KR20240009675A - Underfill Dispensing Device - Google Patents

Abstract

The present invention relates to an underfill dispensing device for applying underfill to a bonding area of a semiconductor device bonded to a substrate, comprising: a substrate table 110 on which a substrate having a plurality of semiconductor devices bonded in a plurality of rows and columns is loaded; an underfill head 120 equipped with a dispensing nozzle 121 that sprays underfill from the upper part of the substrate table 110 to the bonding area of each semiconductor device; an underfill head transfer unit 130 that moves the underfill head 120 in the X-axis or Y-axis direction with respect to the substrate 10 and supports sequential application of underfill to a plurality of semiconductor devices; a scan head 140 that is provided to be spaced apart from the underfill head 120 and calculates position coordinates using a camera 143 that scans each semiconductor device bonded to the substrate; It is characterized in that it includes a control unit 160 that transmits the positional coordinates of each semiconductor device (20, 20a, 20b, 20c) calculated by the scan head 140 to the underfill head transfer unit 130.

Description

Underfill dispensing device {Underfill Dispensing Device}

The present invention relates to an underfill dispensing device, and more specifically, to an underfill dispensing device that can shorten the time required for underfill dispensing of a plurality of semiconductor devices bonded to a substrate.

Bonding technologies applied to semiconductor devices include wire bonding, TAB (Tape Automated Bonding), flip chip bonding, and ACF (Anisotropic Conductive Film) bonding technology. there is.

Among these, research on flip chip bonding technology, which mounts semiconductor devices directly on a substrate, has recently been actively conducted.

Flip chip bonding technology is a technology for mounting a semiconductor device by forming a bump that can be used as an external connection terminal on the electrode pad of the semiconductor device and connecting the bump to the substrate. Bumps formed on electrode pads include solder bumps, Au bumps, and stud bumps. The solder bumps and gold bumps are formed using a plating method, and the stud bumps are formed using a wire. It is formed using a bonding method.

After mounting a semiconductor device on a board using the flip chip bonding method, in order to prevent defects due to differences in thermal expansion coefficient between the semiconductor device and the board, an underfill process is performed to fill the flip chip bonded portion with a filler. Proceed.

Figure 1(a) is a schematic diagram schematically showing a general underfill process, and Figure 1(b) shows a state in which a plurality of semiconductor elements 20, 20a, 20b, and 20c are attached to the substrate 10. It is a plan illustration, and Figure 2 is a schematic diagram showing the operation process of a conventional underfill dispensing device.

As shown in (a) of FIG. 1, the underfill process is performed by bonding the bump 30 formed on the lower part of the semiconductor device 20 to the substrate 10 using a flip chip bonding method, and then attaching the bump 30 to one side of the semiconductor device 20. The liquid underfill 40 is injected from the dispensing nozzle 50 located at to fill the flip chip bonded portion between the semiconductor device 20 and the substrate 10.

A plurality of semiconductor devices 20, 20a, 20b, and 20c are bonded to one substrate 10, as shown in (b) of FIG. 1.

Accordingly, in the conventional underfill dispensing device, as shown in FIG. 2, the dispensing nozzle 50 is transferred to the upper part of the semiconductor device by the nozzle transfer unit 70 and is sequentially applied to a plurality of semiconductor devices 20, 20a, 20b, and 20c. The underfill 40 is dispensed.

At this time, the dispensing nozzle 50 must be moved to the exact position of each semiconductor device 20, 20a, 20b, and 20c bonded to the substrate 10 and then the underfill must be applied to prevent defects from occurring. Accordingly, after recognizing the exact position coordinates of each semiconductor element (20, 20a, 20b, 20c), the dispensing nozzle 50 is moved to the corresponding position coordinates.

For this purpose, as shown in FIG. 2, there is a device at the bottom of the nozzle head 55 connecting the dispensing nozzle 50 and the nozzle transfer unit 70 to scan the position coordinates of the semiconductor elements 20, 20a, 20b, and 20c. A camera 60 is provided.

