR20240013097A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/328,666 US20220375838A1 (en) 2021-05-24 2021-05-24 Package comprising integrated devices coupled through a bridge
US17/328,666 2021-05-24
PCT/US2022/026200 WO2022250821A1 (en) 2021-05-24 2022-04-25 Package comprising integrated devices coupled through a bridge

Publications (1)

Publication Number Publication Date
KR20240013097A true KR20240013097A (ko) 2024-01-30

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KR1020237036533A Pending KR20240013097A (ko) 2021-05-24 2022-04-25 브리지를 통해 결합된 통합 디바이스들을 포함한 패키지

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12355000B2 (en) 2020-11-10 2025-07-08 Qualcomm Incorporated Package comprising a substrate and a high-density interconnect integrated device
US12469811B2 (en) 2021-03-26 2025-11-11 Qualcomm Incorporated Package comprising wire bonds coupled to integrated devices
KR102914981B1 (ko) * 2021-06-14 2026-01-21 삼성전자주식회사 반도체 패키지
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Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9595496B2 (en) * 2014-11-07 2017-03-14 Qualcomm Incorporated Integrated device package comprising silicon bridge in an encapsulation layer
US9379090B1 (en) * 2015-02-13 2016-06-28 Qualcomm Incorporated System, apparatus, and method for split die interconnection
US10147682B2 (en) * 2015-11-30 2018-12-04 Taiwan Semiconductor Manufacturing Co., Ltd. Structure for stacked logic performance improvement
US10833052B2 (en) * 2016-10-06 2020-11-10 Micron Technology, Inc. Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods
US11742293B2 (en) * 2017-03-22 2023-08-29 Intel Corporation Multiple die package using an embedded bridge connecting dies
US10651131B2 (en) * 2018-06-29 2020-05-12 Taiwan Semiconductor Manufacturing Company, Ltd. Supporting InFO packages to reduce warpage
US10930633B2 (en) * 2018-06-29 2021-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. Buffer design for package integration
US10756058B2 (en) * 2018-08-29 2020-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and manufacturing method thereof
US11756889B2 (en) * 2019-08-07 2023-09-12 Intel Corporation Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making

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