When the camera 60 first scans the position coordinates of the corresponding semiconductor elements 20, 20a, 20b, and 20c to perform dispensing, the nozzle transfer unit 70 moves the dispensing nozzle to the position coordinates scanned by the camera 60. Move (50) to dispense the underfill (40).

However, in this conventional underfill dispensing device, the scanning and position coordinate calculation time of the camera 60 and the dispensing time of the dispensing nozzle 50 are almost the same, and the scanning process and dispensing process are repeated alternately. , there was a disadvantage that it took a considerable amount of time to fill all of the plurality of semiconductor devices (20, 20a, 20b, and 20c) bonded to the substrate 10 with underfill.

That is, as shown in FIG. 2, when there are four semiconductor devices 20, 20a, 20b, and 20c on the substrate 10, the camera 60 scans the first semiconductor device 20 and then the dispensing nozzle. (50) dispenses the underfill to the first semiconductor device 20, and the nozzle transfer unit 70 transfers the nozzle head 55 to the second semiconductor device 20a, and then the camera 60 dispenses the underfill to the second semiconductor device 20a. After scanning the device 20a, the dispensing nozzle 50 repeats the process of dispensing underfill to the second semiconductor device 20a four times.

Accordingly, since the efficiency of performing the underfill process per hour of one underfill dispensing device is low, the factory had to increase the number of underfill devices in order to meet the processing volume per unit time.

Publication Patent No. 10-2009-0026848 “Underfill device using a mold and underfill method using the same”

The purpose of the present invention is to solve the above-described problem and to provide an underfill dispensing device that can simultaneously perform a position scanning process of a semiconductor device bonded to a substrate and an underfill dispensing process.

Another object of the present invention is to provide an underfill dispensing device that can increase process efficiency by shortening the time required for the underfill process for a plurality of semiconductor devices bonded to a substrate.

The above objects and various advantages of the present invention will become more apparent to those skilled in the art from preferred embodiments of the present invention.

The object of the present invention can be achieved by an underfill dispensing device that applies underfill to a bonding area of a semiconductor device bonded to a substrate. The underfill dispensing device of the present invention includes a substrate table 110 on which a substrate in which a plurality of semiconductor devices are bonded in a plurality of rows and columns is placed; an underfill head 120 equipped with a dispensing nozzle 121 that sprays underfill from the upper part of the substrate table 110 to the bonding area of each semiconductor device; an underfill head transfer unit 130 that moves the underfill head 120 in the X-axis or Y-axis direction with respect to the substrate 10 and supports sequential application of underfill to a plurality of semiconductor devices; a scan head 140 that is provided to be spaced apart from the underfill head 120 and calculates position coordinates using a camera 143 that scans each semiconductor device bonded to the substrate; It is characterized in that it includes a control unit 160 that transmits the positional coordinates of each semiconductor device (20, 20a, 20b, 20c) calculated by the scan head 140 to the underfill head transfer unit 130.

According to one embodiment, the scan head 140 is coupled to the underfill head transfer unit 130 to be spaced apart from the underfill head 120, and the underfill head transfer unit 130 transfers the scan head 140 to the underfill head 120. It is preferable to transfer the head 120 before the spacing of one or more semiconductor devices.

According to one embodiment, it further includes a scan head transfer unit 150 that transfers the scan head 140 in the X-axis or Y-axis with respect to the substrate 10, and the scan head transfer unit 150 is the underfill head. The scan head 140 can be transported independently from the transmitter 130.

According to one embodiment, the scan head 140 divides the entire semiconductor elements 20, 20a, 20b, and 20c bonded to the substrate 10 into a plurality of regions, and a plurality of semiconductor devices bonded to each divided region. Position coordinates can be obtained by scanning the semiconductor devices (20, 20a, 20b, and 20c) together.

According to one embodiment, the scan head 140 includes all semiconductor devices 20, 20a, 20b bonded to the substrate 10 before the underfill head 120 is moved by the underfill head transfer unit 130. 20c) can be simultaneously scanned to obtain the position coordinates of all semiconductor devices (20, 20a, 20b, 20c).

In the underfill dispensing device according to the present invention, a camera that acquires the positional coordinates of a semiconductor device bonded to a substrate is transported independently of the spray nozzle, and the underfill spray process and the camera scan process can be performed simultaneously.

Accordingly, there is an advantage that the time required for dispensing the entire underfill for a plurality of semiconductor devices bonded to the substrate can be significantly reduced compared to the conventional method in which the underfill spraying process and the camera scanning process are alternately performed.

1 is a schematic diagram schematically showing the underfill process;
Figure 2 is an example diagram schematically showing the operation process of the underfill dispensing device of the conventional underfill device;
3 is a schematic diagram schematically showing the concept of an underfill dispensing device according to the present invention;
Figure 4 is a perspective view showing the configuration of an underfill dispensing device according to an embodiment of the present invention;
Figures 5 and 6 are exemplary diagrams showing an underfill application path and a semiconductor device scan path by the underfill dispensing device according to the present invention.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. This example is provided to more completely explain the present invention to those with average knowledge in the art. Therefore, the shapes of elements in the drawings may be exaggerated to emphasize a clearer description. It should be noted that identical members in each drawing may be indicated by the same reference numerals. Detailed descriptions of well-known functions and configurations that are judged to unnecessarily obscure the gist of the present invention are omitted.

Figure 3 is a schematic diagram schematically showing the concept of the underfill dispensing device 100 according to the present invention.

The underfill dispensing device 100 according to the present invention includes an underfill head ( 120), an underfill head transfer unit 130 that transfers the underfill head 120, and a camera 143 that calculates position coordinates by scanning the semiconductor elements 20, 20a, 20b, and 20c bonded to the substrate 10. A scan head 140 equipped with a scan head 140, a scan head transfer unit 150 that transports the scan head 140, and each position coordinate of the semiconductor elements 20, 20a, 20b, and 20c calculated from the scan head 140. It includes a control unit 160 that transmits data to the underfill head transfer unit 130.

In the underfill dispensing device 100 according to the present invention, the dispensing nozzle 121 and the camera 143 are independently provided and transported independently. That is, the dispensing nozzle 121 is provided on the underfill head 120 and is transferred by the underfill head transfer unit 130, and the camera 143 is provided on the scan head 140 and is freely transferred by the scan head transfer unit 150. is transported.

As shown in FIG. 3, the scan head 140 moves independently regardless of the current position of the underfill head 120 and scans a plurality of semiconductor elements 20, 20a, 20b, and 20c to which the underfill 40 is to be applied. First, it is scanned and the scanned position coordinates are transmitted to the control unit 160.

In addition, the underfill head transfer unit 130 sequentially transfers the underfill head 120 to the position coordinates of each semiconductor device 20, 20a, 20b, and 20c received while the scan head 140 scans the position coordinates, The dispensing nozzle 121 accurately fills the underfill 40 with each semiconductor element 20, 20a, 20b, and 20c.

In this way, since the scanning process of the scan head 140 and the dispensing process of the dispensing nozzle 121 are performed simultaneously, there is an advantage that the time required to underfill the entire substrate 10 can be significantly reduced.

Here, a plurality of semiconductor devices 20, 20a, 20b, and 20c bonded to the substrate 10 are arranged to be spaced apart from each other at regular intervals. As shown in FIG. 3, the scan head transfer unit 150 is preferably moved at least one step ahead of the scan head 140 so as not to interfere with the underfill spraying process of the dispensing nozzle 121.

That is, the underfill head 120 is transported in a straight line by the underfill head transfer unit 130, and the first semiconductor device 20, the second semiconductor device 20a, the third semiconductor device 20b, and the fourth semiconductor device ( 20c) When sequentially spraying the underfill 40, the scan head transfer unit 150 moves the next-highest priority semiconductor device 20a or the next-highest priority semiconductor device adjacent to the semiconductor device 20 where the underfill head 120 is currently located. (20b) It is desirable to transport the scan head 140 so that the scan head 140 performs the scanning operation at a more distant location.

Figure 4 is a perspective view showing an example of the underfill dispensing device 100 of the present invention. As shown, the underfill dispensing device 100 according to an example of the present invention includes a substrate table 110 on which the substrate 10 is mounted, and is movably provided on the upper part of the substrate table 110 to dispense the substrate 10. An underfill head 120 coupled with a dispensing nozzle 121 that applies underfill 40 to the bonded semiconductor elements 20, 20a, 20b, and 20c, and moving the underfill head 120 in the X and Y axes. It includes an underfill head transfer unit 130, a scan head 140 provided to be spaced apart from the underfill head 120, and a scan head transfer unit 150 that transfers the scan head 140 to the X-axis and Y-axis.

A substrate pick-up robot (not shown) loads the substrate 10 on the substrate table 110, and unloads the substrate 10 when underfill dispensing is completed.

The underfill head 120 is provided with a dispensing nozzle 121 and a dispenser 123 that controls spraying of underfill through the dispensing nozzle 121. The dispensing nozzle 121 sprays the underfill 40 by the dispenser 123 and fills the space between the semiconductor elements 20, 20a, 20b, 20c and the substrate 10 with the underfill 40 by capillary force. .

The underfill head transfer unit 130 has an X-axis that supports the transfer of the underfill head 120 in the It includes a transmission unit 131 and a Y-axis transfer unit 133 that transfers the X-axis transfer unit 131 in the Y-axis direction. The underfill head transfer unit 130 transfers the underfill head 120 to the position coordinates of the semiconductor devices 20, 20a, 20b, and 20c received through the control unit 160.

The scan head 140 includes a camera 143 that photographs each corner (21, 23, see FIG. 1(b)) of the semiconductor elements 20, 20a, 20b, and 20c bonded on the substrate 10, and a camera It includes a coordinate calculation unit 141 that calculates the position coordinates of the semiconductor devices 20, 20a, 20b, and 20c based on the image captured at 143.

The scan head transfer unit 150 includes a scan head X-axis transfer unit 151 that transfers the scan head 140 in the ) includes. In some cases, the scan head transfer unit 150 may further include a scan head elevation unit (not shown) that adjusts the height between the scan head 140 and the substrate 10.

As shown in (b) of FIG. 1, reference coordinates 11 are displayed on the corner area of the substrate 10. The coordinate calculation unit 141 uses images of the corners 21 and 23 captured by the camera 143, and the scan head ) Based on the

Figures 5 and 6 are illustrations showing various ways in which the scanning process and the dispensing process of the underfill dispensing device 100 of the present invention are performed simultaneously.

The paths (T1, T2, T3, T4) indicated by dotted lines in the drawing show the semiconductor devices (20, 20a, 20b, 20c) whose positional coordinates have been calculated on the substrate 10 by the scan head 140, and are hatched. The semiconductor devices 20 and 20a indicated by represent semiconductor devices on which underfills S1 and S2 are applied among the semiconductor devices bonded to the substrate 10.

As shown in (a) of FIG. 5, a plurality of semiconductor devices are arranged in a 5*4 shape on the substrate 10. The dispensing nozzle 121 moves sequentially in the 40) is sprayed, moves in the Y-axis direction, and then moves again in the

At this time, the scan head 140 moves two steps ahead of the dispensing nozzle 121 by the scan head transfer unit 150 and sequentially passes through a plurality of semiconductor devices along the same path as the dispensing nozzle 121, and each semiconductor device The position coordinates are obtained and transmitted to the control unit 160.

That is, when the scan head 140 moves to scan the third semiconductor device 20b after scanning the first semiconductor device 20 and the second semiconductor device 20a, the underfill head 120 moves to scan the first semiconductor device 20a. It moves to the position coordinates of the device 20 and sprays the underfill 40 to the first semiconductor device 20. In this way, the scan head 140 and the underfill head 120 simultaneously perform the scanning process and the underfill filling process with a difference of 2 steps.

In this case, compared to the dispensing method of the conventional underfill dispensing device of FIG. 2, the scanning process and the underfill dispensing process proceed simultaneously with the scan head 140 2 steps ahead, so even considering the time to move 2 steps ahead, the entire dispensing The time required can be reduced by 30-40%.

Meanwhile, as shown in (b) of FIG. 5, the scan head 140 groups a plurality of semiconductor devices (20, 20a, 20b, 20c) bonded to the substrate 10 into a certain area and determines their position coordinates. It can be transferred by the scan head transfer unit 150 so that it can be acquired all at once.

That is, by grouping three semiconductor devices based on each column, the position coordinates of all semiconductor devices can be obtained in the order of the first column (T1), the second column (T2), and the third column (T3). In this case, the coordinate calculation unit 141 collects the position coordinates of the grouped semiconductor devices and transmits them to the control unit 160.

The control unit 160 sequentially transmits only the position coordinates of the semiconductor elements to which the underfill head 120 is to be moved in real time among the received position coordinates of the semiconductor elements in the grouping area to the underfill head transfer unit 130.

That is, when the scan head 140 is moved by the scan head transfer unit 150 to obtain the positional coordinates of the three rows of semiconductor elements, the control unit 160 transfers the positional coordinates of the second semiconductor elements 20a in the second row to the underfill head. The dispensing nozzle 121, which is transmitted to the transmitter 130 and moved to the corresponding position coordinates, sprays the underfill 40 to the second semiconductor device 20a.

In this case, compared to the dispensing method of the conventional underfill dispensing device of FIG. 2, the time to acquire the position coordinates of a plurality of semiconductor elements is shorter and the scanning process is completed before the dispensing process, so the total time required can be reduced by nearly 40%. There is an advantage.

Meanwhile, FIG. 6 shows a case where the camera 143 of the scan head 140 captures images of all semiconductor devices bonded to the substrate 10 and calculates location information of all semiconductor devices at once. In this case, when the coordinate calculation unit 141 calculates the position coordinates of all semiconductor devices in batches and transmits them to the control unit 160, the control unit 160 sequentially calculates the position coordinates of the semiconductor devices to which the underfill head 120 is to be moved. It is transmitted to the underfill head transfer unit 130.

In this case, before moving the underfill head 120, the position coordinates of all semiconductor devices are acquired at once through the scan head 140, and the control unit 160 sequentially transmits only the position coordinates of each semiconductor device to the underfill head transfer unit 130. After this, the underfill head 120 is moved.

Additionally, since the dispensing nozzle 121 only needs to spray the underfill 40, the total time required can be reduced by nearly 50% compared to the dispensing method of a conventional underfill dispensing device.

However, in the case of acquiring the position coordinates in the grouping form shown in (b) of FIG. 5 and in the case of acquiring the position coordinates of all semiconductor devices at once shown in FIG. 6, the individual position coordinates shown in (a) of FIG. 5 are obtained. The method and location coordinate acquisition algorithm may vary.

Meanwhile, the scan head transfer unit 150 is provided independently from the underfill head transfer unit 130 and has the advantage of being able to be transferred regardless of the position of the underfill head 120. However, as shown in FIG. 4, since the underfill head transfer unit 130 and the scan head transfer unit 150 are arranged together, the overall structure of the underfill dispensing device 100 may become complicated and bulky.

Accordingly, as indicated by a dotted line in FIG. 4, the underfill head 120 and the scan head 140' can share and use the scan head transfer unit 150.

The scan head 140' can be moved in the same direction as the underfill head 120 in the Y-axis direction, and can be moved independently of the underfill head 120 only in the X-axis direction. At this time, after transfer in the Y-axis direction, the scan head 140' is moved at least one step first, and then the underfill head 120 is moved subsequently.

Accordingly, compared to the case where the underfill head transfer unit 130 is provided independently, the underfill application speed may be reduced, but the overall structure can be simplified, and compared to the dispensing method of the conventional underfill dispensing device of FIG. 2, the overall amount of time required is reduced. The advantage is that the time can be reduced by 20-30%.

As discussed above, in the underfill dispensing device according to the present invention, the camera that acquires the positional coordinates of the semiconductor device bonded to the substrate is transported independently of the spray nozzle, and the underfill spray process and the camera scan process can be performed simultaneously. .

Accordingly, there is an advantage that the time required for dispensing the entire underfill for a plurality of semiconductor devices bonded to the substrate can be significantly reduced compared to the conventional method in which the underfill spraying process and the camera scanning process are alternately performed.

The embodiments of the underfill dispensing device of the present invention described above are merely exemplary, and those skilled in the art will understand that various modifications and other equivalent embodiments are possible therefrom. You will find out. Therefore, it will be understood that the present invention is not limited to the forms mentioned in the detailed description above. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the attached patent claims. In addition, the present invention should be understood to include all modifications, equivalents and substitutes within the spirit and scope of the present invention as defined by the appended claims.

10: substrate 11: reference coordinate
20, 20a, 20b, 20c...: Semiconductor chip 30: Bump
40: Underfill 50: Dispensing nozzle
55: nozzle head 60: camera
70: Nozzle transfer unit 100: Underfill dispensing device
110: substrate table 120: underfill head
121: Dispensing nozzle 123: Dispenser
130: Underfill head transfer unit 131: X-axis transfer unit
133: Y-axis transfer unit 140: Scan head
141: Coordinate calculation unit 143: Camera
150: Scan head transfer unit 151: Scan head X-axis transfer unit
153: Scan head Y-axis transfer unit
160: control unit

Claims (5)

In the underfill dispensing device for applying underfill to the bonding area of a semiconductor device bonded to a substrate,
a substrate table 110 on which a substrate on which a plurality of semiconductor devices are bonded in a plurality of rows and columns is placed;
an underfill head 120 equipped with a dispensing nozzle 121 that sprays underfill from the upper part of the substrate table 110 to the bonding area of each semiconductor device;
an underfill head transfer unit 130 that moves the underfill head 120 in the X-axis or Y-axis direction with respect to the substrate 10 and supports sequential application of underfill to a plurality of semiconductor devices;
a scan head 140 that is provided to be spaced apart from the underfill head 120 and calculates position coordinates using a camera 143 that scans each semiconductor device bonded to the substrate;
An underfill dispensing device comprising a control unit 160 that transmits the positional coordinates of each semiconductor device 20, 20a, 20b, 20c calculated by the scan head 140 to the underfill head transfer unit 130. .
According to paragraph 1,
The scan head 140 is coupled to the underfill head transfer unit 130 to be spaced apart from the underfill head 120,
The underfill dispensing device is characterized in that the underfill head transfer unit 130 transfers the scan head 140 ahead of the underfill head 120 by an interval of one or more semiconductor devices.
According to paragraph 1,
It further includes a scan head transfer unit 150 that transfers the scan head 140 in the X-axis or Y-axis with respect to the substrate 10,
The underfill dispensing device is characterized in that the scan head transfer unit 150 transfers the scan head 140 independently of the underfill head transfer unit 130.
According to paragraph 3,
The scan head 140 divides all of the semiconductor devices 20, 20a, 20b, and 20c bonded to the substrate 10 into a plurality of regions, and divides the plurality of semiconductor devices 20, 20a bonded into each divided region. An underfill dispensing device characterized by obtaining position coordinates by scanning , 20b, 20c) together.
According to paragraph 3,
The scan head 140 simultaneously scans all semiconductor devices 20, 20a, 20b, and 20c bonded to the substrate 10 before the underfill head 120 is moved by the underfill head transfer unit 130. An underfill dispensing device characterized in that it acquires the positional coordinates of all semiconductor devices (20, 20a, 20b, 20c).

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